IP Library › Granted Patent US 12,513,818
Granted Patent B2
US 12,513,818 · App. 18/348,622 · Granted Dec 30, 2025

Flexible circuit board and electronic device comprising same

Inventors: Youngsun Lee (Suwon-si, KR); Kideok Kim (Suwon-si, KR); Byeongkeol Kim (Suwon-si, KR); Jongbum Lee (Suwon-si, KR); Jongmin Jeon (Suwon-si, KR); Jeongbeom Cho (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K1/0281H05K1/147H05K3/28H05K2201/10378
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Quick Facts
Patent No.
US 12,513,818
App. No.
18/348,622
Granted
Dec 30, 2025
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.

Claims (64)

1 . An electronic device comprising:

a housing;

a main circuit board disposed within the housing; and

at least one flexible circuit board electrically connected to the main circuit board,

wherein the flexible circuit board comprises:

a flexible circuit part, and

a connection part disposed at one end of the flexible circuit part and connected to the main circuit board,

wherein the connection part comprises:

a first layer oriented in a first direction and including one or more first connection holes,

a second layer oriented in a second direction opposite to the first direction and including one or more second connection holes, and

a reinforcing member, disposed between the first and second layers, and connected to a layer of the flexible circuit part in a state of at least partially overlapping one end portion of the flexible circuit part, the layer of the flexible circuit part being disposed in a same layer as the reinforcing member, and

wherein a material of the layer of the flexible circuit part is different from a material of the reinforcing member.

2 . The electronic device of claim 1 , wherein the reinforcing member comprises:

first and second reinforcing insulating films, and

an adhesive layer bonded between the first and second reinforcing insulating films.

3 . The electronic device of claim 2 , wherein the adhesive layer comprises one end portion disposed to overlap the one end portion of the flexible circuit part.

4 . The electronic device of claim 2 , wherein the flexible circuit part comprises:

a first conductive layer disposed to be oriented in the first direction, and

a second conductive layer disposed to be oriented in the second direction and spaced apart from the first conductive layer.

5 . The electronic device of claim 4 ,

wherein the first conductive layer comprises:

a first protective layer applied to a first surface of the first conductive layer oriented in the first direction, and

a first insulating film disposed on a second surface of the first conductive layer oriented in the second direction, and

wherein the second conductive layer comprises:

a second protective layer applied to a first surface of the second conductive layer oriented in the first direction, and

a second insulating film disposed on a second surface of the second conductive layer oriented in the second direction.

6 . The electronic device of claim 5 , further comprising: an air layer between the first and second insulating films.

7 . The electronic device of claim 6 , wherein the adhesive layer directly faces the air layer.

8 . The electronic device of claim 5 , further comprising: a flexible material between the first and second insulating films.

9 . The electronic device of claim 5 ,

wherein the first reinforcing insulating film extends from the first insulating film, and

wherein the second reinforcing insulating film extends from the second insulating film.

10 . The electronic device of claim 1 ,

wherein the reinforcing member comprises one or more third connection holes, and

wherein each of the one or more third connection holes are disposed to be vertically coaxial to a corresponding one of the one or more first connection holes and a corresponding one of the one or more second connection holes.

11 . The electronic device of claim 1 , wherein an interposer is disposed between the connection part and the main circuit board.

12 . The electronic device of claim 11 ,

wherein the interposer comprises one or more fourth connection holes, and

wherein each of the one or more fourth connection holes are disposed to be vertically coaxial to a corresponding one of the one or more first connection holes and a corresponding one of the one or more second connection holes.

13 . The electronic device of claim 1 , wherein each of the one or more first connection holes are disposed to be vertically coaxial to a corresponding one of the one or more second connection holes.

14 . A flexible circuit board comprising:

a flexible circuit part; and

a connection part disposed at one end of the flexible circuit part,

wherein the connection part comprises:

a first layer oriented in a first direction and including one or more first connection holes,

a second layer oriented in a second direction opposite to the first direction and including one or more second connection holes, and

a reinforcing member, disposed between the first and second layers, connected to a layer of the flexible circuit part in a state of at least partially overlapping one end portion of the flexible circuit part, the layer of the flexible circuit part being disposed in a same layer as the reinforcing member, and

wherein a material of the layer of the flexible circuit part is different from a material of the reinforcing member.

15 . The flexible circuit board of claim 14 , wherein the reinforcing member comprises:

first and second reinforcing insulating films, and

an adhesive layer bonded between the first and second reinforcing insulating films.

16 . The flexible circuit board of claim 15 , wherein the adhesive layer comprises one end portion disposed to overlap the one end portion of the flexible circuit part.

17 . The flexible circuit board of claim 15 , wherein the flexible circuit part comprises:

a first conductive layer disposed to be oriented in the first direction, and

a second conductive layer disposed to be oriented in the second direction opposite and spaced apart from the first conductive layer.

18 . The flexible circuit board of claim 17 ,

wherein the first conductive layer comprises:

a first protective layer applied to a first surface of the first conductive layer oriented in the first direction, and

a first insulating film disposed on a second surface of the first conductive layer oriented in the second direction, and

wherein the second conductive layer comprises:

a second protective layer applied to a first surface of the second conductive layer oriented in the first direction, and

a second insulating film disposed on a second surface of the second conductive layer oriented in the second direction.

19 . The flexible circuit board of claim 18 , further comprising: an air layer between the first and second insulating films.

20 . The flexible circuit board of claim 19 , wherein the adhesive layer directly faces the air layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2023
From: LEE, YOUNGSUN; KIM, KIDEOK; KIM, BYEONGKEOL; LEE, JONGBUM; JEON, JONGMIN; CHO, JEONGBEOM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064184/0521 →
Priority Claims (1)
KR 10-2021-0004784 · Jan 13, 2021 · national
Continuity (2)
Continuation PCTKR2021020156 · Dec 29, 2021
Related Publication 20230354511A1 · Nov 2, 2023
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