MEMS resonator system
A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.
1. A method of fabricating an integrated circuit device, the method comprising:
adhering a lead frame to a tape, the lead frame providing for one or more external electrical contacts and one or more internal electrical contacts, and for electrical interconnection between the one or more external electrical contacts and corresponding ones of the one or more internal electrical contacts;
physically mounting each of a first chip having a microelectromechanical systems (MEMS) resonator, and a control chip, with respect to the tape and the lead frame, wherein physically mounting comprises electrically connecting contacts of the first chip with first contacts of the control chip and electrically connecting second contacts of the control chip with the internal electrical contacts; and
depositing a mold compound to mechanically support the first chip relative to the control chip and in a manner that encases at least one side of the first chip;
wherein the tape is adapted from removal from the lead frame, in a manner that renders the one or more external electrical contacts exposed to the external atmospheric environment; and
wherein the one or more external electrical contacts are to provide an electrical output of the integrated circuit device which is dependent on operation of the MEMS resonator.
2. The method of claim 1 wherein physically mounting comprises adhering a surface of the control chip to the tape, such that the surface is coplanar with the one or more external electrical contacts and such that, following removal of the tape, the surface is also exposed to the external atmospheric environment.
3. The method of claim 1 wherein physically mounting comprises stacking the control chip, the first chip and the tape, atop one another, such that one of the control chip and the first chip is sandwiched in between the tape and the other of the control chip and the first chip.
4. The method of claim 3 wherein stacking and depositing are performed in a manner such that a height of the integrated circuit device, in a direction of the stacking, is no more than three hundred and fifty microns.
5. The method of claim 3 wherein stacking comprises adhering the control chip to the first chip using a thermally conductive epoxy having a coefficient of thermal expansion between 2×10 −6 /° C. and 170×10 −6 /° C.
6. The method of claim 1 wherein:
the control chip has a temperature sensor; and
the method further comprises providing for thermal communication between the temperature sensor and the MEMS resonator, using one or more thermally-conductive materials, such that the MEMS resonator and the temperature sensor experience the same temperature.
7. The method of claim 1 wherein:
the integrated circuit device is a first integrated circuit device;
the method further comprises forming an array of integrated circuit devices, including the first integrated circuit device; and
the method further comprises singulating the first integrated circuit device from the array of integrated circuit devices, prior to removing the tape.
8. The method of claim 7 wherein:
the singulating is performed in a manner such that the first integrated circuit device is sized to match a footprint of a commercially-sold quartz oscillator integrated circuit.
9. The method of claim 8 wherein singulating is performed such that the integrated circuit device is sized to have a cross-sectional area of 1.6 millimeters by 2.0 millimeters.
10. The method of claim 8 wherein singulating is performed such that the integrated circuit device is sized to have a cross-sectional area of no less than 1.0 millimeters by 1.5 millimeters.
11. A method of fabricating an integrated circuit device, the method comprising:
adhering a lead frame to a tape, the lead frame providing for one or more external electrical contacts and one or more internal electrical contacts, and for electrical interconnection between the one or more external electrical contacts and corresponding ones of the one or more internal electrical contacts;
physically mounting each of a first chip having a microelectromechanical systems (MEMS) resonator, and a control chip, with respect to the tape and the lead frame, wherein physically mounting comprises electrically connecting contacts of the first chip with first contacts of the control chip and electrically connecting second contacts of the control chip with the internal electrical contacts; and
depositing a mold compound to mechanically support the first chip relative to the control chip and in a manner that encases at least one side of the first chip;
removing the lead frame, in a manner that renders the one or more external electrical contacts exposed to the external atmospheric environment; and
wherein the one or more external electrical contacts are to provide an electrical output of the integrated circuit device which is dependent on operation of the MEMS resonator;
wherein physically mounting comprises adhering a surface of the control chip to the tape, such that the surface is coplanar with the one or more external electrical contacts, and such that, following removal of the tape, the surface is also exposed to the external atmospheric environment, and stacking the control chip, the first chip and the tape, atop one another, such that one of the control chip and the first chip is sandwiched in between the tape and the other of the control chip and the first chip; and
wherein the integrated circuit device, in a direction of the stacking, is no more than three hundred and fifty microns.
12. An integrated circuit device comprising:
a lead frame adhered to a tape, the lead frame providing for one or more external electrical contacts and one or more internal electrical contacts, and for electrical interconnection between the one or more external electrical contacts and corresponding ones of the one or more internal electrical contacts;
each of a first chip having a microelectromechanical systems (MEMS) resonator, and a control chip, each physically mounted with respect to the tape and the lead frame, wherein contacts of the first chip are electrically connected with first contacts of the control chip and wherein second contacts of the control chip are electrically connected with the internal electrical contacts; and
a mold compound deposited so as to mechanically support the first chip relative to the control chip and in a manner that encases at least one side of the first chip;
wherein the tape is adapted from removal from the lead frame, in a manner that renders the one or more external electrical contacts exposed to the external atmospheric environment; and
wherein the one or more external electrical contacts are to provide an electrical output of the integrated circuit device which is dependent on operation of the MEMS resonator.
13. The integrated circuit device of claim 12 wherein a surface of the control chip is adhered to the tape, such that the surface is coplanar with the one or more external electrical contacts, and such that, following removal of the tape, the surface is also exposed to the external atmospheric environment.
14. The integrated circuit device of claim 12 wherein the control chip, the first chip and the tape, are stacked atop one another, such that one of the control chip and the first chip is sandwiched in between the tape and the other of the control chip and the first chip.
15. The integrated circuit device of claim 14 wherein a height of the integrated circuit device, in a direction of the stacking, is no more than three hundred and fifty microns.
16. The integrated circuit device of claim 14 wherein the control chip is adhered to the first chip by a thermally conductive epoxy having a coefficient of thermal expansion between 2×10 −6 /° C. and 170×10 −6 /° C.
17. The integrated circuit device of claim 12 wherein:
the control chip has a temperature sensor; and
the integrated circuit device further comprises providing for thermal communication between the temperature sensor and the MEMS resonator, using one or more thermally-conductive materials, such that the MEMS resonator and the temperature sensor experience the same temperature.
18. The integrated circuit device of claim 12 wherein:
the integrated circuit device is sized so as to match a footprint of a commercially-sold quartz oscillator integrated circuit.
19. The integrated circuit device of claim 18 wherein is sized to have a cross-sectional area of 1.6 millimeters by 2.0 millimeters.
20. The integrated circuit device of claim 18 wherein the integrated circuit device is sized to have a cross-sectional area of no less than 1.0 millimeters by 1.5 millimeters.