Methods and apparatus for reducing microbumps for inter-die double-data rate (DDR) transfer

1. An integrated circuit device, comprising:

a plurality of microbumps to receive data bits and parity bits from another integrated circuit device using a double data rate (DDR) transfer scheme; and

decoding circuitry to receive the data bits from the plurality of microbumps and to implement a decoding scheme that exploits an error characteristic associated with the DDR transfer scheme at a defective microbump of the plurality of microbumps, wherein the error characteristic comprises a pattern corresponding to a single defective microbump repeating a value between consecutive bits in the DDR transfer scheme.

2. The integrated circuit device of claim 1 , wherein the plurality of microbumps comprises a plurality of communication channels, and the plurality of communication channels comprise respective single defective microbumps.

3. The integrated circuit device of claim 1 , wherein the decoding scheme is implemented based on a single error correcting, double error detecting, and double adjacent error correcting (SEC-DED-DAEC) error correcting code (ECC) scheme.

4. The integrated circuit device of claim 3 , wherein the SEC-DED-DAEC ECC scheme imposes at least four constraints on a parity check matrix that determines a configuration of the decoding circuitry.

5. The integrated circuit device of claim 4 , wherein the at least four constraints stipulates that:

a) no columns in the parity check matrix are all zeros;

b) every column in the parity check matrix is distinct; and

c) every column in the parity check matrix contains an odd number of ones.

6. The integrated circuit device of claim 5 , wherein the at least four constraints further stipulates that:

d) every even and odd column pair in the parity check matrix is distinct.

7. The integrated circuit device of claim 6 , wherein the decoding circuitry is implemented based on values in the parity check matrix and also based on additional parity bits obtained by combining even and odd columns in the parity check matrix.

8. The integrated circuit device of claim 7 , wherein the additional parity bits enable the decoding circuitry to identify adjacent even and odd bit errors at the defective microbump.

9. An integrated circuit device, comprising:

a first group of microbumps configured to output data bits to another integrated circuit device using a double-data rate (DDR) transfer scheme;

a second group of microbumps configured to output parity bits to the other integrated circuit device; and

decoding circuitry that is configured to receive the data bits and that is configured to implement a decoding scheme that exploits an error characteristic associated with the DDR transfer scheme at a defective microbump of the first group of microbumps, wherein the error characteristic comprises a pattern corresponding to a single defective microbump repeating a value between consecutive bits in the DDR transfer scheme.

10. The integrated circuit device of claim 9 , wherein the defective microbump is configured to receive an even data bit at a rising clock edge and an odd data bit at a falling clock edge.

11. The integrated circuit device of claim 9 , wherein the decoding scheme is implemented based on a single error correcting, double error detecting, and double adjacent error correcting (SEC-DED-DAEC) error correcting code (ECC) scheme.

12. The integrated circuit device of claim 11 , wherein the SEC-DED-DAEC ECC scheme imposes at least four constraints on a parity check matrix that determines the configuration of the decoding circuitry.

13. The integrated circuit device of claim 12 , wherein the at least four constraints stipulates that:

a) no columns in the parity check matrix are all zeros;

b) every column in the parity check matrix is distinct;

c) every column in the parity check matrix contains an odd number of ones; and

d) every even and odd column pair in the parity check matrix is distinct.

14. The integrated circuit device of claim 13 , wherein the decoding circuitry is implemented based on values in the parity check matrix and also based on additional parity bits obtained by combining even and odd columns in the parity check matrix.

15. The integrated circuit device of claim 14 , wherein the additional parity bits enable the decoding circuitry to identify adjacent even and odd bit errors at the defective microbump using the repeated value.

16. A system, comprising:

a first integrated circuit die; and

a second integrated circuit die configured to communicate with the first integrated circuit die via a plurality of microbumps, wherein:

the first integrated circuit die is configured to transmit data bits to the second integrated circuit die via the plurality of microbumps using a double data rate (DDR) toggling scheme; and

the first integrated circuit die comprises an encoder circuitry configured to encode the data bits using an error correcting code (ECC) scheme that is to detect even and odd data bit errors at a defective microbump in the plurality of microbumps using an identified error characteristic, wherein the error characteristic comprises a pattern corresponding to a single defective microbump repeating a value between consecutive bits in the DDR toggling scheme.

17. The system of claim 16 , wherein the ECC scheme comprises a single error correcting, double error detecting, and double adjacent error correcting (SEC-DED-DAEC) scheme that requires fewer parity bits than a single error correcting and double error detecting (SEC-DED) scheme.

18. The system of claim 17 , wherein the SEC-DED-DAEC scheme imposes at least the following constraints on an H-matrix that determines the configuration of the encoder circuitry:

a) no columns in the H-matrix are all zeros;

b) every column in the H-matrix is distinct;

c) every column in the H-matrix contains an odd number of ones; and

d) a function of an even column and an odd column in each associated column pair is distinct from the function of an even column and an odd column of every other column pair in the H-matrix.

19. The system of claim 18 , wherein the second integrated circuit die comprises a decoder circuitry configured to decode the data bits received from the first integrated circuit die, and wherein the decoder circuitry is implemented based on the H-matrix and also based on additional parity bits generated by taking the function of the even column and the odd column in each column pair of the H-matrix.

20. The system of claim 19 , wherein additional parity bits enable the decoding circuitry to identify adjacent even and odd bit errors at the defective microbump using the repeated value.