IP Library › Granted Patent US 11,630,221
Granted Patent B2
US 11,630,221 · App. 17/025,621 · Granted Apr 18, 2023

Radiation detector, radiographic imaging device, and manufacturing method

Inventors: Munetaka Kato (Kanagawa, JP); Shinichi Ushikura (Kanagawa, JP); Yoshihiro Okada (Kanagawa, JP); Keiichi Akamatsu (Kanagawa, JP); Haruyasu Nakatsugawa (Kanagawa, JP)
Assignee: FUJIFILM Corporation
G01T1/20188A61B6/00A61B6/4208G01T1/2023G01T1/20181G01T7/00H01L27/14661
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Quick Facts
Patent No.
US 11,630,221
App. No.
17/025,621
Granted
Apr 18, 2023
Kind
B2
Abstract

A radiation detector including: a substrate formed with a plural pixels in pixel region of a flexible base member, the plural pixels accumulates charges generated in response to light converted from radiation; a conversion layer provided at a surface to which the pixel region is provided on the base member, the conversion layer converts the radiation into light; and a reinforcement substrate provided at a surface of the conversion layer that faces a surface of the substrate side, the reinforcement substrate contains a material having a yield point and has a higher rigidity than the base member.

Claims (33)

1. A radiation detector comprising:

a substrate formed with a plurality of pixels in a pixel region of a flexible base member, the plurality of pixels accumulates charges generated in response to light converted from radiation;

a conversion layer provided at a surface to which the pixel region is provided on the base member, the conversion layer converts the radiation into light; and

a reinforcement substrate provided at a surface of the conversion layer that opposes a first surface of the conversion layer to which the substrate is provided, the reinforcement substrate contains a material having a yield point and has a higher rigidity than the base member.

2. The radiation detector of claim 1 , wherein the reinforcement substrate is provided at a region that is wider than a region provided with the conversion layer.

3. The radiation detector of claim 2 , further comprising a reinforcement member at a surface of the substrate that faces a surface to which the plurality of pixels are formed, the reinforcement member having a higher rigidity than the base member.

4. The radiation detector of claim 2 , wherein the reinforcement substrate has a bending elastic modulus of from 1000 MPa to 2500 MPa.

5. The radiation detector of claim 1 , wherein:

the substrate includes a connection region in a region at an outer periphery of a surface to which the plurality of pixels are formed, the connection region being connected with another end of flexible wiring which is connected with a circuit section for reading the charges accumulated in the plurality of pixels; and

the reinforcement substrate is provided in a region covering the conversion layer and at least a portion of the connection region.

6. The radiation detector of claim 5 , further comprising a reinforcement member at a surface of the substrate that faces a surface to which the plurality of pixels are formed, the reinforcement member having a higher rigidity than the base member.

7. The radiation detector of claim 6 , wherein the conversion layer includes columnar crystals of CsI.

8. The radiation detector of claim 3 , wherein the reinforcement substrate has a bending elastic modulus of from 1000 MPa to 2500 MPa.

9. The radiation detector of claim 1 , further comprising a reinforcement member at a surface of the substrate that faces a surface to which the plurality of pixels are formed, the reinforcement member having a higher rigidity than the base member.

10. The radiation detector of claim 4 , wherein the reinforcement substrate has a bending elastic modulus of from 1000 MPa to 2500 MPa.

11. The radiation detector of claim 1 , further comprising a buffer layer provided between the substrate and the conversion layer.

12. The radiation detector of claim 1 , wherein the reinforcement substrate has a bending elastic modulus of from 1000 MPa to 2500 MPa.

13. The radiation detector of claim 1 , wherein the material having a yield point is at least one material out of polycarbonate or polyethylene terephthalate.

14. The radiation detector of claim 1 , wherein a ratio of a coefficient of thermal expansion of the reinforcement substrate with respect to a coefficient of thermal expansion of the conversion layer is from 0.5 to 2.

15. The radiation detector of claim 1 , wherein the reinforcement substrate has a coefficient of thermal expansion of from 30 ppm/K to 80 ppm/K.

16. The radiation detector of claim 1 , wherein the conversion layer includes columnar crystals of CsI.

17. The radiation detector of claim 1 , wherein the plurality of pixels are formed in the pixel region by a direct formation method.

18. A radiographic imaging device comprising:

the radiation detector of claim 1 ;

a control section that outputs a control signal for reading the charges accumulated in the plurality of pixels; and

a circuit section electrically connected to the radiation detector by flexible wiring, circuit section reads out charges from the plurality of pixels in response to the control signal.

19. A manufacturing method for a radiation detector, comprising:

a process of coating an adhesion layer onto a reinforcement substrate having a size according to the size of a radiation detector;

a process of forming a substrate by providing a flexible base member to a support body with a separation layer interposed between the base member and the support body, and providing a plurality of pixels in a pixel region of the base member, the plurality of pixels accumulates charges generated in response to light converted from radiation;

a process of forming a conversion layer that converts the radiation into light at a surface to which the pixel region of the base member is provided;

a process of affixing a reinforcement substrate at a surface of the conversion layer that opposes a first surface of the conversion layer to which the substrate is provided, the reinforcement substrate containing a material having a yield point and having a higher rigidity than the base member; and

a process of separating the substrate provided with the conversion layer and the reinforcement substrate from the support body.

20. The radiation detector manufacturing method of claim 19 , further comprising, prior to the process of affixing the reinforcement substrate, a process of connecting one end of flexible wiring, which is connected to a circuit section that reads out the charges accumulated in the plurality of pixels, to the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2020
From: KATO, MUNETAKA; USHIKURA, SHINICHI; OKADA, YOSHIHIRO; AKAMATSU, KEIICHI; NAKATSUGAWA, HARUYASU
To: FUJIFILM CORPORATION
Reel/Frame 053820/0675 →
Priority Claims (5)
JP JP2018-051690 · Mar 19, 2018 · national
JP JP2018-182730 · Sep 27, 2018 · national
JP JP2018-219696 · Nov 22, 2018 · national
JP JP2019-022148 · Feb 8, 2019 · national
JP JP2019-022149 · Feb 8, 2019 · national
Continuity (2)
Continuation PCTJP2019009428 · Mar 8, 2019
Related Publication 20210003722A1 · Jan 7, 2021
Cited By (2)
US 12,463,149 US 12,546,905