IP Library Granted Patent US 12,467,308
Granted Patent B2
US 12,467,308 · App. 18/376,483 · Granted Nov 11, 2025

Vacuum insulated panel with tellurium oxide and/or vanadium oxide inclusive seal

Inventor: Scott V. Thomsen (Glen Arbor, MI)
Assignee: LuxWall, Inc.
E06B3/6612B01J20/0211B01J20/0214B01J20/0248B23K26/206B23K26/324B32B17/00B32B17/068B32B17/10005B32B17/10036C03B23/245C03C3/062C03C3/064C03C3/122C03C3/14C03C4/0071C03C8/02C03C27/06C03C27/08E06B3/66304E06B3/66333E06B3/66342E06B3/673E06B3/67334E06B3/6736F16J15/062B23K26/57B23K2103/52B23K2103/54C03C2204/00C03C2207/00E06B2003/66338E06B3/6775
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,467,308
App. No.
18/376,483
Granted
Nov 11, 2025
Kind
B2
Abstract

A vacuum insulating panel includes may include: a first substrate; a second substrate; a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at a pressure less than atmospheric pressure; a seal provided between at least the first and second substrates, the seal comprising a first seal layer and/or a second seal layer; and wherein the first seal layer may include from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first seal layer comprises more TeO 3 than TeO 4 by wt. %.

Claims (69)

1 . A vacuum insulating panel comprising:

a first substrate;

a second substrate;

a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at pressure less than atmospheric pressure;

a seal provided at least partially between at least the first and second substrates, the seal comprising a first seal layer and a second seal layer; and

wherein the first seal layer comprises from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first seal layer comprises more TeO 3 than TeO 4 by wt. %.

2 . The vacuum insulating panel of claim 1 , wherein the first seal layer comprises from about 40-70 wt. % tellurium oxide.

3 . The vacuum insulating panel of claim 1 , wherein from about 60-95% of Te in the first seal layer is in a form of TeO 3 .

4 . The vacuum insulating panel of claim 1 , wherein from about 70-90% of Te in the first seal layer is in a form of TeO 3 .

5 . The vacuum insulating panel of claim 1 , wherein from about 3-35% of Te in the first seal layer is in a form of TeO 4 .

6 . The vacuum insulating panel of claim 1 , wherein from about 5-25% of Te in the first seal layer is in a form of TeO 4 .

7 . The vacuum insulating panel of claim 1 , wherein from about 10-20% of Te in the first seal layer is in a form of TeO 4 .

8 . The vacuum insulating panel of claim 1 , wherein the tellurium oxide further comprises TeO 3+1 , and wherein the first seal layer comprises more TeO 3 than TeO 3+1 by wt. %.

9 . The vacuum insulating panel of claim 8 , wherein from about 1-9% of Te in the first seal layer is in a form of TeO 3+1 .

10 . The vacuum insulating panel of claim 1 , wherein a ratio TeO 4 :TeO 3 in the first seal layer is from about 0.05 to 0.40.

11 . The vacuum insulating panel of claim 1 , wherein a ratio TeO 4 :TeO 3 in the first seal layer is from about 0.10 to 0.30.

12 . The vacuum insulating panel of claim 1 , wherein the first seal layer further comprises vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.

13 . The vacuum insulating panel of claim 12 , wherein the vanadium oxide comprises VO 2 and V 2 O 5 , and wherein more V in the first seal layer is in a form of VO 2 than V 2 O 5 .

14 . The vacuum insulating panel of claim 13 , wherein from about 35-85% of the V in the first seal layer is in a form of VO 2 .

15 . The vacuum insulating panel of claim 13 , wherein from about 50-75% of the V in the first seal layer is in a form of VO 2 .

16 . The vacuum insulating panel of claim 13 , wherein from about 58-67% of the V in the first seal layer is in a form of VO 2 .

17 . The vacuum insulating panel of claim 13 , wherein from about 5-45% of the V in the first seal layer is in a form of V 2 O 5 .

18 . The vacuum insulating panel of claim 13 , wherein from about 10-35% of the V in the first seal layer is in a form of V 2 O 5 .

19 . The vacuum insulating panel of claim 13 , wherein the vanadium oxide further comprises V 2 O 3 , and wherein more V in the first seal layer is in a form of VO 2 than V 2 O 3 .

20 . The vacuum insulating panel of claim 19 , wherein from about 6-20% of the V in the first seal layer is in a form of V 2 O 3 .

