IP Library › Granted Patent US 12,341,235
Granted Patent B2
US 12,341,235 · App. 18/258,801 · Granted Jun 24, 2025

Antenna module

Inventors: Se Ho Lee (Cheonan-si, KR); Hyung Ii Baek (Cheonan-si, KR); Kyung Hyun Ryu (Cheonan-si, KR)
Assignee: AMOSENSE CO., LTD
H01Q1/2283H01Q1/48
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,341,235
App. No.
18/258,801
Granted
Jun 24, 2025
Kind
B2
Abstract

An antenna module comprises a plurality of directors provided to be spaced apart from each other on the top surface of a first base layer; a second base layer disposed under the first base layer; a plurality of radiation patterns spaced apart from each other at positions corresponding to the respective directors on the top surface of the second base layer and functioning as antennas; an RF chipset disposed on bottom surface of the second base layer to transmit and receive RF signals; a connection pattern comprising a power feeding via electrode penetrating the second base layer and connecting the RF chipset and the radiation pattern; and a grounding via electrode that penetrates a part of the second base layer, is spaced apart from a side surface of the power feeding via electrode, and surrounds at least a portion of the side surface of the power feeding via electrode.

Claims (22)

1. An antenna module, comprising:

a plurality of directors provided to be spaced apart from each other on the top surface of a first base layer;

a second base layer disposed under the first base layer;

a plurality of radiation patterns spaced apart from each other at positions corresponding to the respective directors on the top surface of the second base layer and functioning as antennas;

an RF chipset disposed on bottom surface of the second base layer to transmit and receive RF signals;

a connection pattern comprising a power feeding via electrode penetrating the second base layer and electrically connecting the RF chipset and the radiation pattern; and

a grounding via electrode that penetrates a part of the second base layer, is spaced apart from a side surface of the power feeding via electrode, and surrounds at least a portion of the side surface of the power feeding via electrode, wherein:

the power feeding via electrode comprises first and second power feeding via electrodes provided at different plane positions of the second substrate layer,

the connection pattern further comprises a redistribution layer electrically connecting the first and second power feeding via electrodes, and

the grounding via electrode is disposed to be spaced apart from the redistribution layer in an upper and lower direction of a location of the redistribution layer.

2. The antenna module of claim 1 , wherein the grounding via electrode is disposed to be spaced apart from the power feeding via electrode at a predetermined interval while being concentric with the power feeding via electrode.

3. The antenna module of claim 1 , wherein the second base layer is implemented by stacking a plurality of low-temperature co-fired ceramic (LTCC) substrates.

4. The antenna module of claim 3 , wherein the grounding via electrode is disposed to be spaced apart from the radiation pattern in a lower direction of a location of the radiation pattern, and is not provided at the uppermost LTCC substrate of the second base layer.

5. The antenna module of claim 3 , wherein the grounding via electrode is disposed to be spaced apart from the RF chipset in an upper direction of a location of the RF chipset, and is not provided at a bottommost LTCC substrate of the second base layer.

6. The antenna module of claim 3 , wherein

the first and second power feeding via electrodes each passing through a plurality of different LTCC substrates among the second base layer.

7. The antenna module of claim 6 , wherein the grounding via electrode is not provided in LTCC substrates in contact with upper and lower portions of a LTCC substrate having the redistribution layer.

8. The antenna module of claim 6 , wherein the grounding via electrode is provided in a region excluding a corresponding portion of the redistribution layer in first and second LTCC substrates in contact with upper and lower portions of the LTCC substrate having the redistribution layer.

9. The antenna module of claim 3 , further comprising a grounding member provided in at least one of LTCC substrates having a grounding via electrode, and electrically connecting the grounding via electrode to a ground.

10. The antenna module of claim 1 , further comprising a grounding member disposed to be spaced apart from the director on the top surface of the first base layer and electrically connected to a ground.

11. The antenna module of claim 1 , further comprising a grounding member disposed to be spaced apart from the radiation pattern on the top surface of the second base layer and electrically connected to a ground.

12. The antenna module of claim 1 , wherein the radiation pattern emits millimeter wave (mmWave) radio waves.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2023
From: LEE, SE HO; BAEK, HYUNG IL; RYU, KYUNG HYUN
To: AMOSENSE CO.,LTD
Reel/Frame 064021/0545 →
Priority Claims (2)
KR 10-2020-0184511 · Dec 28, 2020 · national
KR 10-2021-0174473 · Dec 8, 2021 · national
Continuity (1)
Related Publication 20240047853A1 · Feb 8, 2024
References Cited (10)
US 20190207304A1 · Kim · 2019 [cited by examiner]
US 20200203801A1 · Im · 2020 [cited by examiner]
US 20210257318A1 · Han · 2021 [cited by examiner]
KR 1020090081731A · 2009 [cited by applicant]
KR 1020150108147A · 2015 [cited by applicant]
KR 1020190101352A · 2019 [cited by applicant]
KR 1020190103677A · 2019 [cited by applicant]
KR 1020200076379A · 2020 [cited by applicant]
Hong et al. English Translation of KR20090081731(A) (Year: 2009). [cited by examiner]
International Search Report for PCT/KR2021/018514 by Korean Intellectual Property Office dated Mar. 14, 2022. [cited by applicant]