Low-particle gas enclosure systems and methods
A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
1. A method of processing of a substrate, the method comprising:
depositing organic material from a printhead of an inkjet printer onto a substrate positioned on a substrate support in a gas enclosure that houses a printing system comprising the printhead;
while depositing the organic material:
flowing a gas within the gas enclosure past the printhead and through a first housing located in the gas enclosure, the first housing containing the printhead;
flowing the gas through a second housing located in the gas enclosure, the second housing containing a service bundle operably coupled to the printing system, wherein the substrate support is located outside the first housing; and
filtering particulate matter from the gas after the gas flows through the second housing.
2. The method of claim 1 , wherein filtering the particulate matter comprises flowing the gas to a dead space.
3. The method of claim 1 , further comprising flowing the gas through a gas purification loop external to the gas enclosure.
4. The method of claim 1 , further comprising flowing the gas from a location proximate to a substrate support disposed in the gas enclosure to the first housing.
5. The method of claim 3 , further comprising returning the gas from the gas purification loop to the gas enclosure.
6. The method of claim 5 , wherein the organic material is an OLED material ink.
7. The method of claim 5 , wherein the organic material is a curable material used to form an encapsulation structure.
8. The method of claim 5 , further comprising curing the organic material deposited on the substrate.
9. The method of claim 1 , further comprising floating the substrate while depositing the organic material on the substrate.
10. The method of claim 1 , wherein the organic material is an OLED material ink.
11. The method of claim 1 , wherein the organic material is a curable material used to form an encapsulation structure.
12. A method, comprising:
depositing a material on a substrate disposed on a substrate support in a gas enclosure of an inkjet printer;
while depositing the material, flowing a gas within the gas enclosure and through a first housing located within the gas enclosure and enclosing a printhead assembly of the inkjet printer;
while depositing the material, flowing the gas from the first housing to a second housing located within the gas enclosure and enclosing a service bundle operably coupled to the inkjet printer, wherein the substrate support is located outside the first housing;
while depositing the material, flowing the gas from the second housing to a conduit fluidly connected to a gas circulation and filtration system.
13. The method of claim 12 , further comprising, while depositing the material, flowing the gas through a gas purification loop external to the gas enclosure.
14. The method of claim 12 , wherein depositing the material comprises depositing ink on the substrate using the printhead assembly while floating the substrate on a floatation table.
15. The method of claim 12 , wherein depositing the material comprises moving the printhead assembly with respect to the substrate and printing material from the printhead assembly onto the substrate.
16. The method of claim 14 , wherein the ink is an OLED material ink.
17. The method of claim 14 , wherein the ink is a curable encapsulation material.
18. The method of claim 14 , further comprising curing the ink deposited on the substrate.
19. The method of claim 14 , further comprising floating the substrate while depositing ink on the substrate using the printhead assembly.
20. The method of claim 15 , wherein depositing the material further comprises floating the substrate on a floatation table.