Cooling system
The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
1. A cooling system, comprising:
a first set of fans located on a first side of an air inlet on a case;
a second set of fans located on a second side of an air outlet on the case, wherein the first set of fans and the second set of fans are configured to generate an airflow from the air inlet to the air outlet;
a first heat sink coupled to a component in the case,
wherein the first heat sink is structured to absorb heat from the component and to transfer heat to a second heat sink,
wherein the first heat sink comprises a plurality of heat sinks,
wherein each of the plurality of heat sinks corresponds to one component, and
wherein each of the plurality of heat sinks comprises a cooling fin coupled to the component and a fan; and
wherein the second heat sink is located on an inward-facing side of the second set of fans and is cooled by the airflow.
2. The system of claim 1 , wherein the fan has an air outlet facing a same direction as a high-pressure airflow.
3. The system of claim 1 , wherein the fan is configured to draw air to blow heat on the cooling fin to the second heat sink.
4. The system of claim 1 , wherein a surface of the component has a layer of thermally conductive silicone grease.
5. The system of claim 4 , wherein the cooling fin of the heat sink is located fixedly on the thermally conductive silicone grease for the component.
6. The system of claim 1 , wherein the second heat sink comprises at least one set of cooling fins.
7. The system of claim 1 , wherein the first set of fans are located on an inward-facing side of the air inlet.
8. The system of claim 1 , wherein the second set of fans are located on an inward-facing side of the air outlet.
9. A method for cooling, comprising:
providing a first set of fans located on a first side of an air inlet on a case;
providing a second set of fans located on a second side of an air outlet on the case, wherein the first set of fans and the second set of fans generate an airflow from the air inlet to the air outlet;
providing a first heat sink coupled to a component in the case, wherein the first heat sink is structured to absorb heat from the component and to transfer heat to a second heat sink,
wherein the first heat sink comprises a plurality of heat sinks,
wherein each of the plurality of heat sinks corresponds to one component, and
wherein each of the plurality of heat sinks comprises a cooling fin coupled to the component and a fan; and
wherein the second heat sink is located on an inward-facing side of the second set of fans and is cooled by the airflow.
10. The method of claim 9 , wherein the fan has an air outlet facing a same direction as a high-pressure airflow.
11. The method of claim 9 , wherein the fan draws air to blow heat on the cooling fin to the second heat sink.
12. The method of claim 9 , wherein a surface of the component has a layer of thermally conductive silicone grease.
13. The method of claim 12 , wherein the cooling fin of the heat sink is located fixedly on the thermally conductive silicone grease for the component.