Platinum-based solder body contacts for integration of a first substrate with a second substrate
One exemplary method of forming a semiconductor structure having a platinum-based solder body contact includes providing a semiconductor structure having a passivation layer over a surface thereof, the passivation layer having a window exposing a portion of a top metal pad, and forming a barrier metal stack over the passivation layer and the portion of the top metal pad, the barrier metal stack including a tantalum nitride (TaN) layer and a tantalum (Ta) layer. The method further includes forming a solder body contact layer comprising platinum (Pt) over the barrier metal stack, and patterning the solder body contact layer and the barrier metal stack to form the platinum-based solder body contact over the portion of the top metal pad.
1 . A method comprising:
providing a semiconductor structure having a passivation layer over a surface thereof, said passivation layer having a window exposing a portion of a top metal pad;
forming a barrier metal stack over said passivation layer and said portion of said top metal pad, said barrier metal stack comprising a tantalum nitride (TaN) layer and a tantalum (Ta) layer;
forming a solder body contact layer comprising platinum (Pt) over said barrier metal stack;
patterning said solder body contact layer and said barrier metal stack to form a solder body contact over said portion of said top metal pad.
2 . The method of claim 1 , wherein said top metal pad has first and second lateral ends, and wherein said passivation layer covers said first and second lateral ends while exposing said portion of said top metal pad.
3 . The method of claim 2 , wherein said patterning said solder body contact layer and said barrier metal stack forms said solder body contact over said portion of said top metal pad and over said first and second lateral ends.
4 . The method of claim 1 , wherein said solder body contact layer is one of a Pt layer or a platinum alloy layer.
5 . The method of claim 1 , wherein said top metal pad is an aluminum (Al) pad or a copper (Cu) pad.
6 . The method of claim 1 , wherein said passivation layer comprises an oxide layer and/or a nitride layer.
7 . The method of claim 1 , wherein said passivation layer does not comprise polybenzoxazole (PBO), polyimide (PI), or benzocyclobutene (BCB).
8 . A method comprising:
providing a semiconductor structure having a top metal layer formed thereon;
forming a barrier metal stack over said top metal layer, said barrier metal stack comprising a tantalum nitride (TaN) layer and a tantalum (Ta) layer;
forming a solder body contact layer comprising platinum over said barrier metal stack;
substantially concurrently patterning said solder body contact layer and said barrier metal stack to form a solder body contact.
9 . The method of claim 8 , further comprising:
forming a passivation layer, wherein said passivation layer is not situated under any portion of said solder body contact;
forming a window in said passivation layer, said window exposing a portion of said solder body contact.
10 . The method of claim 9 , wherein said passivation layer comprises an oxide layer and/or a nitride layer.
11 . The method of claim 9 , wherein said passivation layer does not comprise polybenzoxazole (PBO), polyimide (PI), or benzocyclobutene (BCB).
12 . The method of claim 8 , wherein said solder body contact layer is one of a Pt layer or a platinum alloy layer.
13 . The method of claim 8 , wherein said top metal layer is an aluminum (Al) layer or a copper (Cu) layer.
14 . A semiconductor structure comprising:
a passivation layer formed over a surface of said semiconductor structure, said passivation layer having a window exposing a portion of a top metal pad;
a patterned barrier metal stack formed over said top metal pad in said window, said patterned barrier metal stack comprising a tantalum nitride (TaN) segment formed over a tantalum (Ta) segment;
a solder body contact comprising platinum (Pt) formed over said patterned barrier metal stack.
15 . The semiconductor structure of claim 14 , wherein said top metal pad has first and second lateral ends, and wherein said passivation layer is situated over said first and second lateral ends while exposing said portion of said top metal pad.
16 . The semiconductor structure of claim 14 , wherein said solder body contact is situated over said portion of said top metal pad and over said first and second lateral ends.
17 . The semiconductor structure of claim 14 , wherein said solder body contact is one of a Pt contact or a platinum alloy contact.
18 . The semiconductor structure of claim 14 , wherein said top metal pad is an aluminum (Al) pad or a copper (Cu) pad.
19 . The semiconductor structure of claim 14 , wherein said passivation layer comprises an oxide layer and/or a nitride layer.
20 . The semiconductor structure of claim 14 , wherein said passivation layer does not comprise polybenzoxazole (PBO), polyimide (PI), or benzocyclobutene (BCB).