Electrode bridging in an emitter assembly
In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) device. The VCSEL device may include a substrate. The VCSEL device may include a plurality of VCSELs on the substrate. The VCSEL device may include at least one anode layer on the substrate and electrically connected to the plurality of VCSELs. The VCSEL device may include a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs. The cathode electrode may include multiple cathode electrode fingers. The emitter assembly may include a bridge element that electrically connects a first finger of the multiple cathode electrode fingers and a second finger of the multiple cathode electrode fingers.
1 . An emitter assembly, comprising:
a carrier comprising a carrier substrate;
a vertical cavity surface emitting laser (VCSEL) device, on the carrier, comprising:
a substrate;
a plurality of VCSELs on the substrate;
at least one anode layer on the substrate and electrically connected to the plurality of VCSELs;
one or more anode interconnects that electrically connect the at least one anode layer and the carrier;
a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs,
the cathode electrode comprising multiple cathode electrode fingers; and
one or more cathode interconnects that electrically connect the cathode electrode and the carrier,
the one or more cathode interconnects comprising one or more first interconnects connected to a first finger of the multiple cathode electrode fingers of the cathode electrode and one or more second interconnects connected to a second finger of the multiple cathode electrode fingers of the cathode electrode; and
one or more redistribution layers comprising one or more traces,
the one or more first interconnects being bridged to the one or more second interconnects by the one or more traces of the one or more redistribution layers.
2 . The emitter assembly of claim 1 , wherein the one or more traces comprise multiple traces, and
wherein each of the multiple traces bridges one of the one or more first interconnects with one of the one or more second interconnects.
3 . The emitter assembly of claim 1 , wherein the one or more traces comprise a single trace having a main trace portion that is linear and one or more trace extensions that extend from the main trace portion, and
wherein the one or more trace extensions bridge the one or more first interconnects with the one or more second interconnects.
4 . The emitter assembly of claim 3 , wherein the one or more trace extensions comprise multiple trace extensions, and
wherein each of the multiple trace extensions bridges one of the one or more first interconnects with one of the one or more second interconnects.
5 . The emitter assembly of claim 3 , wherein the one or more trace extensions comprise a trace extension that bridges one of the one or more first interconnects with at least two of the one or more second interconnects.
6 . The emitter assembly of claim 1 , wherein the one or more redistribution layers are on the VCSEL device.
7 . The emitter assembly of claim 1 , wherein the one or more redistribution layers are on the carrier substrate.
8 . The emitter assembly of claim 1 , wherein the multiple cathode electrode fingers are arranged interdigitally with cathode electrode fingers of an additional cathode electrode of the VCSEL device.
9 . An emitter assembly, comprising:
a carrier comprising a carrier substrate;
a vertical cavity surface emitting laser (VCSEL) device, on the carrier, comprising:
a substrate;
a plurality of VCSELs on the substrate;
at least one anode layer on the substrate and electrically connected to the plurality of VCSELs;
a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs,
the cathode electrode comprising multiple cathode electrode fingers; and
a bridge element that electrically connects a first finger of the multiple cathode electrode fingers and a second finger of the multiple cathode electrode fingers.
10 . The emitter assembly of claim 9 , further comprising:
an isolation layer on the cathode electrode,
wherein the bridge element includes a conductive pad, on the isolation layer, electrically connecting the first finger and the second finger, and isolated from a cathode electrode finger of an additional cathode electrode by the isolation layer.
11 . The emitter assembly of claim 10 , further comprising:
a cathode interconnect electrically connected to the conductive pad,
wherein a width of the cathode interconnect is greater than a width of the first finger or a width of the second finger.
12 . The emitter assembly of claim 9 , further comprising:
one or more cathode interconnects, that electrically connect the cathode electrode and the carrier, comprising one or more first interconnects connected to the first finger and one or more second interconnects connected to the second finger,
wherein the bridge element includes one or more traces of one or more redistribution layers that bridge the one or more first interconnects with the one or more second interconnects.
13 . The emitter assembly of claim 9 , wherein the multiple cathode electrode fingers are arranged interdigitally with cathode electrode fingers of an additional cathode electrode of the VCSEL device.
14 . The emitter assembly of claim 13 , wherein the bridge element electrically connects the first finger of the multiple cathode electrode fingers and the second finger of the multiple cathode electrode fingers by crossing an electrode finger of the additional cathode electrode that is interdigitated between the first finger and the second finger.
15 . The emitter assembly of claim 9 , wherein the carrier further comprises a ground layer, and
wherein the emitter assembly further comprises a decoupling capacitor electrically connected to the ground layer.
16 . An emitter assembly, comprising:
a vertical cavity surface emitting laser (VCSEL) device, comprising:
a substrate;
a plurality of VCSELs on the substrate;
at least one anode layer on the substrate and electrically connected to the plurality of VCSELs;
a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs,
the cathode electrode comprising multiple cathode electrode fingers; and
a bridge element that electrically connects a first finger of the multiple cathode electrode fingers and a second finger of the multiple cathode electrode fingers.
17 . The emitter assembly of claim 16 , further comprising:
an isolation layer on the cathode electrode,
wherein the bridge element includes a conductive pad, on the isolation layer, electrically connecting the first finger and the second finger, and isolated from a cathode electrode finger of an additional cathode electrode by the isolation layer; and
a cathode interconnect electrically connected to the conductive pad,
wherein a width of the cathode interconnect is greater than a width of the first finger or a width of the second finger.
18 . The emitter assembly of claim 16 , further comprising:
one or more cathode interconnects comprising one or more first interconnects connected to the first finger and one or more second interconnects connected to the second finger,
wherein the bridge element includes one or more traces of one or more redistribution layers that bridge the one or more first interconnects with the one or more second interconnects.
19 . The emitter assembly of claim 18 , wherein the one or more traces comprise multiple traces, and
wherein each of the multiple traces bridges one of the one or more first interconnects with one of the one or more second interconnects.
20 . The emitter assembly of claim 16 , wherein the multiple cathode electrode fingers are arranged interdigitally with cathode electrode fingers of an additional cathode electrode of the VCSEL device.