Diamond wafer based electronic vehicle power electronics
A power device electronics system includes a thermal management configuration in which a power electronics chip is attached to a copper substrate and a single crystal diamond substrate attached to the copper substrate. The copper substrate is sandwiched between a first side of the diamond substrate and the power electronics chip.
1 . A power device, comprising:
a first power electronics chip attached to a first copper substrate; and
a first diamond substrate attached to the first copper substrate, wherein the first copper substrate is sandwiched between a first side of the first diamond substrate and the first power electronics chip.
2 . The device of claim 1 , further comprising one or more pressure jets, each pressure jet being configured to direct pressurized coolant toward a second side of the first diamond substrate that is opposite the first side of the first diamond substrate.
3 . The device of claim 2 , wherein the one or more pressure jets include one or more pressure jets configured to deliver a perpendicular impact flow of coolant to the second side of the first diamond substrate.
4 . The device of claim 1 , wherein the first diamond substrate is a single crystal diamond (SCD) substrate.
5 . The device of claim 1 , wherein the first power electronics chip is a gallium nitride chip, a silicon carbide chip, or an insulated gate bipolar transistor silicon chip.
6 . The device of claim 1 , wherein the first power electronics chip includes one or more metal oxide semiconductor field effect transistor (MOSFET) devices.
7 . The device of claim 6 , wherein the one or more metal oxide semiconductor field effect transistor (MOSFET) devices include one or more Silicon Carbide (SiC) MOSFET devices.
8 . The device of claim 7 , wherein the one or more SiC MOSFET devices include three SiC MOSFET devices.
9 . The device of claim 1 wherein a drain of the first power electronics chip is conductively coupled to the first copper substrate.
10 . The device of claim 9 further comprising one or more conductive pillar structures coupled to the first copper substrate and conductively coupled to the drain of the first power electronics chip.
11 . The device of claim 1 wherein the first power electronics chip includes a conductive source pad on a side of the first power electronics chip opposite the side of the first power electronics chip attached to the first copper substrate and conductively coupled to a source connection of the first power electronics chip.
12 . The device of claim 11 further comprising a conductive clip coupled to the conductive source pad of the power electronics device wherein the conductive clip is conductively coupled to the source connection of the first power electronics chip.
13 . The device of claim 12 wherein the conductive clip is conductively coupled and physically attached to the conductive source pad.
14 . The device of claim 1 wherein the first power electronics chip includes a conductive gate pad on a side of the first power electronics chip opposite the side of the first power electronics chip attached to the first copper substrate and conductively coupled to a gate input of the first power electronics chip.
15 . The device of claim 14 further comprising a gate router circuit conductively coupled to the gate pad of the first power electronics chip.
16 . The device of claim 15 wherein the gate router circuit includes gate driver and current sense circuits.
17 . The device of claim 15 wherein the gate router circuit includes a thin-flex printed circuit board.
18 . The device of claim 1 further comprising a second power electronics chip attached to a second copper substrate and a second diamond substrate attached to the second copper substrate, wherein the second copper substrate is sandwiched between a first side of the second diamond substrate, and the power electronics chip wherein the second power electronics chip, second copper substrate, and second diamond substrate are arranged such that the first side of the first diamond substrate and the first side second diamond substrate are facing each other.
19 . The device of claim 18 wherein the second power electronics chip is configured to operate anti-parallel with the first power electronics chip and the first and second power electronics chip form a first half bridge inverter.
20 . The device of claim 19 further comprising a second half bridge inverter device conductively coupled to the first half bridge inverter forming a full H-Bridge inverter, wherein the second half bridge device is configured as set forth in claim 19 .
21 . The device of claim 19 further comprising two additional half bridge inverter devices conductively coupled to the first half bridge inverter forming a three-phase power inverter wherein the two additional half bridge devices are configured as set forth in claim 19 .
22 . The device of claim 21 further comprising at least one rigid conductive bus bar connecting the two additional Half bridge inverter devices and the first half bridge inverter.
23 . A powered vehicle system comprising:
at least one half bridge device having a power electronics chip mounted to a copper substrate and the copper substrate sandwiched between the power electronics chip and a diamond substrate; and
a motor conductively coupled to the at least one half bridge device.
24 . The powered vehicle system of claim 23 further comprising a wheel coupled to an output shaft of the motor wherein the output shaft of motor rotates the wheel.
25 . The powered vehicle system of claim 23 further comprising a propeller coupled to an output shaft of the motor wherein the output shaft of the motor rotates the propeller and propeller is configured to generate thrust in a medium.
26 . The powered vehicle system of claim 23 further comprising a differential coupled to an output shaft of the motor, wherein the differential is configured to deliver rotation from the output shaft of the motor to a differential output shaft.
27 . The powered vehicle system of claim 25 further comprising at least one wheel attached to the differential output shaft wherein the differential output shafts delivers rotation to the wheel.
28 . The powered vehicle system of claim 23 further comprising a gearbox coupled to the output shaft of the motor wherein in the gearbox is configured to convert a portion of rotational velocity the output shaft of the motor into torque.
29 . The powered vehicle system of claim 23 further comprising at least one battery conductively coupled to the at least one half bridge device.
30 . The powered vehicle system of claim 23 further comprising a controller communicatively coupled to the at least one half bridge device.
31 . The powered vehicle system of claim 23 further comprising a cooling block coupled to the at least one half bridge device wherein the coolant block includes at least one pressure jet, each pressure jet being configured to direct pressurized coolant toward a side of the diamond substrate that is opposite the side of the diamond substrate that the copper substrate is attached.
32 . The powered vehicle system of claim 31 wherein the at least one pressure jets include one or more pressure jets configured to deliver a perpendicular impact flow of coolant to the second side of the first diamond substrate.
33 . The powered vehicle of claim 23 wherein the at least one half bridge device includes two half bridge devices operating as a full H-bridge.
34 . The powered vehicle of claim 23 wherein the at least one half bridge device includes three half bridge devices operating as a three phase inverter.