Apparatus including a bonding head and a method of using the same
An apparatus can include a bonding head. The bonding head can include a bonding head body, a die chuck body, and lands. The bonding head body can be coupled to the die chuck. The lands can define zones. The lands and zones can be configured so that an outer zone can be under vacuum to hold a die while an inner zone is pressurized to cause the die to bow away from the bonding head. The bowed die has a relatively smoother curvature as compared to a die bent by bowing a die chuck that has pins, lands, or both. When the die contacts a substrate using the novel bonding head, the likelihood of trapping air and creating a void during a bonding operation is significantly reduced.
1 . An apparatus, comprising:
a bonding head comprising;
a bonding head body;
a die chuck body coupled to the bonding head body and having a proximal side and a distal side, wherein the bonding head body is closer to the proximal side than to the distal side;
a first land closer to the distal side than to the proximal side; and
a second land closer to the distal side than to the proximal side, wherein:
the second land is spaced apart from and laterally surrounded by the first land,
a first zone is disposed between the first land and the second land, and
a second zone is laterally surrounded by the second land;
a first pressure actuator configured to provide a first vacuum within the first zone, wherein the first vacuum is sufficient to hold a die; and
a second pressure actuator configured to provide a pressure to the second zone, wherein the pressure is sufficient to bow the die while the die is being held by the first vacuum within the first zone.
2 . The apparatus of claim 1 , wherein the die chuck body is configured to transmit less than 9% of radiation in a range from 100 nm to 1000 nm.
3 . The apparatus of claim 1 , wherein the die chuck body includes a material present in a sufficient amount to dissipate electrical charge.
4 . The apparatus of claim 1 , wherein the apparatus does not have a radiation source configured to emit radiation along the proximal side of the die chuck body, wherein the radiation is in a range from 100 nm to 1000 nm.
5 . The apparatus of claim 1 , wherein the die chuck body is releasably coupled to the bonding head body.
6 . The apparatus of claim 1 , further comprising a holding means for holding the bonding head body and the die chuck body together.
7 . The apparatus of claim 1 , further comprising a third land laterally surrounding the first land, wherein a third zone disposed between the first land and the third land.
8 . The apparatus of claim 7 , further comprising a sensor to sense a state of the third zone.
9 . The apparatus of claim 7 , further comprising a holding means for holding the bonding head body and the die chuck body together, wherein the holding means comprises a third pressure actuator coupled to the third zone, wherein a combination of the first pressure actuator and the third pressure actuator are configured to provide a second vacuum sufficient to hold the die chuck body and the bonding head body together.
10 . The apparatus of claim 1 , wherein the apparatus further comprises a first drive means configured to generate a pressure in a range from 0.5 N/cm 2 to 20 N/cm 2 between the first land of the bonding head and an object while the first land of the bonding head and the object are in contact with each other.
11 . The apparatus of claim 1 , further comprising a mesa disposed between the die chuck body and each of the first land and the second land.
12 . The apparatus of claim 1 , further comprising a pin within the second zone.
13 . The apparatus of claim 12 , wherein the pin, the first land, and the second land have surfaces that lie at substantially a same elevation from the distal side of the die chuck body.
14 . An apparatus, comprising:
a first bonding head comprising;
a first bonding head body;
a first die chuck body coupled to the first bonding head body and having a first proximal side and a first distal side, wherein the first bonding head body is closer to the first proximal side than to the first distal side;
a first land closer to the first distal side than to the first proximal side;
a second land closer to the first distal side than to the first proximal side, wherein:
the second land is spaced apart from and laterally surrounded by the first land,
a first zone is disposed between the first land and the second land, and
a second zone is laterally surrounded by the second land;
a first pressure actuator configured to provide a first vacuum within the first zone, wherein the first vacuum is sufficient to hold a first die;
a second pressure actuator configured to provide a first pressure to the second zone, wherein the first pressure is sufficient to bow the first die while the first die is being held by the first vacuum within the first zone;
a second bonding head comprising:
a second bonding head body;
a second die chuck body coupled to the second bonding head body and having a second proximal side and a second distal side, wherein the second bonding head body is closer to the second proximal side than to the second distal side;
a third land closer to the second distal side than to the second proximal side; and
a fourth land closer to the second distal side than to the second proximal side, wherein:
the fourth land is spaced apart from and laterally surrounded by the third land,
a third zone is disposed between the third land and the fourth land, and
a fourth zone is disposed laterally surrounded by the fourth land;
a third pressure actuator configured to provide a second vacuum within the third zone, wherein the second vacuum is sufficient to hold a second die;
a fourth pressure actuator configured to provide a second pressure to the fourth zone, wherein the second pressure is sufficient to bow the second die while the second die is being held by the second vacuum within the third zone; and
a controller configured such that the first bonding head can bond the first die to a destination substrate and the second bonding head can bond the second die to the destination substrate during a same point in time.