Printed circuit board with passthrough signal connections between a radio-frequency system and an antenna module
An assembly is provided that includes a printed circuit board, a transceiver integrated circuit mounted on a first surface of the printed circuit board, and an antenna module having multiple antennas and that is mounted on a second surface of the printed circuit board. The antenna module at least partially overlaps with the transceiver integrated circuit in an overlap region. The antenna module is electrically coupled to the transceiver integrated circuit via direct passthrough signal connections that extend from the first surface to the second surface. The direct passthrough signal connections are located within the overlap region. Each of the direct passthrough signal connections can be implemented using through-board stacked via structures. The antenna module can include multiple layers of signal routing lines for distributing the signals from the direct passthrough signal connections to the various antennas on the antenna module.
1. An assembly comprising:
a printed circuit board having a first outer surface and a second outer surface opposing the first outer surface;
a semiconductor package disposed on the first outer surface of the printed circuit board and occupying a first region on the printed circuit board;
an antenna module disposed on the second outer surface of the printed circuit board and occupying a second region on the printed circuit board, wherein the first and second regions are at least partially overlapping in an overlapping region;
first solder balls disposed between the semiconductor package and the first outer surface of the printed circuit board;
second solder balls disposed between the antenna module and the second outer surface of the printed circuit board; and
underfill material around the first solder balls.
2. The assembly of claim 1 , wherein the printed circuit board comprises stacked via structures that extend from the first outer surface to the second outer surface and that electrically couple the semiconductor package to the antenna module.
3. The assembly of claim 1 , wherein the stacked via structures are located in the overlapping region.
4. The assembly of claim 1 , wherein the printed circuit board comprises ground connections that surround the stacked via structures.
5. The assembly of claim 1 , wherein the semiconductor package comprises a radio-frequency transceiver integrated circuit.
6. The assembly of claim 1 , wherein the antenna module comprises:
a first antenna configured to receive radio-frequency signals via a first signal path on the antenna module; and
a second antenna configured to receive radio-frequency signal via a second signal path on the antenna module.
7. The assembly of claim 1 , wherein the antenna module comprises:
an antenna structure;
a first signal routing line formed in a first routing layer in the antenna module and having a first terminal coupled to the antenna structure at a first location in the first routing layer and a second terminal coupled to a first signal pin at a second location, different than the first location, in the first routing layer; and
a second signal routing line formed in a second routing layer in the antenna module and having a first terminal coupled to the antenna structure at a third location in the second routing layer and a second terminal coupled to a second signal pin at a fourth location, different than the third location, in the second routing layer.
8. The assembly of claim 7 , wherein the antenna module further comprises:
a pair of ground lines routed along the first signal routing line and formed in the first routing layer.
9. Wireless circuitry comprising:
a circuit board;
a radio-frequency transceiver coupled to a first side of the circuit board;
one or more antennas coupled to a second side of the circuit board that is different than the first side, wherein the one or more antennas are configured to receive radio-frequency signals from the radio-frequency transceiver through via structures traversing a height of the circuit board;
a first array of solder balls disposed between the radio-frequency transceiver and the first side of the circuit board;
a second array of solder balls disposed on the second side of the circuit board and coupled to the one or more antennas; and
underfill material around the second array of solder balls.
10. The wireless circuitry of claim 9 , wherein the circuit board comprises ground structures around the via structures, the ground structures traversing the height of the circuit board.
11. The wireless circuitry of claim 9 , further comprising underfill material around the first array of solder balls.
12. The wireless circuitry of claim 9 , wherein the one or more antennas comprise a phased antenna array.
13. The wireless circuitry of claim 9 , wherein:
the one or more antennas are formed as part of an antenna module; and
at least one of the antennas is configured to receive radio-frequency signals via a first set of signal routing paths formed in a first routing layer in the antenna module and via a second set of signal routing paths formed in a second routing layer in the antenna module different than the first routing layer.
14. An apparatus comprising:
a circuit board;
an integrated circuit coupled to a first side of the circuit board; and
an antenna module coupled to a second side of the circuit board opposing the first side, wherein the circuit board comprises vertical signal connections configured to convey radio-frequency signals between the integrated circuit and the antenna module, wherein the antenna module comprises:
an antenna structure; and
a first signal routing path formed within a first layer of the antenna module, wherein the first signal routing path has a first terminal coupled to the antenna structure at a first location in the first layer and has a second terminal coupled to a first signal pin at a second location, different than the first location, in the first layer.
15. The apparatus of claim 14 , wherein the circuit board further comprises vertical ground connections surrounding the signal connections.
16. The apparatus of claim 14 , wherein the antenna module further comprises:
a second signal routing path formed within the first layer, wherein the second signal routing path has a first terminal coupled to the antenna structure at a third location in the first layer and has a second terminal coupled to a second signal pin at a fourth location, different than the third location, in the first layer.
17. The apparatus of claim 16 , wherein the antenna module further comprises:
a third signal routing path formed within a second layer of the antenna module, wherein the third signal routing path has a first terminal coupled to the antenna structure at a fifth location in the second layer and has a second terminal coupled to a third signal pin at a sixth location, different than the fifth location, in the second layer; and
a fourth signal routing path formed within the second layer, wherein the fourth signal routing path has a first terminal coupled to the antenna structure at a seventh location in the second layer and has a second terminal coupled to a fourth signal pin at an eighth location, different than the seventh location, in the second layer.
18. The apparatus of claim 16 , wherein the integrated circuit and the antenna module have at least partially overlapping footprints on the circuit board.