Probe
A probe includes greater than or equal to 15 mass % and less than or equal to 60 mass % of Pd, greater than or equal to 3 mass % and less than or equal to 79.9 mass % of Cu, and greater than or equal to 0.1 mass % and less than or equal to 75 mass % of at least one of Ni and Pt.
1 . A probe formed of an alloy, the alloy comprising:
greater than or equal to 15 mass % and less than or equal to 60 mass % of Pd;
greater than or equal to 3 mass % and less than or equal to 79.9 mass % of Cu; and
greater than or equal to 0.1 mass % and less than or equal to 75 mass % of at least one of Ni and Pt, wherein when the alloy and a solder undergo heat treatment, the alloy has a solder resistance such that a diffusion layer in which both the solder and the Pd exist is less than or equal to 200 μm.
2 . The probe according to claim 1 , wherein the solder is a Sn—Bi based solder.
3 . The probe according to claim 1 , wherein the heat treatment is conducted at 250° C. for 1 hour.
4 . The probe according to claim 1 , wherein the alloy constitutes at least a tip end of the probe.
5 . The probe according to claim 4 , wherein the tip end of the probe includes a plurality of points around a central axis of the probe.
6 . The probe according to claim 1 , wherein the alloy comprises:
greater than or equal to 20 mass % and less than or equal to 48 mass % of Pd;
greater than or equal to 5 mass % and less than or equal to 74 mass % of Cu; and
greater than or equal to 0.5 mass % and less than or equal to 70 mass % of at least one of Ni and Pt.
7 . The probe according to claim 1 , wherein the alloy does not contain Ag.
8 . The probe according to claim 1 , wherein the alloy does not contain In.
9 . The probe according to claim 1 , wherein the alloy does not contain Ag or In.
10 . The probe according to claim 1 , wherein the alloy contains both Ni and Pt.
11 . The probe according to claim 1 , wherein the probe includes a plunger having a tip end, and wherein the plunger is formed of the alloy.
12 . The probe according to claim 11 , wherein the tip end of the plunger includes a plurality of points.
13 . The probe according to claim 1 , wherein the probe is configured to electrically connect an inspection target object to an inspection board.
14 . The probe according to claim 13 , wherein the inspection target object includes the solder.
15 . A socket for electrically connecting an inspection target object to an inspection board, the socket comprising the probe of claim 1 .