Contact probe for testing head
It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.
1. A contact probe for a testing head of an apparatus for testing electronic devices, comprising:
a body extended along a longitudinal direction between a contact tip and a contact head, wherein the body includes:
at least one multilayer structure having opposing first and second planar surfaces and opposing first and second lateral side surfaces extending between the first and second planar surfaces, the multilayer structure including a superposition of at least one inner layer or core and a plurality of first inner coating layers that are planar and parallel to each other, wherein the core includes lateral edge portions at the first and second lateral side surfaces of the multilayer structure, and each of the first inner coating layers includes lateral edge portions at the first and second lateral side surfaces of the multilayer structure, and
an outer coating layer that completely covers the multilayer structure including the lateral edge portions of the core, wherein:
the outer coating layer is on the first and second planar surfaces of the multilayer structure, the lateral edge portions of the core, and the lateral edge portions of the first inner coating layers, and
the outer coating layer is made of a material having a higher hardness than a material realizing the core, and
wherein the multilayer structure comprises:
the plurality of first inner coating layers and a plurality of second inner coating layers arranged one above the other in an alternated manner starting from the core,
one or more adhesive films arranged between the core and a first one of the first inner coating layers, and
one or more adhesive films arranged between one of the second inner coating layers and a second one of the first inner coating layers,
wherein each of the adhesive films extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core, lateral portions of the first inner coating layers, or lateral edge portions of the second inner coating layers.
2. The contact probe of claim 1 , wherein the lateral edge portions of the first inner coating layers of the multilayer structure are covered by the outer coating layer.
3. The contact probe of claim 1 , wherein at least one of the first inner coating layers comprises a first portion and a second portion arranged at a first side and at a second, opposite side of the core, respectively.
4. The contact probe of claim 1 , wherein the core is made of a first conductive material and the first inner coating layers are made of a second conductive material having values of electrical and thermal conductivity higher than the first conductive material.
5. The contact probe of claim 1 , wherein the core is made of a non-conductive material and the first inner coating layers are made of a conductive material having a high electrical and thermal conductivity.
6. The contact probe of claim 1 , wherein each of the second inner coating layers covers a respective one of the first inner coating layers.
7. The contact probe of claim 1 , wherein the one or more adhesive films arranged between the core and the first one of the first inner coating layers is made of a material adapted to facilitate adhesion of the first one of the first inner coating layers on the core, wherein the adhesive film extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core or the lateral edge portions of the first one of the first inner coating layers.
8. The contact probe of claim 1 , wherein the second inner coating layers are made of a conductive material.
9. The contact probe of claim 1 , wherein the outer coating layer is made of a conductive material being selected among rhodium, platinum, iridium or a metal alloy thereof or a palladium-cobalt alloy, a palladium-nickel alloy or a nickel-phosphorus alloy.
10. A testing head of an apparatus for testing electronic devices, comprising:
a plurality of contact probes, wherein each contact probe includes:
a body extended along a longitudinal direction between a contact tip and a contact head, wherein the body includes:
at least one multilayer structure having opposing first and second planar surfaces and opposing first and second lateral side surfaces extending between the first and second planar surfaces, the multilayer structure including a superposition of at least one inner layer or core and a first inner coating layer that are planar and parallel to each other, the core including lateral edge portions at the first and second lateral side surfaces of the multilayer structure that are not covered by the first inner coating layer,
an outer coating layer that completely covers the first and second planar surfaces of the multilayer structure, the outer coating layer being made of a material having a higher hardness than a material realizing the core, and
a protective layer completely surrounding the multilayer structure and interposed between the multilayer structure and the outer coating laver, of the contact probe, the outer coating layer covering the protective layer.
11. The testing head of claim 10 , wherein the first inner coating layer of the multilayer structure of each contact probe includes edge portions covered by the outer coating layer of the contact probe.
12. The testing head of claim 10 , wherein the first inner coating layer of each contact probe comprises a first portion and a second portion arranged at a first side and at a second, opposite side of the core of the probe, respectively.
13. The testing head of claim 10 , wherein the core of each contact probe is made of a first conductive material and the first inner coating layer is made of a second conductive material having values of electrical and thermal conductivity higher than the first conductive material.