21 . The vacuum insulating panel of claim 1 , wherein the first seal layer further comprises from about 10-50 wt. % vanadium oxide, wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide, and wherein the vanadium oxide comprises VO 2 and V 2 O 5 .

22 . The vacuum insulating panel of claim 21 , wherein a ratio V 2 O 5 :VO 2 in the first seal layer is from about 0.10 to 0.90.

23 . The vacuum insulating panel of claim 21 , wherein a ratio V 2 O 5 :VO 2 in the first seal layer is from about 0.20 to 0.80.

24 . The vacuum insulating panel of claim 21 , wherein a ratio V 2 O 5 :VO 2 in the first seal layer is from about 0.25 to 0.50.

25 . The vacuum insulating panel of claim 1 , wherein the first seal layer further comprises from about 12-40 wt. % vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.

26 . The vacuum insulating panel of claim 1 , wherein the first seal layer is a main seal layer, and the second seal layer is a primer layer.

27 . The vacuum insulating panel of claim 1 , wherein the second seal layer comprises bismuth oxide and boron oxide.

28 . The vacuum insulating panel of claim 27 , wherein the second seal layer comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and comprises at least two times more boron than bismuth on an elemental basis in terms of mol %.

29 . The vacuum insulating panel of claim 1 , wherein the seal further comprises a third seal layer, and wherein for at least one location of the seal, the first seal layer has a first thickness, the second seal layer has a second thickness, and the third seal layer has a third thickness; and wherein the first thickness is greater than the second thickness and less than the third thickness.

30 . The vacuum insulating panel of claim 29 , wherein the third seal layer comprises from about 1-40 mol % bismuth and comprises at least two times more boron than bismuth on an elemental basis in terms of mol %.

31 . The vacuum insulating panel of claim 1 , wherein the first seal layer has a density of from about 2.8-4.0 g/cm 3 , the second seal layer has a density of from about 3.0-4.2 g/cm 3 , and wherein the density of the second seal layer is at least about 0.20 g/cm 3 greater than the density of the first seal layer.

32 . The vacuum insulating panel of claim 1 , wherein, for at least one location of the seal, a width of the first seal layer is less than a width of the second seal layer by at least about 1 mm.

33 . The vacuum insulating panel of claim 1 , wherein the seal is substantially lead-free.

34 . The vacuum insulating panel of claim 1 , wherein the first seal layer has an average particle size (D50) of from about 5-20 μm.

35 . The vacuum insulating panel of claim 1 , wherein the first seal layer comprises: from about 40-70% wt. % tellurium oxide, from about 12-40 wt. % vanadium oxide, from about 3-30 wt. % aluminum oxide, and from about 1-25 wt. % silicon oxide.

36 . The vacuum insulating panel of claim 1 , wherein the second seal layer comprises from about 1-12 mol % bismuth oxide, from about 15-40% mol % boron oxide, and from about 0-50 mol % silicon oxide.

37 . The vacuum insulating panel of claim 1 , wherein the first seal layer has a physical thickness of from about from about 40-100 μm.

38 . The vacuum insulating panel of claim 1 , wherein the second seal layer has a physical thickness of from about 20-70 μm or from about 100-220 μm.

39 . The vacuum insulating panel of claim 1 , wherein, for the at least one location of the seal, a thickness of the first seal layer is at least about 10 μm thicker than a thickness of the second seal layer.

40 . The vacuum insulating panel of claim 1 , wherein, for the at least one location of the seal, an outer lateral edge of the first seal layer is spaced inwardly from an outer lateral edge of the second seal layer by an offset distance of at least about 0.5 mm.

41 . The vacuum insulating panel of claim 1 , wherein the first and second substrates comprise glass substrates.

42 . The vacuum insulating panel of claim 1 , wherein the first and second substrates comprise tempered glass substrates or heat strengthened glass substrates.

43 . The vacuum insulating panel of claim 1 , wherein the seal is a hermetic edge seal of the vacuum insulating panel.

44 . The vacuum insulating panel of claim 1 , wherein the panel is configured for use in a window.

45 . The vacuum insulating panel of claim 1 , wherein tellurium oxide has the highest wt. % of any metal oxide in the first seal layer.

46 . A vacuum insulating panel comprising:

a first substrate;

a second substrate;

a plurality of spacers provided in a gap between at least the first and second substrates, wherein the gap is at pressure less than atmospheric pressure;

a seal provided at least partially between at least the first and second substrates, the seal comprising a first seal layer, a second seal layer, and a third seal layer;

wherein the second and third seal layers each comprise boron oxide and/or bismuth oxide; and

wherein the first seal layer comprises from about 20-80 wt. % tellurium oxide, the tellurium oxide comprising TeO 4 and TeO 3 , and wherein the first seal layer comprises more TeO 3 than TeO 4 by wt. %.

