Radio frequency module
A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.
1. A radio frequency module, comprising:
a radio frequency integrated circuit (RFIC) configured to input or output a base signal and a radio frequency (RF) signal comprising a frequency higher than a frequency of the base signal;
a wiring via extending from the RFIC in an upward direction and configured to provide a transmission path of the RF signal;
a feed line electrically connected to the wiring via and configured to provide the transmission path of the RF signal;
a second ground layer surrounding the feed line;
a first ground layer spaced apart from the second ground layer in an upward direction;
a third ground layer disposed between the second ground layer and the RFIC;
a feed-line insulating layer disposed between the first and the third ground layers;
at least one IC wiring layer disposed between the third ground layer and the RFIC, electrically connected to the RFIC, and comprising at least one portion configured to provide a transmission path of the base signal; and
at least one IC insulating layer disposed between the third ground layer and the RFIC,
wherein a dielectric constant of the at least one IC insulating layer is higher than a dielectric constant of the feed-line insulating layer.
2. The radio frequency module of claim 1 , wherein the at least one IC wiring layer further comprises a power line configured to provide a transfer path of power for the RFIC, and
wherein the at least one portion comprises a base signal line configured to provide the transmission path of the base signal.
3. The radio frequency module of claim 1 , wherein the at least one IC wiring layer further comprises a fourth ground layer electrically connected to the RFIC, and
wherein the at least one portion comprises a base signal line configured to provide the transmission path of the base signal.
4. The radio frequency module of claim 1 , further comprising:
a first patch antenna pattern spaced apart from the first ground layer in an upward direction;
a feed via electrically connected to the feed line and configured to provide a feeding path with respect to the first patch antenna pattern; and
a first antenna insulating layer disposed between the first ground layer and the first patch antenna pattern.
5. The radio frequency module of claim 4 , wherein a dielectric constant of the feed-line insulating layer is lower than a dielectric constant of the first antenna insulating layer.
6. The radio frequency module of claim 4 , further comprising:
a second patch antenna pattern spaced apart from the first patch antenna pattern in an upward direction; and
a second antenna insulating layer disposed between the first and the second patch antenna patterns.
7. The radio frequency module of claim 6 , wherein a dielectric constant of the first antenna insulating layer is higher than a dielectric constant of the feed-line insulating layer, and is higher than a dielectric constant of the second antenna insulating layer.
8. The radio frequency module of claim 7 , further comprising:
an antenna insulating adhesive layer in contact with the first and the second antenna insulating layers between the first and the second antenna insulating layers.
9. The radio frequency module of claim 1 , further comprising:
an insulating adhesive layer in contact with the at least one IC insulating layer and the feed-line insulating layer between the at least one IC insulating layer and the feed-line insulating layer.
10. An electronic device comprising:
a plurality of different edges;
the radio frequency module of claim 1 disposed adjacent to an edge of the plurality of edges;
a communications modem; and
a baseband integrated circuit (IC) configured to generate the base signal and transfer the base signal input to and output from the baseband IC to the radio frequency module.
11. The electronic device of claim 10 , wherein the electronic device is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet personal computer (PC), a laptop PC, a netbook PC, a television, a video game, a smart watch, or an automotive component.
12. A radio frequency module, comprising:
a radio frequency integrated circuit (RFIC) configured to input or output a base signal and a radio frequency (RF) signal comprising a frequency higher than a frequency of the base signal;
a wiring via extending from the RFIC in an upward direction and configured to provide a transmission path of the RF signal;
a feed line electrically connected to the wiring via and configured to provide the transmission path of the RF signal;
a second ground layer surrounding the feed line;
a first ground layer spaced apart from the second ground layer in an upward direction;
a third ground layer disposed between the second ground layer and the RFIC;
a feed-line insulating layer disposed between the first and the third ground layers;
at least one IC wiring layer disposed between the third ground layer and the RFIC, electrically connected to the RFIC, and comprising at least one portion configured to provide a transmission path of the base signal;
at least one IC insulating layer disposed between the third ground layer and the RFIC; and
one or more of a first insulating adhesive layer in contact with a lower surface of the feed-line insulating layer and a second insulating adhesive layer in contact with an upper surface of the feed-line insulating layer, wherein a dielectric constant of the at least one IC insulating layer is higher than a dielectric constant of the feed-line insulating layer.
13. The radio frequency module of claim 12 , wherein the first insulating adhesive layer is disposed in contact with the at least one IC insulating layer and the feed-line insulating layer between the at least one IC insulating layer and the feed-line insulating layer.
14. The radio frequency module of claim 13 , wherein the at least one IC wiring layer further comprises a power line configured to provide a transfer path of power for the RFIC, and
wherein the at least one portion comprises a base signal line configured to provide the transmission path of the base signal.
15. The radio frequency module of claim 13 , wherein the at least one IC wiring layer further comprises a fourth ground layer electrically connected to the RFIC, and
wherein the at least one portion comprises a base signal line configured to provide the transmission path of the base signal.
16. The radio frequency module of claim 12 , further comprising:
a first patch antenna pattern spaced apart from the first ground layer in an upward direction;
a feed via electrically connected to the feed line and configured to provide a feeding path with respect to the first patch antenna pattern; and
a first antenna insulating layer disposed between the first ground layer and the first patch antenna pattern,
wherein the second insulating adhesive layer is disposed in contact with the first antenna insulating layer and the feed-line insulating layer between the first antenna insulating layer and the feed-line insulating layer.
17. The radio frequency module of claim 16 , further comprising:
a second patch antenna pattern spaced apart from the first patch antenna pattern in an upward direction;
a second antenna insulating layer disposed between the first and the second patch antenna patterns; and
an antenna insulating adhesive layer in contact with the first and the second antenna insulating layers between the first and the second antenna insulating layers.
18. The radio frequency module of claim 16 , wherein the second insulating adhesive layer is configured to provide a dispositional space free of solder comprising a melting point lower than a melting point of the feed via between the first antenna insulating layer and the feed-line insulating layer.
19. An electronic device comprising:
a plurality of different edges;
the radio frequency module of claim 12 disposed adjacent to an edge of the plurality of edges;
a communications modem; and
a baseband integrated circuit (IC) configured to generate the base signal and transfer the base signal input to and output from the baseband IC to the radio frequency module.
20. The electronic device of claim 19 , wherein the electronic device is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet personal computer (PC), a laptop PC, a netbook PC, a television, a video game, a smart watch, or an automotive component.