Wearable device
A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.
1. A wearable device, comprising:
a case having a first opening; and
a temperature sensing device disposed inside the case of the wearable device, and the temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which surrounds the sensor chip, wherein the metal shielding structure has a second opening, and the sensor chip faces towards the first opening and the second opening.
2. The wearable device as claimed in claim 1 , wherein the temperature sensing device further comprises:
a second substrate disposed in the case; and
a waterproof structure disposed in the first opening of the case;
wherein the waterproof structure is used to enclose the case.
3. The wearable device as claimed in claim 1 , wherein the sensor chip is electrically connected to the first substrate by at least one wire.
4. The wearable device as claimed in claim 2 , wherein the waterproof structure is an infrared passing structure.
5. The wearable device as claimed in claim 2 , wherein the first substrate is disposed on the second substrate.
6. The wearable device as claimed in claim 1 , wherein the sensor chip is configured to detect a far infrared which has a wavelength ranging from 15 to 1000 μm.
7. The wearable device as claimed in claim 1 , wherein the metal shielding structure is configured to block the noise generated from other sensors and external electronic products, and prevent other far infrared from passing into the case.
8. The wearable device as claimed in claim 1 , wherein the case is a watch case of a smartwatch, the first substrate is a SMD substrate or a CLCC substrate, and the sensor chip is a far infrared sensor chip.
9. The wearable device as claimed in claim 2 , wherein the second substrate is a PCB and the waterproof structure is a waterproof glue or a waterproof layer.
10. A wearable device, comprising:
a case having a first opening;
a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening; and
at least one of a heart sensor, a blood pressure sensor, a blood sugar sensor and a blood oxygen sensor, disposed simultaneously inside the case of the wearable device.
11. A wearable device, comprising:
a case having a first opening;
a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:
a first substrate;
a sensor chip which is disposed on the first substrate; and
a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening; and
an optical sensor disposed inside the case of the wearable device, wherein the optical sensor is disposed outside the metal shielding structure.