IP Library › Granted Patent US 12,434,456
Granted Patent B2
US 12,434,456 · App. 18/063,138 · Granted Oct 7, 2025

Laminated member

Inventors: Yu Hanawa (Tokyo, JP); Shuhei Ogawa (Tokyo, JP); Seiji Inaba (Tokyo, JP); Hiroyuki Yamamoto (Tokyo, JP)
Assignee: AGC Inc.
B32B17/06B32B7/12B32B18/00B32B37/12B32B37/20B32B2250/03B32B2307/302B32B2307/308B32B2307/412B32B2315/02B32B2315/08
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,434,456
App. No.
18/063,138
Granted
Oct 7, 2025
Kind
B2
Abstract

The present invention relates to a laminated member including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer including a resin and lying on the glass member; and a Si—SiC member lying on the bonding member, in which the Si—SiC member has an average linear expansion coefficient α at from 20° C. to 200° C. of from 2.85 ppm/° C. to 4.00 ppm/° C.

Claims (25)

1. A laminated member, comprising:

a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more and a thickness in a range of 3 mm to 40 mm;

a bonding layer comprising a resin and formed on the glass member; and

a Si—SiC member formed on the bonding layer and having a thickness in a range of 0.5 to 15mm, such that the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C.

2. The laminated member according to claim 1 , wherein the glass member has an average linear expansion coefficient δ at 20 to 200° C. of to 1.50 to 5.00 ppm/° C.

3. The laminated member according to claim 1 , wherein the glass member has a composition comprising 55.0 to 85.0 mol % of SiO 2 , 1.5 to 14.5 mol % of Al 2 O 3 , 3.0 to 14.0 mol % of B 2 O 3 , and 0 to 3.5 mol % of P 2 O 5 , as represented by mole percent based on oxides, and has a total content of the SiO 2 , the Al 2 O 3 , the B 2 O 3 , and the P 2 O 5 in a range of 70.0 to 97.0% as represented by mole percent based on oxides.

4. The laminated member according to claim 3 , wherein the glass member has a content of the B 2 O 3 in a range of 8.5 mol % or less.

5. The laminated member according to claim 1 , wherein the glass member comprises from has a composition comprising 0 to 13.0 mol % of Na 2 O, as represented by mole percent based on oxides.

6. The laminated member according to claim 1 , wherein the glass member has a composition comprising 0.0001 to 0.0115 mol % of Fe 2 O 3 , as represented by mole percent based on oxides.

7. The laminated member according to claim 1 , wherein the glass member has the linear transmittance of 90% or more at a wavelength of 850 nm.

8. The laminated member according to claim 1 , wherein the glass member has a thickness of 5 mm or more, and the Si—SiC member has a thickness of 1.5 mm or more.

9. The laminated member according to claim 1 , wherein the Si—SiC member has a thermal conductivity in a range of 190 to 300 W/m·K at 20° C.

10. The laminated member according to claim 1 , wherein the laminated member has an absolute value |α−β| of 2.00 ppm/° C. or less, where the absolute value |α−β| is a value obtained by subtracting an average linear expansion coefficient β of the glass member at 20 to 200° C. from the average linear expansion coefficient a of the Si—SiC member at 20 to 200° C.

11. The laminated member according to claim 1 , wherein the Si—SiC member has a Young's modulus in a range of 300 to 420 GPa.

12. The laminated member according to claim 1 , wherein the Si—SiC member has a content ratio of a metallic Si in a range of 8 to 60 mass %.

13. The laminated member according to claim 1 , wherein the resin has a heat resistance temperature in a range of 120 to 300° C.

14. The laminated member according to claim 1 , wherein the bonding layer has an average linear expansion coefficient γ at 20 to 200° C. in a range of 2 to 200 ppm/° C.

15. The laminated member according to claim 1 , wherein the laminated member has a density in a range of 2.40 to 2.85 g/cm 3 .

16. The laminated member according to claim 1 , wherein the laminated member has an amount of bending of 0.25 mm or less.

17. The laminated member according to claim 1 , further comprising:

a second bonding layer lying on the Si—SiC member; and

a second Si—SiC member bonded to the Si—SiC member via the second bonding layer.

18. The laminated member according to claim 2 , wherein the glass member has a composition comprising 55.0 to 85.0 mol % of SiO 2 , 1.5 to 14.5 mol % of Al 2 O 3 , 3.0 to 14.0 mol % of B 2 O 3 , and 0 to 3.5 mol % of P 2 O 5 , as represented by mole percent based on oxides, and has a total content of the SiO 2 , the Al 2 O 3 , the B 2 O 3 , and the P 2 O 5 in a range of 70.0 to 97.0% as represented by mole percent based on oxides.

19. The laminated member according to claim 18 , wherein the glass member has a content of the B 2 O 3 in a range of 8.5 mol % or less.

20. The laminated member according to claim 2 , wherein the glass member has a composition comprising 0 to 13.0 mol % of Na 2 O, as represented by mole percent based on oxides.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2022
From: HANAWA, YU; OGAWA, SHUHEI; INABA, SEIJI; YAMAMOTO, HIROYUKI
To: AGC INC.
Reel/Frame 062022/0733 →
Priority Claims (3)
JP 2020-101051 · Jun 10, 2020 · national
JP 2020-161312 · Sep 25, 2020 · national
JP 2021-007287 · Jan 20, 2021 · national
Continuity (2)
Continuation PCTJP2021021106 · Jun 2, 2021
Related Publication 20230107722A1 · Apr 6, 2023
References Cited (21)
US 20040183232A1 · Kinoshita · 2004 [cited by examiner]
US 20080174054A1 · Lipson et al. · 2008 [cited by applicant]
US 20100128242A1 · Lipson et al. · 2010 [cited by applicant]
US 20130288876A1 · Fujisawa et al. · 2013 [cited by applicant]
US 20170157891A1 · Soda et al. · 2017 [cited by applicant]
US 20180082914A1 · Hanawa · 2018 [cited by examiner]
US 20180305241A1 · Sawamura · 2018 [cited by examiner]
US 20220134713A1 · Ogawa et al. · 2022 [cited by applicant]
CN 107270755 · 2017 [cited by applicant]
JP 08083835 · 1996 [cited by applicant]
JP 11100229A · 1999 [cited by applicant]
JP 200586711A · 2005 [cited by applicant]
JP 2008199006A · 2008 [cited by applicant]
JP 2012148958A · 2012 [cited by applicant]
JP 2013197425 · 2013 [cited by applicant]
JP 2014165459A · 2014 [cited by applicant]
JP 2018203571A · 2018 [cited by applicant]
WO WO2015087812A1 · 2015 [cited by applicant]
WO WO2021015059A1 · 2021 [cited by applicant]
International Search Report issued Jul. 6, 2021 in PCT/JP2021/021105 filed Jun. 2, 2021, 2 pages. [cited by applicant]
International Search Report issued Aug. 17, 2021 in PCT/JP2021/021106 filed Jun. 2, 2021, 3 pages. [cited by applicant]