Power overlay architecture
A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.
1. A modular power overlay architecture, comprising:
a first set of power overlay tiles defining a substantially planar arrangement of power switching components arranged on a first substrate and defining a first planar footprint;
a second set of power overlay tiles defining a substantially planar arrangement of power switching components arranged on a second substrate and defining a second planar footprint, the second planar footprint equal to the first planar footprint; and
a housing configured to receive the first set of power overlay tiles and the second set of power overlay tiles in a parallel arrangement where the first planar footprint and second planar footprint are in an overlying arrangement;
wherein each tile of the first set of power overlay tiles defines a first end having a set of terminals, and wherein each tile of the second set of power overlay tiles defines a first end having a set of terminals, and wherein each terminal of the set of terminals includes a first conductive layer, a second conductive layer, and a non-conductive layer separating the first conductive layer from the second conductive layer.
2. The modular power overlay architecture of claim 1 , wherein each tile of the first set of power overlay tiles defines a second end having a second set of terminals, and wherein each tile of the second set of power overlay tiles defines a second end having a second set of terminals.
3. The modular power overlay architecture of claim 2 , wherein the housing is configured to receive the second end of the first set of power overlay tiles and the second end of the second set of power overlay tiles at a common end of the housing.
4. The module power overlay architecture of claim 3 , wherein the housing further includes a common connector at the common end of the housing, the common connector mechanically coupled with the second sets of terminals.
5. The module power overlay architecture of claim 2 , wherein the second set of terminals is a set of pinouts.
6. The module power overlay architecture of claim 5 , wherein the set of pinouts extend in parallel to, and away from, a respective tile of the first set of power overlay tiles.
7. The module power overlay architecture of claim 1 , wherein the first set of power overlay tiles and the second set of power overlay tiles are laterally received by the housing into the overlying arrangement.
8. The module power overlay architecture of claim 7 , wherein the housing includes openings at a lateral end of the housing, and wherein the first set of power overlay tiles and the second set of power overlay tiles are laterally received by the openings.
9. The modular power overlay architecture of claim 1 , wherein each of the first set of power overlay tiles and each of the second set of power overlay tiles includes a first conductive surface of a respective tile electrically connected with the power switching components.
10. The modular power overlay architecture of claim 9 , wherein the first conductive surface is commonly arranged relative to each of the first and second sets of power overlay tiles.
11. The modular power overlay architecture of claim 9 , wherein the first conductive surface defines a source terminal for the first and second sets of power overlay tiles.
12. The modular power overlay architecture of claim 9 , wherein the power switching components of the first and second sets of power overlay tiles are arranged on a second surface of the respective tile, opposite the first conductive surface, and electrically connected with the first conductive surface of the respective tile.
13. The modular power overlay architecture of claim 12 , wherein a surface of the power switching components distal from the respective tile defines a drain connection of the power switching components.
14. The modular power overlay architecture of claim 13 , further comprising a second conductive surface overlying and electrically connected with each of the drain connections of the power switching components, defining a power overlay tile drain connection.
15. The modular power overlay architecture of claim 14 , wherein the first conductive surface and the second conductive surface allow for reduced inductance connections with the set or subset of first set of power overlay tiles or second set of power overlay tiles, compared with a set of wire bond connections.
16. The modular power overlay architecture of claim 1 , wherein the housing is configured to receive the first end of the first set of power overlay tiles and the first end of the second set of power overlay tiles at a common end of the housing.
17. The modular power overlay architecture of claim 1 , wherein first conductive layer defines a first conductive surface, wherein the second conductive layer defines a second conductive surface, and wherein at least one first conductive surface of a first tile of at least one of the first set of power overlay tiles or the second set of power overlay tiles faces a second conductive surface of a second tile of at least one of the first set of power overlay tiles or the second set of power overlay tiles.
18. The modular power overlay architecture of claim 17 , wherein each first conductive surface of the first set of power overlay tiles and the second set of power overlay tiles faces a common direction.
19. The modular power overlay architecture of claim 18 , wherein the common direction is perpendicular to the parallel arrangement of the first set of power overlay tiles and the second set of power overlay tiles.