Light-emitting device and method for manufacturing the same
A light-emitting device includes a circuit substrate; a plurality of light-emitting elements disposed over the circuit substrate; a plurality of metal patterns disposed between the plurality of light-emitting elements and the circuit substrate respectively; a plurality of connectors disposed between the plurality of light-emitting elements and the plurality of metal patterns respectively; and a plurality of eutectic patterns disposed between the plurality of light-emitting elements and the plurality of connectors respectively, wherein a first spacing exists between a first light-emitting element of the plurality of light-emitting elements and the circuit substrate, a second spacing exists between a second light-emitting element of the plurality of light-emitting elements and the circuit substrate, and a difference between the first spacing and the second spacing is equal to a thickness of the eutectic pattern.
1 . A light-emitting device, comprising:
a circuit substrate;
a plurality of light-emitting elements disposed over the circuit substrate;
a plurality of metal patterns disposed between the plurality of light-emitting elements and the circuit substrate respectively;
a plurality of connectors disposed between the plurality of light-emitting elements and the plurality of metal patterns respectively; and
a plurality of eutectic patterns disposed between the plurality of light-emitting elements and the plurality of connectors respectively,
wherein a first spacing exists between a first light-emitting element of the plurality of light-emitting elements and the circuit substrate, a second spacing exists between a second light-emitting element of the plurality of light-emitting elements and the circuit substrate, and a difference between the first spacing and the second spacing is equal to a thickness of the eutectic pattern.
2 . The light-emitting device of claim 1 , wherein the metal pattern comprises titanium, molybdenum or copper.
3 . The light-emitting device of claim 1 , wherein the connector comprises indium, tin, copper, silver, bismuth or an alloy thereof.
4 . The light-emitting device of claim 1 , wherein the plurality of connectors has different thicknesses.
5 . The light-emitting device of claim 1 , wherein the connector electrically connected to the first light-emitting element has a first thickness, the connector electrically connected to the second light-emitting element has a second thickness, and a difference between the first thickness and the second thickness is equal to the thickness of the eutectic pattern.
6 . The light-emitting device of claim 1 , wherein the plurality of eutectic patterns has substantially the same thicknesses.
7 . The light-emitting device of claim 6 , wherein the thickness of the eutectic pattern ranges from 0.4 μm to 0.7 μm.
8 . The light-emitting device of claim 1 , further comprising a plurality of pads disposed between the plurality of metal patterns and the circuit substrate respectively.
9 . A light-emitting device, comprising:
a circuit substrate;
a plurality of light-emitting elements disposed over the circuit substrate;
a plurality of connectors disposed between the plurality of light-emitting elements and the circuit substrate respectively; and
a plurality of eutectic patterns disposed between the plurality of light-emitting elements and the plurality of connectors respectively,
wherein a first connector of the plurality of connectors is disposed between a first light-emitting element of the plurality of light-emitting elements and the circuit substrate, a second connector of the plurality of connectors is disposed between a second light-emitting element of the plurality of light-emitting elements and the circuit substrate, both the first connector and the second connector extend continuously between the eutectic patterns and the circuit substrate, and a thickness of the first connector is equal to a sum of a thickness of the eutectic pattern and a thickness of the second connector.
10 . The light-emitting device of claim 9 , wherein the eutectic pattern includes a material of an electrode of the light-emitting element and a material of the connector.
11 . The light-emitting device of claim 9 , further comprising a plurality of metal patterns disposed between the plurality of connectors and the circuit substrate respectively.
12 . The light-emitting device of claim 11 , wherein the metal pattern has a thickness ranging from 300 Å to 1000 Å.