Test tray system and related method
A test tray system for electronics, like photonics integrated circuit (PIC) structures, and a related method are disclosed. The test tray system includes at least one test tray. Each test tray includes a first section exposing a first electrical component to a high temperature, and a second section covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature at the same time that the first electrical component is being exposed to the high temperature. The test tray system allows testing of the first component at a high temperature, e.g., 125° C., while protecting the second component from the high temperatures.
1 . A test tray system, comprising:
at least one test tray including:
a first section configured to expose a first electrical component to a high temperature; and
a second section covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature at the same time that the first electrical component is being exposed to the high temperature.
2 . The test tray system of claim 1 , wherein the thermal protection element includes a thermal insulator layer enclosing the second component.
3 . The test tray system of claim 1 , wherein the thermal protection element includes an enclosure enclosing the second component.
4 . The test tray system of claim 3 , wherein the enclosure includes a thermally insulated enclosure including a thermal insulating layer over an inner container.
5 . The test tray system of claim 3 , further comprising a cooling system operatively coupled to the enclosure to cool at least the second component.
6 . The test tray system of claim 5 , wherein the cooling system uses a fluid coolant to cool at least the second component.
7 . The test tray system of claim 1 , further comprising a cooling system operatively coupled to the thermal protection element to cool at least the second component.
8 . The test tray system of claim 1 , wherein the first electrical component includes a photonics integrated circuit (PIC) module and the second component includes an optical connector, wherein the PIC module and the optical connector are connected by an optical fiber.
9 . The test tray system of claim 1 , wherein the at least one test tray includes a plurality of test trays, each test tray including a stacking structure configured to position the test tray to stack with an adjacent test tray of the plurality of test trays.
10 . The test tray system of claim 1 , wherein the first section exposes a plurality of first electrical components to the high temperature; and
the thermal protection element prevents a plurality of second components from being exposed to the high temperature at the same time that the plurality of first electrical components is being exposed to the high temperature.
11 . A test tray system for a photonics integrated circuit (PIC) structure including a PIC module connected to an optical connector with an optical fiber, the test tray system comprising:
at least one test tray including:
a first section configured to expose the PIC module to a high temperature; and
a second section covered by a thermal protection element configured to prevent the optical connector from being exposed to the high temperature at the same time that the PIC module is being exposed to the high temperature.
12 . The test tray system of claim 11 , wherein the thermal protection element includes a thermal insulator layer enclosing the optical connector.
13 . The test tray system of claim 11 , wherein the thermal protection element includes a thermally insulated enclosure including a thermal insulating layer over an inner container.
14 . The test tray system of claim 13 , further comprising a cooling system operatively coupled to the thermally insulated enclosure to cool at least the optical connector.
15 . The test tray system of claim 11 , further comprising a cooling system operatively coupled to the thermal protection element to cool at least the optical connector.
16 . The test tray system of claim 11 , wherein the at least one test tray includes a plurality of test trays, each test tray including a stacking structure configured to position the test tray to stack with an adjacent test tray of the plurality of test trays.
17 . A method of testing a photonics integrated circuit (PIC) structure, the method comprising:
exposing a PIC module of the PIC structure in a first section of a test tray to a high temperature;
thermally insulating an optical connector of the PIC structure in a second section of the test tray to prevent the optical connector from being exposed to the high temperature at the same time that the PIC module is exposed to the high temperature, the PIC module coupled to the optical connector by an optical fiber; and
testing the PIC structure at the same time that the PIC module is exposed to the high temperature and the optical connector is thermally insulated.
18 . The method of claim 17 , wherein thermally insulating includes using a thermal insulator layer enclosing the optical connector.
19 . The method of claim 17 , wherein thermally insulating includes enclosing the optical connector in a thermally insulated enclosure.
20 . The method of claim 17 , further comprising cooling at least the optical connector with a cooling system.