47 . The vacuum insulating panel of claim 46 , wherein for at least one location of the seal, the first seal layer has a first thickness, the second seal layer has a second thickness, and the third seal layer has a third thickness; and wherein the first thickness is greater than the second thickness and less than the third thickness.

48 . The vacuum insulating panel of claim 46 , wherein at least one of the second and third seal layers comprises from about 1-40 mol % bismuth and from about 3-40 mol % boron on an elemental basis, and comprises more boron than bismuth on an elemental basis in terms of mol %.

49 . The vacuum insulating panel of claim 46 , wherein the first seal layer comprises from about 40-70 wt. % tellurium oxide.

50 . The vacuum insulating panel of claim 46 , wherein from about 60-95% of Te in the first seal layer is in a form of TeO 3 .

51 . The vacuum insulating panel of claim 46 , wherein from about 5-25% of Te in the first seal layer is in a form of TeO 4 .

52 . The vacuum insulating panel of claim 46 , wherein the tellurium oxide further comprises TeO 3+1 , and wherein the first seal layer comprises more TeO 3 than TeO 3+1 by wt. %.

53 . The vacuum insulating panel of claim 46 , wherein the first seal layer further comprises vanadium oxide, and wherein the first seal layer by wt. % comprises more tellurium oxide than vanadium oxide.

54 . The vacuum insulating panel of claim 53 , wherein the vanadium oxide comprises VO 2 and V 2 O 5 , and wherein more V in the first seal layer is in a form of VO 2 than V 2 O 5 .

55 . The vacuum insulating panel of claim 54 , wherein from about 50-75% of the V in the first seal layer is in a form of VO 2 and from about 5-45% of the V in the first seal layer is in a form of V 2 O 5 .

56 . The vacuum insulating panel of claim 54 , wherein a ratio V 2 O 5 :VO 2 in the first seal layer is from about 0.20 to 0.80.

57 . The vacuum insulating panel of claim 46 , wherein at least one of the second and third seal layers comprises from about 1-40 mol % bismuth and comprises at least three times more boron than bismuth on an elemental basis in terms of mol %.

58 . The vacuum insulating panel of claim 46 , wherein tellurium oxide has the highest wt. % of any metal oxide in the first seal layer.

