DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
A device includes device parts, a diamond-like based material coating arranged on one or more of the device parts. Additionally, the diamond-like based material coating may include at least one of a diamond-like carbon (DLC) material and/or a diamond-like nanocomposite (DLN) material.
1 . A device comprising:
device parts; and
a diamond-like based material coating arranged on one or more of the device parts, wherein the diamond-like based material coating comprises at least one of a diamond-like carbon (DLC) material and/or a diamond-like nanocomposite (DLN) material.
2 . The device according to claim 1 further comprising a molding compound arranged on and/or around one or more of the device parts.
3 . The device according to claim 2 further wherein the molding compound is further arranged on one or more of the device parts implemented without the diamond-like based material coating coated thereon.
4 . The device according to claim 1 wherein the device parts comprise one or more of a first lead, a second lead, at least one device component, a mount, at least one interconnect, a component attach, and/or at least one connection.
5 . The device according to claim 1 wherein the diamond-like based material coating is arranged on all exposed surfaces of one or more of the device parts.
6 . The device according to claim 2 wherein the diamond-like based material coating is arranged on surfaces of one or more of the device parts that contact the molding compound.
7 . The device according to claim 1 wherein the diamond-like based material coating comprises a film deposited, arranged, configured, and/or implemented on one or more of the device parts.
8 . The device according to claim 1 wherein the diamond-like based material coating comprises at least one precursor material configured to control coating characteristics and coating functionalities.
9 . The device according to claim 1 wherein the diamond-like based material coating comprises a plasma enhanced chemical vapor deposition (PECVD) coating.
10 . The device according to claim 1 wherein the diamond-like based material coating comprises the diamond-like nanocomposite (DLN) coating material that comprises networks of one or more of a-CH and a-SiO.
11 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to enhance high temperature stability of one or more of the device parts.
12 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to lower friction and coating stress between one or more of the device parts and/or between one or more of the device parts and a molding compound.
13 . The device according to claim 1 wherein the diamond-like based material coating comprises elemental doping.
14 . The device according to claim 1 wherein the diamond-like based material coating comprises nitrogen doping.
15 . The device according to claim 1 wherein the diamond-like based material coating comprises a layer on the one or more of the device parts; and wherein the layer has a thickness of 5 μm or less.
16 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to reduce a diffusion of humidity and moisture to one or more of the device parts.
17 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to mitigate degradations and/or failures of one or more of the device parts.
18 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to reduce migration and/or diffusion of ionic impurities.
19 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to reduce migration and/or diffusion of ionic impurities presented in a molding compound.
20 . The device according to claim 1 wherein the diamond-like based material coating is configured and/or formulated to facilitate a conduction of heat.
21 . The device according to claim 1 wherein the diamond-like based material coating is implemented as a single layer on one or more of the device parts or as multiple layers on one or more of the device parts.
22 . The device according to claim 1 wherein the diamond-like based material coating is implemented with a second coating layer on one or more of the device parts.
23 . The device according to claim 22 wherein the diamond-like based material coating and the second coating layer form a bilayer on one or more of the device parts.
24 . The device according to claim 22 wherein the second coating layer comprises a polyimide material.
25 . The device according to claim 22 wherein the second coating layer comprises a composite coating material that comprises a polymer matrix including and/or incorporating ceramic particles.
26 . The device according to claim 4 wherein the at least one device component comprises one or more active devices, passive devices, dies, chips, and/or transistors.
27 . The device according to claim 4 wherein the at least one interconnect comprises one or more wires, wire bonds, and/or leads.
28 . The device according to claim 1 wherein the device comprises a package, a power device package, and/or a power module.
29 . A process of manufacturing a device comprising: providing device parts; and
arranging a diamond-like based material coating on one or more of the device parts, wherein the diamond-like based material coating comprises at least one of a diamond-like carbon (DLC) material and/or a diamond-like nanocomposite (DLN) material.
30 .- 36 . (canceled)
37 . The process of manufacturing a device according to claim 29 further comprising applying the diamond-like based material coating utilizing plasma enhanced chemical vapor deposition (PECVD).
38 .- 56 . (canceled)