IP Library › Granted Patent US 12,614,696
Granted Patent B2
US 12,614,696 · App. 18/178,664 · Granted Apr 28, 2026

Ultra high purity conditions for atomic scale processing

Inventors: Gilbert Bruce Rayner, Jr. (Spring Mills, PA); Noel Christopher O'Toole (Aliquippa, PA); Daniel Edward Carlsen (Canonsburg, PA)
Assignee: Kurt J. Lesker Company
H01J37/321C23C16/4408C23C16/45536H01J37/32715H01J2237/002H01J2237/3322
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Quick Facts
Patent No.
US 12,614,696
App. No.
18/178,664
Granted
Apr 28, 2026
Kind
B2
Abstract

An apparatus for atomic scale processing is provided. The apparatus may include a reactor and an inductively coupled plasma source. The reactor may have inner and outer surfaces such that a portion of the inner surfaces define an internal volume of the reactor. The internal volume of the reactor may contain a fixture assembly to support a substrate wherein the partial pressure of each background impurity within the internal volume may be below 10 −6 Torr to reduce the role of said impurities in surface reactions during atomic scale processing.

Claims (52)

1 . An apparatus r atomic scale processing, comprising:

a reactor having inner and outer surfaces;

wherein at least a portion of the inner surfaces define an internal volume of the reactor;

a fixture assembly positioned within the internal volume of the reactor having a surface configured to hold a substrate within the internal volume of the reactor; and

an inductively coupled plasma source;

wherein the inductively coupled plasma source and the reactor are connected at a first connection point; and

wherein a system control software is provided to establish a partial pressure of each background impurity within the internal volume of the reactor below approximately 10-6 Torr to reduce said background impurities role in surface reactions at least during atomic scale processing.

2 . The apparatus of claim 1 , further comprising a mechanical pump with a nominal pumping speed of approximately 5 to 50 Liters/sec.

3 . The apparatus of claim 1 , further comprising:

a process gas source;

wherein the process gas source and the inductively coupled plasma source are connected at a second connection point;

wherein the second connection point comprises a first elastomeric seal and a second elastomeric seal spaced apart from the first elastomeric seal to define a first volume therebetween; and

wherein the second volume is a vacuum, or the second volume is actively purged and/or backfilled with a process gas.

4 . The apparatus of claim 1 , wherein any connection points spatially located between the first connection point and the fixture assembly comprise metallic and/or elastomeric seals;

wherein each elastomeric seal connection point comprises at least two elastomeric seals spaced apart to define a volume therebetween; and

wherein the volume is a vacuum, or the volume is actively purged and/or backfilled with a process gas.

5 . The apparatus of claim 1 , further comprising an exhaust port from the reactor to a pump isolation valve and a foreline from the pump isolation valve to a pump;

wherein a continuous gas flow is maintained in the exhaust port and the foreline when the pump is on, the pump isolation valve is open, and the reactor is in communication with the pump.

6 . The apparatus of claim 5 , further comprising a downstream port attached to the foreline;

wherein the downstream port is configured to provide continuous gas flow to the foreline when the pump is on, the pump isolation valve is closed, and the reactor is not in communication with the pump.

7 . The apparatus of claim 6 , wherein the downstream port is further configured to provide gas flow that rapidly brings the foreline to atmospheric pressure when the pump isolation valve is closed and the pump is turned off.

8 . The apparatus of claim 1 , wherein the reactor comprises a cladding around at least a portion of the reactor.

9 . The apparatus of claim 1 , wherein the reactor comprises at least one independently controlled heat zone.

10 . The apparatus of claim 1 , further comprising at least one gas purification arrangement between the reactor and at least one source of process gas.

11 . An apparatus for supplying precursor gas or vapor to an ultra-high purity background and controlling the partial pressure of said precursor gas or vapor, comprising:

a reactor having inner and outer surfaces;

wherein at least a portion of the inner surfaces define an internal volume of the reactor, and

wherein an ultra-high purity level is established within the internal volume of the reactor;

a fixture assembly positioned within the internal volume of the reactor having a surface configured to hold a substrate within the internal volume of the reactor;

at least one primary precursor gas or vapor delivery arrangement; and

at least one supplemental precursor gas or vapor delivery arrangement,

wherein the at least one primary precursor gas or vapor delivery arrangement comprises a device to sequentially supply the reactor with a precursor gas or vapor, and wherein a device of the at least one supplemental precursor gas or vapor delivery arrangement continuously supplies the reactor with a precursor gas or vapor, and

wherein a system control software is provided to control the at least one primary precursor gas or vapor delivery arrangement and the at least one supplemental precursor gas or vapor delivery arrangement.

12 . The apparatus of claim 11 , wherein the device of the at least one supplemental precursor gas or vapor delivery arrangement comprises:

a compressed gas cylinder or an ampoule in communication the reactor; and

a reservoir and pressure gauge between the compressed gas cylinder or the ampoule and the reactor.

13 . The apparatus of claim 12 , wherein the device of the at least one supplemental precursor gas or vapor delivery arrangement further comprises:

a regulator between the compressed gas cylinder or the ampoule and the reservoir and pressure gauge;

a first orifice between the regulator and the reservoir and pressure gauge; and

a first valve between the first orifice and the reservoir and pressure gauge.

14 . The apparatus of claim 13 , wherein the device of the at least one supplemental precursor gas or vapor delivery arrangement further comprises:

a second orifice between the reservoir and pressure gauge and the reactor; and

a second valve between the second orifice and the reactor;

wherein the second orifice and the second valve control the flow of precursor gas or vapor from the reservoir to the reactor.

15 . The apparatus of claim 13 , further comprising system control software in communication with the pressure gauge and the first valve;

wherein the system control software receives feedback from the pressure gauge and cycles the first valve based on the feedback to control flow into the reservoir.

16 . The apparatus of claim 11 , wherein the device of the at least one supplemental precursor gas or vapor delivery arrangement comprises:

a compressed gas cylinder or an ampoule in communication the reactor;

wherein a regulator, an orifice, and a valve are provided between the compressed gas cylinder or ampoule and the reactor to control the flow of a precursor gas or vapor from the compressed gas cylinder or the ampoule to the reactor.

17 . The apparatus of claim 11 , wherein the device of the at least one supplemental precursor vapor delivery arrangement comprises:

an ampoule in communication with the reactor;

wherein an orifice and a valve are provided between the ampoule and the reactor to control the flow of precursor vapor from the ampoule to the reactor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2023
From: RAYNER, GILBERT BRUCE, JR.; O'TOOLE, NOEL CHRISTOPHER; CARLSEN, DANIEL EDWARD
To: KURT J. LESKER COMPANY
Reel/Frame 062920/0125 →
Continuity (4)
Continuation 17288981
Provisional Application 63035014 · Jun 5, 2020
Provisional Application 62885446 · Aug 12, 2019
Related Publication 20230230802A1 · Jul 20, 2023
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