Electronic devices and methods of manufacturing electronic devices
In one example, an electronic device includes a substrate including a substrate first side, a substrate second side, and a conductive structure. An electronic component includes a component first side coupled to the conductive structure at the substrate first side, a component second side, and a component lateral side connecting the component first side to the component second side. A lid structure includes a first lid having a first lid side wall coupled to the substrate and a first lid top coupled to the first lid side wall and an opening over the component second side. The lid structure includes second lid with a second lid top coupled to the first lid top and a lid channel coupled to the opening. A thermal interface material is within the opening and covers at least a portion of the component second side. Other examples and related methods are also disclosed herein.
1 . An electronic device, comprising:
a substrate comprising:
a substrate first side;
a substrate second side opposite to the substrate first side; and
a conductive structure;
a first electronic component comprising:
a component first side coupled to the conductive structure at the substrate first side;
a component second side opposite to the component first side; and
a component lateral side connecting the component first side to the component second side;
a lid structure comprising:
a first lid comprising:
a first lid outer sidewall coupled to the substrate; and
a first lid top coupled to the first lid outer sidewall and comprising an opening over the component second side;
a second lid comprising a second lid top attached to the first lid top; and
a lid channel coupled to the opening and comprising a first channel portion extending inward into a first portion of the first lid top, the first channel portion comprising a first distal end that exits from a first lateral side of the first lid outer sidewall, wherein the second lid top covers the lid channel and covers the opening; and
a thermal interface material within the opening and covering at least a portion of the component second side.
2 . The electronic device of claim 1 , further comprising:
a closing member covering the first distal end of the first channel portion;
wherein:
the closing member comprises a deformable material that expands or contracts in response to fluid force.
3 . The electronic device of claim 1 , wherein:
the lid channel comprises segments that are coupled together between the opening and the first lateral side as a single channel; and
the segments are arranged in different directions with respect to the opening.
4 . The electronic device of claim 1 , wherein:
the second lid comprises a protrusion that extends inward from the second lid top into the opening.
5 . The electronic device of claim 1 , further comprising:
a dam structure coupling the first lid top with the component second side;
wherein:
the thermal interface material is inside the dam structure.
6 . The electronic device of claim 1 , wherein:
the lid channel comprises:
a second channel portion extending inward into a second portion of the first lid top, the second channel portion comprising a second distal end that exits from a second lateral side of the first lid outer sidewall.
7 . The electronic device of claim 6 , wherein:
the first lateral side is opposite to the second lateral side.
8 . The electronic device of claim 6 , wherein:
the first lateral side is adjacent to the second lateral side.
9 . The electronic device of claim 1 , wherein:
the thermal interface material comprises a liquid; and
a portion of the lid channel is devoid of the thermal interface material.
10 . The electronic device of claim 1 , wherein:
the thermal interface material extends into at least a portion of the lid channel.
11 . The electronic device of claim 2 , further comprising:
an attachment material;
wherein:
the closing member is external to the lid channel and is bonded to the first lid outer sidewall with the attachment material.
12 . An electronic device, comprising:
a substrate comprising:
a substrate first side;
a substrate second side opposite to the substrate first side; and
a conductive structure;
a first electronic component comprising:
a component first side coupled to the conductive structure at the substrate first side;
a component second side opposite to the component first side; and
a component lateral side connecting the component first side to the component second side;
a lid structure comprising:
a first lid comprising a first lid top and a first lid outer sidewall, wherein the first lid outer sidewall is coupled to the substrate first side, and wherein the first lid top is coupled to the first lid outer sidewall and comprises an opening;
a second lid comprising a second lid top attached to the first lid top; and
a lid channel in one or more of the first lid or the second lid, wherein the lid channel comprises a first channel portion comprising a first proximate end coupled to the opening and a first distal end that exits at a first lateral side of the lid structure, and wherein the second lid top covers the opening and the lid channel;
a thermal interface material within the opening; and
a first closing member coupled to the first lateral side of the lid structure and covering the first distal end of the first channel portion, wherein the first closing member comprises a deformable material that expands or contracts in response to fluid force.
13 . The electronic device of claim 12 , further comprising:
a dam structure coupled to the first lid top and the first electronic component; and
an attachment material;
wherein:
the second lid top is bonded to the first lid top with the attachment material;
the first lid top is attached to the dam structure;
the first closing member is attached to the first lateral side and is external to the distal end of the first channel portion;
the thermal interface material comprises a liquid;
the dam structure laterally confines the thermal interface material; and
the second lid comprises a protrusion extending inward from the second lid top that is, at least, partially within the opening.
14 . The electronic device of claim 12 , wherein:
the first lid comprises a first lid inner sidewall laterally inset with respect to the first lid outer sidewall and coupled to the substrate first side such that the first lid inner sidewall is laterally separated from the component lateral side and the first lid is devoid of contact with the first electronic component; and
the first lid top is coupled to the first lid inner sidewall.
15 . The electronic device of claim 14 , wherein:
the thermal interface material comprises a liquid; and
the thermal interface material contacts the component lateral side and the first lid inner sidewall.
16 . The electronic device of claim 12 , further comprising:
a second closing member;
wherein:
the lid structure comprises a second lateral side that is different than the first lateral side;
the lid channel comprises:
a second channel portion comprising a second proximate end coupled to the opening and a second distal end that exits at the second lateral side;
the second closing member is coupled to the second lateral side of the lid structure and covers the second distal end of the second channel portion; and
the second closing member comprises the deformable material that expands or contracts in response to fluid force.
17 . The electronic device of claim 12 , wherein the first channel portion comprises:
a first channel segment comprising the first proximate end coupled to the opening and laterally extending in a first direction; and
a second channel segment connected to the first channel segment and comprising the first distal end extending in a second direction that is perpendicular to the first direction.
18 . A method of manufacturing an electronic device, comprising:
providing a substrate comprising:
a substrate first side;
a substrate second side opposite to the substrate first side; and
a conductive structure;
providing a first electronic component comprising:
a component first side coupled to the conductive structure at the substrate first side;
a component second side opposite to the component first side; and
a component lateral side connecting the component first side to the component second side;
providing a first lid comprising a first lid top, a lid channel extending inward into the first lid from the first lid top, and a first lid outer sidewall, wherein the first lid outer sidewall is coupled to the substrate first side, and wherein the first lid top comprises an opening, and wherein the lid channel comprises a first channel portion comprising a first proximate end coupled to the opening and a first distal end that exits at a first lateral side of the first lid outer sidewall, and wherein the component second side is exposed through the opening over the component second side;
providing a second lid comprising a second lid top; coupled to the first lid top;
attaching the second lid top to the first lid top, wherein the second lid top covers the lid channel and the opening;
providing a thermal interface material within the opening; and
providing a first closing member coupled to the first lid outer sidewall and the second lid, wherein the first closing member covers the first distal end of the first channel portion, and wherein the first closing member comprises a deformable material that expands or contracts in response to fluid force.
19 . The method of claim 18 , further comprising:
providing a dam structure between the first lid top and the first electronic component;
wherein:
providing the thermal interface material comprises providing a liquid thermal interface material;
the dam structure laterally confines the thermal interface material; and
providing the second lid comprises locating a protrusion of the second lid, at least, partially within the opening.
20 . The method of claim 18 , wherein:
providing the first lid comprises providing the first channel portion comprising:
a first channel segment comprising the first proximate end coupled to the opening and laterally extending in a first direction; and
a second channel segment connected to the first channel segment and comprising the first distal end extending in a second direction that is perpendicular to the first direction.