14. The testing head of claim 10 , wherein, for each contact probe, the core is made of a non-conductive material and the first inner coating layer is made of a conductive material having a high electrical and thermal conductivity.
15. The testing head of claim 10 , wherein the multilayer structure of each contact probe further comprises a second inner coating layer that covers the first inner coating layer of the contact probe.
16. The testing head of claim 15 , wherein the second inner coating layer of the contact probes is made of a conductive material.
17. The testing head of claim 10 , wherein, for each contact probe, the multilayer structure further comprises an adhesive film, disposed between the core and the first inner coating layer and made of a material adapted to facilitate the adhesion of the first inner coating layer on the core, wherein the adhesive film extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core or lateral edge portions of first inner coating layer.
18. The testing head of claim 10 , wherein, for each contact probe, the multilayer structure comprises a plurality of first inner coating layers and second inner coating layers arranged one above the other in an alternated manner and in any number starting from the core of the contact probe.
19. The testing head of claim 18 , wherein, in each contact probe, the multilayer structure further comprises one or more adhesive films arranged between the core and a first one of the first inner coating layers, and one or more adhesive films between one of the second inner coating layers and a second one of the first inner coating layers,
wherein each of the adhesive films extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core.
20. A contact probe for a testing head of an apparatus for testing electronic devices, comprising:
a body extended along a longitudinal direction between a contact tip and a contact head, wherein the body includes:
at least one multilayer structure having opposing first and second planar surfaces and opposing first and second lateral side surfaces extending between the first and second planar surfaces, the multilayer structure including a superposition of at least one inner layer or core and a first inner coating layer that are planar and parallel to each other,
an outer coating layer that completely covers the multilayer structure, wherein:
the outer coating layer is made of a material having a higher hardness than a material realizing the core and also covers lateral edge portions of the multilayer structure at the first and second lateral side surfaces,
the lateral edge portions include lateral edge portions of the core and lateral edge portions of the first inner coating layer, and
the outer coating layer is on the first and second planar surfaces of the multilayer structure, the lateral the edge portions of the core, and the lateral edge portions of the first inner coating layer, and
a protective layer completely surrounding the multilayer structure and interposed between the multi layer structure and the outer coating layer of the contact probe, the outer coating layer covering the protective layer.
21. The contact probe of claim 20 , wherein the first inner coating layer comprises a first portion and a second portion arranged at a first side and at a second, opposite side of the core, respectively.
22. The contact probe of claim 20 , wherein the core is made of a first conductive material and the first inner coating layer is made of a second conductive material having values of electrical and thermal conductivity higher than the first conductive material.
23. The contact probe of claim 20 , wherein the core is made of a non-conductive material and the first inner coating layer is made of a conductive material having a high electrical and thermal conductivity.
24. The contact probe of claim 20 , wherein the multilayer structure further comprises a second inner coating layer that covers the first inner coating layer.
25. The contact probe of claim 20 , wherein the multilayer structure further comprises an adhesive film, disposed between the core and the first inner coating layer and made of a material adapted to facilitate the adhesion of the first inner coating layer on the core, wherein the adhesive film extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core or the lateral edge portions of first inner coating layer.
26. The contact probe of claim 25 , wherein the second inner coating layer is made of a conductive material.
27. The contact probe of claim 20 , wherein the multilayer structure comprises a plurality of first inner coating layers and second inner coating layers arranged one above the other in an alternated manner and in any number starting from the core.
28. The contact probe of claim 27 , wherein the multilayer structure further comprises one or more adhesive films arranged between the core and a first one of the first inner coating layers, and one or more adhesive films arranged between a second inner coating layer and a second one of the first inner coating layers,
wherein each of the adhesive films extends between the first and second lateral side surfaces of the multilayer structure and does not cover the lateral edge portions of the core, lateral edge portions of the first inner coating layers, or lateral edge portions of the second inner coating layers.
29. The contact probe of claim 20 , wherein the outer coating layer is made of a conductive material selected among rhodium, platinum, iridium or a metal alloy thereof or a palladium-cobalt alloy, a palladium-nickel alloy or a nickel-phosphorus alloy.