Radiation detector manufacturing method, radiation detector, radiation imaging apparatus, and radiation imaging system
A radiation detector manufacturing method is provided. The method includes: preparing a structure including a support base, a flexible base member arranged on the support base and having a principal surface including a pixel region in which a plurality of pixels are arranged, a scintillator arranged so as to cover the pixel region, and a protective layer arranged so as to cover the scintillator; and removing the support base from the flexible base member. The principal surface includes a peripheral region not covered with the protective layer. The method further includes, before the removing, arranging a reinforcing member in contact with the peripheral region, in a position overlapping the peripheral region and not overlapping the scintillator, in orthogonal projection to the principal surface.
1 . A radiation detector manufacturing method, comprising:
preparing a structure including a support base, a flexible base member arranged on the support base and having a principal surface including a pixel region in which a plurality of pixels are arranged, a wiring board connected to an outer edge portion of the principal surface, a scintillator arranged so as to cover the pixel region, and a protective layer arranged so as to cover the scintillator; and
removing the support base from the flexible base member,
wherein the principal surface includes a peripheral region not covered with the protective layer,
the method further comprises, before the removing, arranging a reinforcing member in contact with the peripheral region, in a position overlapping the peripheral region and not overlapping the scintillator, in orthogonal projection to the principal surface,
the reinforcing member is arranged in a region of the peripheral region, which is not covered with the wiring board,
the reinforcing member overlaps both the protective layer and the wiring board in orthogonal projection to the principal surface, and
the reinforcing member is further in contact with the protective layer and the wiring board.
2 . The method according to claim 1 , wherein the protective layer includes an upper surface in a position furthest from the principal surface, and the reinforcing member is arranged nearer to a principal surface side than a virtual surface including the upper surface and parallel to the principal surface.
3 . The method according to claim 1 , wherein the arranging the reinforcing member includes placing the structure in a housing,
the principal surface is arranged so as to face a placement surface of the housing, on which the structure is placed, and
the reinforcing member is arranged between the peripheral region and the placement surface.
4 . The method according to claim 3 , wherein the reinforcing member is in contact with the placement surface.
5 . The method according to claim 3 , wherein the reinforcing member is integrally molded with the housing.
6 . The method according to claim 3 , wherein the reinforcing member is formed by the same material as that of the housing.
7 . The method according to claim 1 , wherein the reinforcing member contains an epoxy resin.
8 . The method according to claim 1 , wherein in the removing, the support base is removed from the flexible base member by using laser emission.
9 . A radiation detector manufacturing method, comprising:
preparing a structure including a support base, a flexible base member arranged on the support base and having a principal surface including a pixel region in which a plurality of pixels are arranged, a scintillator arranged so as to cover the pixel region, a protective layer arranged so as to cover the scintillator, and a wiring board connected to an outer edge portion of the principal surface; and
removing the support base from the flexible base member,
wherein the principal surface includes a peripheral region not covered with the protective layer,
the method further comprises, before the removing, arranging a reinforcing member in a position overlapping the peripheral region, the protective layer, and the wiring board, and not overlapping the scintillator, in orthogonal projection to the principal surface, and
the reinforcing member is in contact with the protective layer and the wiring board, and is not in contact with the peripheral region.
10 . A radiation detector comprising a flexible base member having a principal surface including a pixel region in which a plurality of pixels are arranged, a scintillator arranged so as to cover the pixel region, a protective layer arranged so as to cover the scintillator, and a wiring board connected to an outer edge portion of the principal surface,
wherein the principal surface includes a peripheral region not covered with the protective layer,
a reinforcing member in contact with the peripheral region is further arranged in a position overlapping the peripheral region, the protective layer, and the wiring board, and not overlapping the scintillator, in orthogonal projection to the principal surface,
the reinforcing member is in contact with the protective layer and the wiring board, and is not in contact with the peripheral region,
the protective layer includes an upper surface in a position furthest from the principal surface, and
the reinforcing member is arranged nearer to a principal surface side than a virtual surface including the upper surface and parallel to the principal surface.
11 . A radiation imaging apparatus comprising:
the radiation detector of claim 10 ; and
a signal processor configured to process an output signal from the radiation detector.
12 . A radiation imaging system comprising:
the radiation imaging apparatus of claim 11 ; and
a radiation source configured to emit radiation to the radiation imaging apparatus.