Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus
An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.
1. An electronic module comprising:
a flexible wiring member;
a wiring circuit board; and
a conductive connection member,
wherein the flexible wiring member comprises:
a first base which is an insulating and flexible base;
a first wiring layer formed on the first base; and
a first insulating layer formed on the first base so that a part of the first wiring layer is arranged between the first base and the first insulating layer,
wherein the wiring circuit board comprises:
a second base;
a second wiring layer formed on the second base; and
a second insulating layer formed on the second base so that a part of the second wiring layer is arranged between the second base and the second insulating layer,
wherein the flexible wiring member includes a plurality of first electrodes formed of the first wiring layer, the wiring circuit board includes a plurality of second electrodes formed of the second wiring layer,
wherein the first base includes a first part and a second part that is more distant from an end of the flexible wiring member than the first part,
wherein the plurality of first electrodes and the plurality of second electrodes are connected to each other via the conductive connection member between the second base and the both of the first part and the second part in a direction perpendicular to the wiring circuit board,
wherein a first distance between the first part and the plurality of second electrodes is less than a second distance between the second part and the plurality of second electrodes,
wherein a first thickness of the conductive connection member between the first part and the plurality of second electrodes is less than a second thickness of the conductive connection member between the second part and the plurality of second electrodes, and
wherein the first distance is less than a thickness of the second insulating layer and the second thickness.
2. The electronic module according to claim 1 , wherein the flexible wiring member has a portion contacting with the second insulating layer.
3. The electronic module according to claim 1 ,
wherein the electronic module further comprises a resin covering an edge part of the flexible wiring member, and
wherein the resin and the conductive connection member are arranged so as to be spaced apart from each other between the flexible wiring member and the wiring circuit board.
4. The electronic module according to claim 1 ,
wherein the electronic module further comprises a resin covering an edge part of the flexible wiring member,
wherein the electronic module further comprises an intermediate member having lower Young's modules than the resin and the conductive connection member, and
wherein, between the first base and the wiring circuit board, the resin and the intermediate member are arranged to be contacted with each other, and the intermediate member and the conductive connection member are arranged to be contacted with each other.
5. The electronic module according to claim 1 , wherein the thickness of the second insulating layer is 20 to 40 μm.
6. The electronic module according to claim 5 , wherein the conductive connection member is an anisotropic conductive film or an anisotropic conductive resin.
7. The electronic module according to claim 1 , wherein the second insulating layer is formed of a solder-resist.
8. The electronic module according to claim 1 , wherein, the conductive connection member comprises plural pieces of solder.
9. The electronic module according to claim 1 , wherein a distance between two first electrodes of the plurality of first electrodes neighboring each other is greater than the thickness of the second insulating layer.
10. The electronic module according to claim 9 , wherein a width of each of the two first electrodes in a direction where the two first electrodes are neighboring is greater than the distance between the two of the plurality of first electrodes.
11. The electronic module according to claim 1 , wherein the second thickness is less than the thickness of the second insulating layer.
12. The electronic module according to claim 1 , wherein the conductive connection member is in contact with the second insulating layer.
13. The electronic module according to claim 1 , wherein the second base includes a silicon substrate.
14. An electronic equipment comprising:
a casing; and
the electronic module according to claim 1 accommodated in the casing.
15. The electronic equipment according to claim 14 further comprising:
an imaging sensor mounted on the wiring circuit board, wherein the wiring circuit board is arranged between the imaging sensor and the flexible wiring member.
16. The electronic equipment according to claim 14 further comprising:
an image processing circuit accommodated in the casing,
wherein the flexible wiring member connects the wiring circuit board and the image processing circuit.
17. The electronic equipment according to claim 14 , further comprising:
a unit accommodated in the casing,
wherein the unit is configured to move the wiring circuit board.
18. The electronic equipment according to claim 14 , wherein the flexible wiring member extends to form a space between the flexible wiring member and the wiring circuit board, a distance between the flexible wiring member and wiring circuit board through the space exceeds the thickness of the second insulating layer.
19. The electronic equipment according to claim 14 , wherein the flexible wiring member has a part that does not overlap the face of the wiring circuit board in a direction perpendicular to the face of the wiring circuit board.
20. An electronic equipment comprising:
the electronic module according to claim 1 ; and
an imaging element mounted on the wiring circuit board,
wherein the imaging element is electrically connected to the wiring circuit board via a metal wire.
21. An electronic equipment comprising:
the electronic module according to claim 1 ;
an imaging element mounted on the wiring circuit board; and
an image stabilizing unit to move the imaging element.
22. A display apparatus comprising:
the electronic module according to claim 1 ; and
a light emitting element on the wiring circuit board.
23. The electronic module according to claim 1 ,
wherein the second insulating layer does not extend between the plurality of the first electrodes.
24. The electronic module according to claim 1 ,
wherein the second insulating layer includes a first portion and a second portion,
wherein an opening is formed between the first portion and the second portion in a first direction, and
the plurality of second electrodes are arranged between the first portion and the second portion in the first direction.
25. The electronic module according to claim 24 , wherein a width of an end part of the flexible wiring member is smaller than a width of the opening in the first direction.
26. The electronic module according to claim 24 ,
wherein the second insulating layer includes a third portion,
wherein the third portion of the second insulating layer is provided between the second base and the flexible wiring member.
27. The electronic module according to claim 26 ,
wherein at least a part of the first insulating layer is located between the first wiring layer and the third portion of the second insulating layer in the direction perpendicular to the wiring circuit board.
28. The electronic module according to claim 27 , wherein the part of the first insulating layer is arranged with an inclination relative to the third portion of the second insulating layer.
29. The electronic module according to claim 26 , wherein a part of the first base overlapping the third portion of the second insulating layer is arranged with an inclination relative to the third portion of the second insulating layer.
30. The electronic module according to claim 26 , wherein a part of the second wiring layer is arranged between the second base and the third portion of the second insulating layer.
31. The electronic module according to claim 26 , wherein the second insulating layer includes a fourth portion,
wherein the opening is formed between the third portion and the fourth portion in a second direction perpendicular to the first direction, and
wherein a first side of the opening formed by one of the third portion and the fourth portion is longer than a second side of the opening formed by one of the first portion and the second portion.
32. The electronic module according to claim 31 , wherein the conductive connection member is surrounded by the second insulating layer, and the conductive connection member does not extend between the fourth portion of the second insulating layer and the flexible wiring member in the direction perpendicular to the wiring circuit board.
33. The electronic module according to claim 31 , wherein the end of the flexible wiring member is opposite to the fourth portion of the second insulating layer in the plan view.
34. The electronic module according to claim 33 , wherein an end of the flexible wiring member is arranged so as to be spaced apart from the fourth portion of the second insulating layer.