IP Library Granted Patent US 11,259,407
Granted Patent B2
US 11,259,407 · App. 16/813,897 · Granted Feb 22, 2022

Electrical connecting device and electronic device including the same

Inventors: Jongwan Shim (Gyeonggi-do, KR); Bumhee Bae (Gyeonggi-do, KR); Younho Kim (Gyeonggi-do, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K1/0281H04B1/38H05K1/118H05K7/1407H05K7/1422
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Quick Facts
Patent No.
US 11,259,407
App. No.
16/813,897
Granted
Feb 22, 2022
Kind
B2
Abstract

According to certain embodiments, an electronic device comprises a first electrical structure disposed in an internal space of the electronic device; and a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the first electrical structure, wherein the FPCB further comprises: a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the first electrical structure; a first conductive layer disposed on the first surface of the dielectric substrate; and a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area; wherein the first fastening area comprises a screw through hole for screw fastening, and at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first conductive layer.

Claims (44)

1. An electronic device, comprising:

a conductive portion disposed between a pair of separated non-conductive portions in at least a portion of a side member at least partially exposed to an exterior of the electronic device, wherein the conductive portion is configured to radiate a signal; and

a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the conductive portion,

wherein the FPCB further comprises:

a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the conductive portion;

a first conductive layer disposed on the first surface of the dielectric substrate, and

a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area,

wherein in the first fastening area, the first conductive layer electrically contacts the conductive portion,

wherein the first fastening area comprises a screw through hole for screw fastening,

wherein at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first conductive layer, and

wherein the conductive portion comprises a conductive bushing extended to an internal space of the electronic device, and comprising a screw fastener, and the first fastening area of the FPCB is fastened to the conductive bushing through a screw.

2. The electronic device of claim 1 , further comprising a plating layer stacked on the first conductive layer in the first fastening area.

3. The electronic device of claim 1 , further comprising a reinforcing member stacked on the first conductive layer in the first fastening area.

4. The electronic device of claim 1 , further comprising:

a second conductive layer disposed on the second surface of the dielectric substrate; and

a second protective layer disposed on the second conductive layer, extending in the extension area and terminating in the first fastening area.

5. The electronic device of claim 1 , further comprising: in the first fastening area,

a first additional dielectric layer stacked on the first conductive layer; and

a second conductive layer disposed on the first additional dielectric layer.

6. The electronic device of claim 1 , further comprising a second fastening area extended from the extension area and electrically connected to an electrical structure disposed in the internal space of the electronic device.

7. The electronic device of claim 2 , wherein the plating layer comprises gold.

8. The electronic device of claim 3 , wherein the reinforcing member is made of at least one material of stainless steel (SUS), Al, or Cu.

9. The electronic device of claim 3 , wherein the reinforcing member comprises polymer material.

10. The electronic device of claim 4 , further comprising a reinforcing member stacked on the second conductive layer in the first fastening area.

11. The electronic device of claim 6 , further comprising an electrical connector electrically connected to the first conductive layer and connected to a connector of the electrical structure in the second fastening area.

12. The electronic device of claim 6 , wherein the electrical structure comprises a printed circuit board disposed in the internal space of the electronic device.

13. The electronic device of claim 10 , wherein the reinforcing member comprises a polymer material.

14. An electronic device, comprising:

a side member including a conductive portion disposed between a pair of separated non-conductive portions in at least a portion of the side member, wherein the conductive portion is configured to radiate a signal;

an electrical structure spaced apart from the conductive portion;

a flexible printed circuit board (FPCB) comprising a first fastening area electrically connected to the conductive portion through screw fastening, an extension area extended from the first fastening area, and a second fastening area extended from the extension area and electrically connected to the electrical structure,

wherein the FPCB comprises:

a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the conductive portion;

a first conductive layer disposed at the first surface of the dielectric substrate;

a first protective layer stacked on the first conductive layer in the extension area;

a second conductive layer disposed at the second surface of the dielectric substrate; and

a second protective layer stacked on the second conductive layer, in the extension area;

wherein in the first fastening area, the first conductive layer and the second conductive layer are electrically connected to the conductive portion;

a screw through hole for screw fastening in the first fastening area; and

at least one conductive via disposed at a periphery of the screw through hole and formed from the first conductive layer to the second conductive layer through the dielectric substrate in the first fastening area, and

wherein the conductive portion comprises a conductive bushing extended to an internal space of the electronic device and comprising a screw fastener, and the first fastening area of the FPCB is fastened to the conductive bushing through a screw.

15. The electronic device of claim 14 , wherein the at least one conductive via is disposed to enclose along an edge of the screw through hole.

16. The electronic device of claim 14 , wherein the electrical structure comprises a printed circuit board comprising a wireless communication circuit, and

the wireless communication circuit is configured to transmit or receive wireless signals of a specific frequency band through the conductive portion electrically connected by the FPCB.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2020
From: SHIM, JONGWAN; BAE, BUMHEE; KIM, YOUNHO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 052062/0494 →
Priority Claims (1)
KR 10-2019-0059620 · May 21, 2019 · national
Continuity (1)
Related Publication 20200375026A1 · Nov 26, 2020
Cited By (4)
US 12,265,431 US 12,349,271 US 12,513,818 US 12,706,399