Photonic semiconductor device and method of manufacture

1. A package comprising:

a silicon waveguide coupled to a grating coupler;

an interconnect structure over the silicon waveguide;

an electronic die over and electrically connected to the interconnect structure;

a support substrate over and bonded to the electronic die;

a micro lens on a top surface of the support substrate;

a polymer layer over the support substrate, wherein the micro lens is embedded in the polymer layer;

a prism over the micro lens and the polymer layer; and

a metal reflector on a sidewall of the prism.

2. The package of claim 1 , wherein the micro lens comprises a polymer.

3. The package of claim 1 , wherein the prism is an arc prism, and wherein the sidewall of the prism is curved.

4. The package of claim 3 , wherein the metal reflector is also curved.

5. The package of claim 1 , further comprising:

a socket attached to a top surface of the polymer layer; and

a fiber holder coupled to the socket.

6. The package of claim 5 , wherein the socket comprises polyethylene terephthalate (PET), high-density polyethylene (PE), polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), or polymethyl methacrylate (PMMA).

7. The package of claim 5 , wherein the fiber holder comprises plastic or epoxy-based material.

8. The package of claim 1 , wherein an angle between the sidewall of the prism and a top surface of the polymer layer is larger than 90° and smaller than 180°.

9. A package comprising:

a waveguide on a first substrate;

a coupler adjacent to and integrated with the waveguide;

an electronic die over the first substrate and the waveguide;

a second substrate over and coupled to the electronic die;

a socket attached to a top surface of the second substrate; and

a fiber holder coupled to the socket, wherein a cavity is disposed between inner sidewalls of the socket and a bottom surface of the fiber holder.

10. The package of claim 9 , further comprising a micro lens disposed within the cavity.

11. The package of claim 10 , wherein the micro lens comprises a polymer.

12. The package of claim 11 , further comprising:

a guide-pin on the top surface of the second substrate, wherein a material of the guide-pin and a material of the micro lens are the same.

13. The package of claim 11 , wherein the cavity is filled with air.

14. The package of claim 9 , wherein the fiber holder comprises a casing that holds a prism.

15. The package of claim 14 , wherein the prism comprises a polymer waveguide, wherein a material of the polymer waveguide comprises siloxane, epoxy, acrylate, or polynorbornene.

16. A method comprising:

forming a photonic layer over a first substrate, the photonic layer comprising a waveguide coupled to a grating coupler;

forming an interconnect structure over the photonic layer;

coupling a semiconductor die to the interconnect structure;

depositing a first dielectric layer over the semiconductor die to encapsulate the semiconductor die;

attaching a second substrate to top surfaces of the semiconductor die and the first dielectric layer; and

forming a micro lens over a top surface of the second substrate.

17. The method of claim 16 , further comprising:

forming a polymer layer over the micro lens, wherein after forming the polymer layer, the micro lens is embedded in the polymer layer.

18. The method of claim 17 , further comprising:

forming a prism on a top surface of the polymer layer, wherein the prism overlaps the micro lens.

19. The method of claim 18 , wherein an angle between a sidewall of the prism and the top surface of the polymer layer is larger than 90° and smaller than 180°.

20. The method of claim 19 , further comprising:

forming a reflector on the sidewall of the prism, wherein the reflector comprises a metal.