Semiconductor device
A technique for enhancing reliability is provided. A semiconductor device includes a main device which operates in a delayed lockstep mode, a sub device which operates in parallel to the main device in a delayed lockstep mode, a delay circuit which delays an output of the main device, a switching circuit which switches the main device to the sub device according to failure information of the main device.
1. A semiconductor device comprising:
a main device which operates in a delayed lockstep mode;
a sub device which operates in parallel to the main device in the delayed lockstep mode;
a first delay circuit which delays an output of the main device; and
a first switching circuit which switches the main device to the sub device according to first failure information of the main device,
wherein the main device includes a first master central processing unit, a first checker central processing unit, and a first comparator which compares an output of the first master central processing unit with an output of the first checker central processing unit to output the first failure information, and
wherein the sub device includes a second master central processing unit, a second checker central processing unit, and a second comparator which compares an output of the second master central processing unit with an output of the second checker central processing unit to output second failure information.
2. The semiconductor device according to claim 1 , further comprising:
a delay circuit which delays the sub device relative to the main device in operation.
3. The semiconductor device according to claim 1 , wherein an output of the first delay circuit is controlled according to the first failure information.
4. The semiconductor device according to claim 1 , further comprising:
an input control circuit which supplies an input signal to the main device and the sub device,
wherein the input control circuit is controlled by the first failure information.
5. The semiconductor device according to claim 1 , further comprising:
a switching circuit which switches the output of the main device and an output of the sub device according to the first failure information.
6. The semiconductor device according to claim 5 , wherein the first delay circuit delays the output of the sub device.
7. The semiconductor device according to claim 2 , further comprising:
a circuit which controls an input to the sub device according to the first failure information.
8. The semiconductor device according to claim 1 , further comprising:
a second delay circuit which delays an output of the sub device; and
a second switching circuit which switches an output of the first delay circuit and an output of the second delay circuit according to the first failure information.
9. The semiconductor device according to claim 8 , wherein the second switching circuit switches the output of the first delay circuit and the output of the second delay circuit according to the first failure information and the second failure information.