Lamination member and glass composition
The present invention relates to a laminated member, including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer containing a resin and lying on the glass member; and a Si—SiC member lying on the bonding layer, in which the glass member includes predetermined amounts of SiO 2 , Al 2 O 3 , B 2 O 3 , and P 2 O 5 , the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C., and has an average linear expansion coefficient β at 20 to 200° C. of 1.50 to 5.00 ppm/° C., and the laminated member has an absolute value |α-β|, which is a value obtained by subtracting β from α, of 2.00 ppm/° C. or less.
1. A laminated member, comprising:
a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more;
a bonding layer containing a resin and lying on the glass member; and
a Si—SiC member lying on the bonding layer, wherein
the glass member comprises, as represented by mole percent based on oxides, 55.0 mol % to 85.0 mol % of SiO 2 , 1.5 mol % to 22.0 mol % of Al 2 O 3 , 2.0 mol % to 14.0 mol % of B 2 O 3 , and 0 mol % to 5.0 mol % of P 2 O 5 ,
the glass member has a total content of the SiO 2 , the Al 2 O 3 , the B 2 O 3 , and the P 2 O 5 of 70.0% to 97.0% as represented by mole percent based on oxides,
the Si—SiC member has an average linear expansion coefficient α at 20° C. to 200° C. of 2.85 ppm/° C. to 4.00 ppm/° C.,
the glass member has an average linear expansion coefficient β at 20° C. to 200° C. of 1.50 ppm/° C. to 5.00 ppm/° C., and
the laminated member has an absolute value |α−β|, which is a value obtained by subtracting the average linear expansion coefficient β of the glass member at 20° C. to 200° C. from the average linear expansion coefficient α of the Si—SiC member at 20° C. to 200° C., of 2.00 ppm/° C. or less.
2. The laminated member according to claim 1 , wherein
the glass member comprises, as represented by mole percent based on oxides, 60.0 mol % to 78.0 mol % of SiO 2 , 8.0 mol % to 18.0 mol % of Al 2 O 3 , 2.0 mol % to 11.0 mol % of B 2 O 3 , and 0 mol % to 3.0 mol % of P 2 O 5 , and
the glass member has the total content of the SiO 2 , the Al 2 O 3 , the B 2 O 3 , and the P 2 O 5 of 80.0% to 90.0% as represented by mole percent based on oxides.
3. The laminated member according to claim 1 , wherein
the glass member has a total content of RO and ZnO of 2.0% to 25.0% as represented by mole percent based on oxides, and
the glass member has a total content of R 2 O of 0% to 15.0% as represented by mole percent based on oxides.
4. The laminated member according to claim 1 , wherein
the glass member has an average linear expansion coefficient β of 2.00 ppm/° C. to 3.50 ppm/° C., a Young's modulus of 40 GPa to 120 GPa, and a melting temperature of 1000° C. to 2000° C.
5. The laminated member according to claim 1 , wherein
the glass member has the content of B 2 O 3 of 8.5 mol % or less.
6. The laminated member according to claim 1 , wherein
the glass member comprises, as represented by mole percent based on oxides, 0 mol % to 13.0 mol % of Na 2 O.
7. The laminated member according to claim 1 , wherein
the glass member comprises, as represented by mole percent based on oxides, 0.0001 mol % to 0.0115 mol % of Fe 2 O 3 .
8. The laminated member according to claim 1 , wherein
the glass member has the linear transmittance at a wavelength of 850 nm of 90% or more.
9. The laminated member according to claim 1 , wherein
the glass member has a thickness of 2 mm to 40 mm, and
the Si—SiC member has a thickness of 0.5 mm to 15 mm.
10. The laminated member according to claim 1 , wherein
the Si—SiC member has a thermal conductivity at 20° C. of 130 W/m·K to 300 W/m·K.
11. The laminated member according to claim 1 , wherein
the average linear expansion coefficient β of the glass member at 20° C. to 200° C. is smaller than the average linear expansion coefficient α of the Si—SiC member at 20° C. to 200° C.
12. The laminated member according to claim 1 , wherein
the Si—SiC member has a Young's modulus of 300 GPa to 420 GPa.
13. The laminated member according to claim 1 , wherein
the Si—SiC member has a metal Si content ratio of 8 mass % to 60 mass %.
14. The laminated member according to claim 1 , wherein
the resin has a heat resistance temperature of 120° C. to 420° C.
15. The laminated member according to claim 1 , wherein
the bonding layer has an average linear expansion coefficient γ at 20° C. to 200° C. of 2 ppm/° C. to 200 ppm/° C.
16. The laminated member according to claim 1 , having a density of 2.40 g/cm 3 to 2.85 g/cm 3 .
17. The laminated member according to claim 1 , having an amount of warpage of 0.25 mm or less.
18. The laminated member according to claim 1 , further comprising:
a second bonding layer lying on the Si—SiC member; and
a second Si—SiC member bonded to the Si—SiC member via the second bonding layer.
19. A glass composition used for a glass member in a laminated member, the laminated member comprising the glass member, a bonding layer containing a resin and lying on the glass member, and a Si—SiC member lying on the bonding layer, wherein
the glass composition has a linear transmittance at a wavelength of 850 nm of 80% or more,
the glass composition comprises, as represented by mole percent based on oxides, 55.0 mol % to 85.0 mol % of SiO 2 , 1.5 mol % to 22.0 mol % of Al 2 O 3 , 2.0 mol % to 14.0 mol % of B 2 O 3 , and 0 mol % to 5.0 mol % of P 2 O 5 ,
the glass composition has a total content of the SiO 2 , the Al 2 O 3 , the B 2 O 3 , and the P 2 O 5 of 70.0% to 97.0% as represented by mole percent based on oxides,
the glass composition has an average linear expansion coefficient β at 20° C. to 200° C. of 1.50 ppm/° C. to 5.00 ppm/° C.,
the glass composition is used for a laminated member comprising a Si—SiC member having an average linear expansion coefficient α at 20° C. to 200° C. of 2.85 ppm/° C. to 4.00 ppm/° C. so that the laminated member has an absolute value |α−β|, which is a value obtained by subtracting the average linear expansion coefficient β of the glass member at 20° C. to 200° C. from the average linear expansion coefficient α of the Si—SiC member at 20° C. to 200° C., of 2.00 ppm/° C. or less.