Hexagonal boron nitride powder and method for producing the same
Provided is a hexagonal boron nitride powder capable of obtaining a resin composition excellent in solder heat resistance. The solder heat resistance of the resin composition can be improved by using a hexagonal boron nitride powder having a ratio (S W /S N ) of a BET specific surface area (S W ) measured using water as an adsorbed species to a BET specific surface area (S N ) measured using nitrogen as an adsorbed species of 0.07 or less. In addition, by a method for producing a hexagonal boron nitride powder, including a step of heat-treating a coarse hexagonal boron nitride powder having an amount of eluted boron of 60 ppm or less at 1300° C. or higher and 2200° C. or lower in a nitrogen atmosphere having a dew point temperature of −85° C. or lower, a hexagonal boron nitride powder capable of improving the solder heat resistance of the resin composition can be obtained.
1 . A hexagonal boron nitride powder having a ratio (S W /S N ) of a BET specific surface area (S W ) measured using water as an adsorbed species to a BET specific surface area (S N ) measured using nitrogen as an adsorbed species of 0.07 or less.
2 . The hexagonal boron nitride powder according to claim 1 , wherein an amount of eluted boron is 40 ppm or less, an amount of eluted sodium is 1 ppm or less, and an amount of eluted calcium is 50 ppm or less.
3 . The hexagonal boron nitride powder according to claim 1 , wherein an average particle size is 1 to 150 μm, and the BET specific surface area (S N ) measured using nitrogen as the adsorbed species is 15 m 2 /g or less.
4 . A resin composition comprising the hexagonal boron nitride powder according to claim 1 and a resin.
5 . The resin composition according to claim 4 , wherein the resin composition is for a heat dissipation material.