IP Library Granted Patent US 12,657,365
Granted Patent B2
US 12,657,365 · App. 18/303,219 · Granted Jun 16, 2026

Fault diagnostics

Inventors: Sandeep Kumar Goel (Dublin, CA); Ankita Patidar (San Jose, CA)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
G06F30/333G06F30/33G06F30/39G06F30/392
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Quick Facts
Patent No.
US 12,657,365
App. No.
18/303,219
Granted
Jun 16, 2026
Kind
B2
Abstract

Process for determining defects in cells of a circuit is provided. A layout of a circuit is received. The layout comprises a first cell and a second cell separated by a boundary circuit. Bridge pairs for the first cell and the second cell is determined. The bridge pairs comprises a first plurality of boundary nodes of the first cell paired with a second plurality of boundary nodes of the second cell. Bridge pair faults between the bridge pairs are modeled. A test pattern for the bridge pair faults is generated.

Claims (40)

1 . A method comprising:

receiving a layout of a circuit comprising a plurality of cells, the layout comprising placement information of a first cell and a second cell of the circuit;

determining a cell orientation for each of the first cell and the second cell;

determining a base orientation for each of the first cell and the second cell from the cell orientation;

determining, from the base orientation, a bridge pair comprising a first boundary node of the first cell facing a second boundary node of the second cell;

modeling of the bridge pair as another circuit; and

generating a test pattern for the modeled bridge pair.

2 . The method of claim 1 , wherein the test pattern comprises automatic test pattern generation (ATPG) pattern.

3 . The method of claim 1 , wherein generating the test pattern comprises generating an input pattern and an expected output for the input pattern for the bridge pair.

4 . The method of claim 1 , wherein modeling the bridge pair between the bridge pair comprises modelling the bridge pair fault between an internal node to internal node bridge pair.

5 . The method of claim 1 , wherein modeling the bridge pair comprises modelling a bridge pair fault between an internal node to an external node bridge pair.

6 . The method of claim 1 , wherein the second cell abuts the first cell and is separated from the first cell by a boundary circuit.

7 . The method of claim 1 , further comprising determining a fault coverage of the circuit from the generated test pattern.

8 . The method of claim 7 , further comprising inserting, in response to determining that the fault coverage is less than a predetermined level, a filler cell between the first cell and the second cell.

9 . The method of claim 8 , further comprising determining the bridge pair for the circuit with the inserted filler cell.

10 . An apparatus comprising:

a memory storage; and

a processing unit coupled to the memory storage, wherein the processing unit is operative to:

receive a circuit layout comprising placement information of the plurality of cells of the circuit;

identify, from the placement information, a first cell abutting a second cell from the circuit layout, the second cell being separated from the first cell by a boundary circuit;

identify a bridge pair between the first cell and the second cell, the bridge pair comprising a first boundary node of the first cell paired with a second boundary node of the second cell;

model the bridge pair as another circuit comprising a resistive element connected to a predetermined potential; and

generate a test pattern for the modeled bridge pair.

11 . The apparatus of claim 1 , wherein the processing unit is further operative to determine a fault coverage of the circuit layout from the generated pattern.

12 . The apparatus of claim 11 , wherein the processing unit is further operative to insert, in response to determining that the fault coverage is less than a predetermined level, a filler cell between the first cell and the second cell.

13 . The apparatus of claim 12 , wherein the processing unit is further operative to determine the bridge pair for the circuit layout with the inserted filler cell.

14 . The apparatus of claim 10 , wherein the bridge pair comprises an internal node to internal node bridge pairs.

15 . A non-transitory computer-readable medium that stores a set of instructions which when executed perform a method comprising:

receiving a layout of a circuit comprising a plurality of cells, the layout comprising placement information of the plurality of cells of the circuit;

identifying a bridge pair in the circuit from the layout, wherein identifying the bridge pair comprises:

identifying a first cell abutting a second cell from the layout, the second cell being separated from the first cell by a boundary circuit, and

identifying the bridge pair between the first cell and the second cell, the bridge pair comprising a first boundary node of the first cell paired with a second boundary node of the second cell;

determining whether to model the bridge pair as another circuit; and

generating a test pattern for the bridge pair.

16 . The non-transitory computer-readable medium of claim 15 , further comprising:

modeling the bridge pair as the another circuit comprising a resistive element connected to a predetermined potential.

17 . The non-transitory computer-readable medium of claim 15 , further comprising determining a fault coverage of the circuit from the test pattern.

18 . The non-transitory computer-readable medium of claim 17 , further comprising inserting, in response to determining that the fault coverage is less than a predetermined level, a filler cell between the first cell and the second cell.

19 . The non-transitory computer-readable medium of claim 18 , further comprising determining the bridge pair for the circuit with the inserted filler cell.

20 . The non-transitory computer-readable medium of claim 15 , wherein the bridge pair comprises an internal node to internal node bridge pair.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2023
From: GOEL, SANDEEP KUMAR
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063382/0110 →
Continuity (4)
Continuation 17379256 · Jul 19, 2021
Division 16545624 · Aug 20, 2019
Provisional Application 62725759 · Aug 31, 2018
Related Publication 20230385498A1 · Nov 30, 2023
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