Radio frequency module and communication device
A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of the one or more circuit components, and an engraved portion provided on the top surface of the one or more circuit components.
1 . A radio frequency module comprising:
a module substrate having a principal surface;
one or more circuit components disposed on the principal surface;
a resin member placed on the principal surface and covering a side surface of the one or more circuit components;
a metal layer in contact with a top surface of the resin member and top surfaces of the one or more circuit components; and
an engraved portion provided on the top surfaces of the one or more circuit components.
2 . The radio frequency module according to claim 1 ,
wherein the engraved portion is provided only on the top surfaces of the one or more circuit components.
3 . The radio frequency module according to claim 1 ,
wherein the engraved portion is provided on the top surfaces of the one or more circuit components and the top surface of the resin member.
4 . The radio frequency module according to claim 1 ,
wherein the one or more circuit components comprise a plurality of circuit components, and
the engraved portion is provided on top surfaces of all of the plurality of circuit components.
5 . The radio frequency module according to claim 1 ,
wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.
6 . The radio frequency module according to claim 1 ,
wherein the one or more circuit components include a filter having a pass band in a radio frequency band.
7 . The radio frequency module according to claim 1 ,
wherein the one or more circuit components include a power amplifier configured to amplify a transmitting signal.
8 . The radio frequency module according to claim 1 ,
wherein the resin member contains a filler.
9 . The radio frequency module according to claim 1 ,
wherein the top surfaces of the one or more circuit components are flush with the top surface of the resin member.
10 . The radio frequency module according to claim 1 ,
wherein the engraved portion includes a character, a figure, a symbol, or a two-dimensional code.
11 . A communication device comprising:
an RF signal processing circuit configured to process radio frequency signals transmitted and received by an antenna; and
the radio frequency module according to claim 1 , configured to transmit the radio frequency signals between the antenna and the RF signal processing circuit.
12 . The radio frequency module according to claim 2 ,
wherein the one or more circuit components comprise a plurality of circuit components, and
the engraved portion is provided on top surfaces of all of the plurality of circuit components.
13 . The radio frequency module according to claim 3 ,
wherein the one or more circuit components comprise a plurality of circuit components, and
the engraved portion is provided on top surfaces of all of the plurality of circuit components.
14 . The radio frequency module according to claim 2 ,
wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.
15 . The radio frequency module according to claim 3 ,
wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.
16 . The radio frequency module according to claim 4 ,
wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.
17 . The radio frequency module according to claim 2 ,
wherein the one or more circuit components include a filter having a pass band in a radio frequency band.
18 . The radio frequency module according to claim 3 ,
wherein the one or more circuit components include a filter having a pass band in a radio frequency band.
19 . The radio frequency module according to claim 4 ,
wherein the one or more circuit components include a filter having a pass band in a radio frequency band.
20 . The radio frequency module according to claim 5 ,
wherein the one or more circuit components include a filter having a pass band in a radio frequency band.