Thermoplastic joining films and methods for joining thermoplastic and thermoset composite materials
A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.
1 . A composite structure comprising:
a thermoset composite component;
a thermoplastic composite component formed of a single thermoplastic material of polyetheretherketon (PEEK) or polyetherketoneketone (PEKK); and
a thermoplastic joining film forming a structural composite joint between the thermoset composite component and the thermoplastic composite component, the thermoplastic joining film comprising a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.
2 . The composite structure of claim 1 wherein the thermoplastic polymer comprises polyetherimide.
3 . The composite structure of claim 1 wherein the polyaryletherketone polymer comprises at least one of polyether ether ketone or polyether ketone ketone.
4 . The composite structure of claim 1 wherein the polyaryletherketone polymer comprises a blend of at least two polyaryletherketones.
5 . The composite structure of claim 1 wherein a ratio of the thermoplastic polymer to the polyaryletherketone polymer is between about 15:85 and about 30:70.
6 . The composite structure of claim 1 comprising a degree of crystallinity from about 1 percent to about 30 percent.
7 . The composite structure of claim 1 comprising a degree of crystallinity from about 2 percent to about 15 percent.
8 . The composite structure of claim 1 comprising a degree of crystallinity from about 3 percent to about 10 percent.
9 . The composite structure of claim 1 , wherein the thermoplastic polymer and the polyaryletherketone polymer have diffused into the thermoset composite component.
10 . The composite structure of claim 1 , wherein the thermoplastic joining film is co-consolidated to a thermoplastic substrate of the thermoplastic composite component.
11 . The composite structure of claim 10 wherein a polyaryletherketone polymer of the thermoplastic joining film and the polyaryletherketone polymer of the thermoplastic substrate are the same.
12 . The composite structure of claim 1 further comprising:
an epoxy film adhesive between the thermoplastic joining film and the thermoset composite component.
13 . The composite structure of claim 12 further comprising:
a second thermoplastic joining film between the epoxy film adhesive and the thermoset composite component.
14 . A method for manufacturing a composite structure comprising:
positioning a thermoplastic composite component with a surface formed of thermoplastic joining film relative to a thermoset composite component such that the thermoplastic joining film is between a thermoplastic substrate of the thermoplastic composite component and the thermoset composite component, wherein the thermoplastic composite component is formed of a single thermoplastic material of polyetheretherketon (PEEK) or polyetherketoneketone (PEKK) and the thermoplastic joining film comprises a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer; and
applying heat lower than a melting temperature of the thermoplastic joining film to the thermoplastic joining film to form a composite joint between the thermoplastic composite component and the thermoset composite component.
15 . The method of claim 14 , wherein applying heat comprises applying heat in a range of about 180 degrees Celsius to about 220 degrees Celsius to the thermoplastic joining film.
16 . The method of claim 14 , wherein the thermoset composite component is an uncured thermoset composite material, curing the thermoset composite material such that curing the thermoset composite material applies the heat lower than the melting temperature of the thermoplastic joining film to the thermoplastic joining film to form the composite joint.
17 . The method of claim 14 further comprising:
applying an epoxy film adhesive between the thermoplastic joining film and the thermoset composite component, wherein applying the heat to the thermoplastic joining film diffuses a second thermoplastic material of the thermoplastic joining film into the epoxy film adhesive and diffuses the epoxy film adhesive into the thermoplastic joining film.
18 . The method of claim 14 further comprising:
co-consolidating the thermoplastic joining film with the thermoplastic substrate to define the surface of the thermoplastic composite component.
19 . The method of claim 18 , wherein the co-consolidating is performed at a temperature of about 330° C. to about 400° C.
20 . The method of claim 18 , wherein the co-consolidating is performed at a temperature of at least 340° C.
21 . The method of claim 18 , wherein the co-consolidating comprises compression molding.
22 . The method of claim 14 further comprising:
extruding the thermoplastic polymer and the polyaryletherketone polymer to yield the thermoplastic joining film.