Techniques for conductive particle based material used for at least one of propagation, emission and absorption of electromagnetic radiation
An antenna system and method for fabricating an antenna are provided. The antenna system includes a substrate and an antenna. The antenna includes a conductive particle based material applied onto the substrate. The conductive particle based material includes conductive particles and a binder. When the conductive particle based material is applied to the substrate, the conductive particles are dispersed in the binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.
1. An electronic device comprising:
at least one of a receiver or a transmitter; and
an antenna,
wherein the antenna comprises:
a first element formed of a conductive material, the first element being electrically coupled to the at least one of the receiver or the transmitter, and
a second element formed of a conductive particle based material, the second element being disposed separately from the first element,
wherein the second element enhances at least one of reception or transmission performance of the first element,
wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,
wherein the binder is disposed between at least a part of the conductive particles that are adjacent to, but do not touch, one another,
wherein at least some of the conductive particles of the conductive particle based material that are adjacent to one another are at least one of capacitively or inductively coupled to one another, and
wherein at least a portion of the conductive particles of the conductive particle based material forming the second element are at least one of capacitively or inductively coupled to first element.
2. The electronic device of claim 1 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.
3. The electronic device of claim 1 , wherein a non-conductive material is disposed adjacent to at least a part of one side of the second element.
4. The electronic device of claim 1 , wherein the second element is at least one of flexible or semi-flexible.
5. The electronic device of claim 1 , wherein the second element is coupled to a reference ground.
6. The electronic device of claim 1 , wherein the second element is a transmission line.
7. The electronic device of claim 1 , wherein the second element is an antenna enhancing element.
8. The electronic device of claim 1 , wherein the second element is one of a receiving or radiating antenna element.
9. The electronic device of claim 1 , wherein a radio frequency signal passes between the first element and the second element.
10. The electronic device of claim 1 , wherein the second element is applied directly onto at least a portion of the first element.
11. The electronic device of claim 1 , wherein the second element is spaced apart from the first element.
12. The electronic device of claim 1 ,
wherein at least a portion of the first element is formed in a first plane and at least a portion of the second element is formed in a second plane,
wherein the first plane is parallel to the second plane, and
wherein the at least the portion of the first element in the first plane and the at least the portion of the second element in the second plane at least partially overlap when viewed perpendicular to the first and second planes.
13. The electronic device of claim 12 , wherein a cross sectional area of the at least the portion of the second element in the second plane is a same as, or less than, a cross sectional area of the at least the portion of the first element in the first plane.
14. The electronic device of claim 1 , wherein the conductive particle based material has non-ohmic conduction with direct current (DC).
15. An antenna subassembly comprising:
a first element formed of a conductive material, the first element being electrically coupled to the at least one of a receiver or a transmitter, and
a second element formed of a conductive particle based material, the second element being disposed separately from the first element,
wherein the second element enhances at least one of reception or transmission performance of the first element,
wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,
wherein the binder is disposed between at least a part of the conductive particles that are adjacent to, but do not touch, one another,
wherein at least some of the conductive particles of the conductive particle based material that are adjacent to one another are at least one of capacitively or inductively coupled to one another, and
wherein at least a portion of the conductive particles of the conductive particle based material forming the second element are at least one of capacitively or inductively coupled to first element.
16. The antenna subassembly of claim 15 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.
17. The antenna subassembly of claim 15 , wherein the conductive particle based material has non-ohmic conduction with direct current (DC).
18. The antenna subassembly of claim 15 , wherein a non-conductive material is disposed adjacent to at least a part of one side of the second element.
19. The antenna subassembly of claim 15 , wherein the second element is at least one of flexible or semi-flexible.
20. The antenna subassembly of claim 15 , wherein the second element is coupled to a reference ground.
21. The antenna subassembly of claim 15 , wherein the second element is a transmission line.
22. The antenna subassembly of claim 15 , wherein the second element is an antenna enhancing element.
23. The antenna subassembly of claim 15 , wherein the second element is one of a receiving or radiating antenna element.
24. The antenna subassembly of claim 15 , wherein a radio frequency signal passes between the first element and the second element.
25. The antenna subassembly of claim 15 , wherein the second element is applied directly onto at least a portion of the first element.
26. The antenna subassembly of claim 15 , wherein the second element is spaced apart from the first element.
27. The antenna subassembly of claim 15 ,
wherein at least a portion of the first element is formed in a first plane and at least a portion of the second element is formed in a second plane,
wherein the first plane is parallel to the second plane, and
wherein the at least the portion of the first element in the first plane and the at least the portion of the second element in the second plane at least partially overlap when viewed perpendicular to the first and second planes.
28. The antenna subassembly of claim 27 , wherein a cross sectional area of the at least the portion of the second element in the second plane is a same as, or less than, a cross sectional area of the at least the portion of the first element in the first plane.