Assignments (3)
SECURITY INTEREST Recorded Feb 19, 2026
From: LUXWALL, INC.
To: FIRST-CITIZENS BANK & TRUST COMPANY
Reel/Frame 074938/0702 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2024
From: THOMSEN, SCOTT V.
To: LUXWALL, INC.
Reel/Frame 066304/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2023
From: THOMSEN, SCOTT V.
To: LUXWALL, INC.
Reel/Frame 065747/0803 →
Continuity (6)
Provisional Application 63540729 · Sep 27, 2023
Provisional Application 63427661 · Nov 23, 2022
Provisional Application 63427657 · Nov 23, 2022
Provisional Application 63427670 · Nov 23, 2022
Provisional Application 63427645 · Nov 23, 2022
Related Publication 20240167324A1 · May 23, 2024
References Cited (139)
US 3433611A · Saunders et al. · 1969 [cited by applicant]
US 4040808A · Kahn et al. · 1977 [cited by applicant]
US 5124185A · Kerr et al. · 1992 [cited by applicant]
US 5489321A · Tracy et al. · 1996 [cited by applicant]
US 5657607A · Collins · 1997 [cited by applicant]
US 5664395A · Collins · 1997 [cited by applicant]
US 5935702A · Macquart et al. · 1999 [cited by applicant]
US 6042934A · Guiselin et al. · 2000 [cited by applicant]
US 6106798A · Kambe · 2000 [cited by examiner]
US 6322881B1 · Boire et al. · 2001 [cited by applicant]
US 6352749B1 · Aggas · 2002 [cited by applicant]
US 6533632B1 · Dynka · 2003 [cited by applicant]
US 6558494B1 · Wang et al. · 2003 [cited by applicant]
US 6641689B1 · Aggas · 2003 [cited by applicant]
US 6946171B1 · Aggas · 2005 [cited by applicant]
US 7045181B2 · Yoshizawa et al. · 2006 [cited by applicant]
US 7115308B2 · Amari et al. · 2006 [cited by applicant]
US 7314668B2 · Lingle et al. · 2008 [cited by applicant]
US 7342716B2 · Hartig · 2008 [cited by applicant]
US 7407423B2 · Aitken et al. · 2008 [cited by applicant]
US 7425166B2 · Burt et al. · 2008 [cited by applicant]
US 7560402B2 · Thomsen · 2009 [cited by applicant]
US 7632571B2 · Hartig et al. · 2009 [cited by applicant]
US 7858193B2 · Ihlo et al. · 2010 [cited by applicant]
US 7910229B2 · Medwick et al. · 2011 [cited by applicant]
US 7919157B2 · Cooper · 2011 [cited by applicant]
US 8490434B2 · Watanabe et al. · 2013 [cited by applicant]
US 8500933B2 · Cooper · 2013 [cited by applicant]
US 8590343B2 · Wang · 2013 [cited by applicant]
US 8821999B2 · Grzybowski et al. · 2014 [cited by applicant]
US 8833105B2 · Dennis et al. · 2014 [cited by applicant]
US 8951617B2 · Reymond et al. · 2015 [cited by applicant]
US 9169155B2 · Dennis et al. · 2015 [cited by applicant]
US 9215760B2 · Fischer et al. · 2015 [cited by applicant]
US 9290984B2 · Hogan et al. · 2016 [cited by applicant]
US 9388628B2 · Petrmichl et al. · 2016 [cited by applicant]
US 9428952B2 · Dennis et al. · 2016 [cited by applicant]
US 9441416B2 · Veerasamy et al. · 2016 [cited by applicant]
US 9458052B2 · Dennis · 2016 [cited by applicant]
US 9593527B2 · Hogan et al. · 2017 [cited by applicant]
US 9752375B2 · Jones · 2017 [cited by applicant]
US 9776910B2 · Dennis · 2017 [cited by applicant]
US 9822580B2 · Cooper et al. · 2017 [cited by applicant]
US 9908811B2 · Gross et al. · 2018 [cited by applicant]
US 10011525B2 · Logunov et al. · 2018 [cited by applicant]
US 10017417B2 · Dejneka et al. · 2018 [cited by applicant]
US 10077204B2 · Maschmeyer et al. · 2018 [cited by applicant]
US 10087676B2 · Dennis · 2018 [cited by applicant]
US 10107028B2 · Dennis · 2018 [cited by applicant]
US 10125045B2 · Dennis · 2018 [cited by applicant]
US 10153389B2 · Godeke et al. · 2018 [cited by applicant]
US 10267085B2 · Dennis et al. · 2019 [cited by applicant]
US 10280680B2 · Veerasamy et al. · 2019 [cited by applicant]
US 10421684B2 · Hogan et al. · 2019 [cited by applicant]
US 10435938B2 · Dennis et al. · 2019 [cited by applicant]
US 10465433B2 · Hogan et al. · 2019 [cited by applicant]
US 10611664B2 · Lezzi et al. · 2020 [cited by applicant]
US 10731403B2 · Krisko et al. · 2020 [cited by applicant]
US 10745317B2 · Godeke et al. · 2020 [cited by applicant]
US 10752535B2 · Dennis · 2020 [cited by applicant]
US 10759693B2 · Xu et al. · 2020 [cited by applicant]
US 10829984B2 · Dennis et al. · 2020 [cited by applicant]
US 10858880B2 · Dennis · 2020 [cited by applicant]
US 10954160B2 · Streltsov et al. · 2021 [cited by applicant]
US 11014847B2 · Dennis · 2021 [cited by applicant]
US 11028009B2 · Dennis · 2021 [cited by applicant]
US 11028637B2 · Abe et al. · 2021 [cited by applicant]
US 11124450B2 · Miki et al. · 2021 [cited by applicant]
US 11285703B2 · Jorgensen et al. · 2022 [cited by applicant]
US 12338677B2 · Thomsen et al. · 2025 [cited by applicant]
US 12365164B2 · Thomsen et al. · 2025 [cited by applicant]
US 12377639B2 · Thomsen · 2025 [cited by applicant]
US 12377640B2 · Thomsen et al. · 2025 [cited by applicant]
US 20090155500A1 · Cooper et al. · 2009 [cited by applicant]
US 20090155555A1 · Botelho et al. · 2009 [cited by applicant]
US 20120131959A1 · No et al. · 2012 [cited by applicant]
US 20120202049A1 · Valladeau et al. · 2012 [cited by applicant]
US 20130101759A1 · Jones · 2013 [cited by applicant]
US 20140037870A1 · Petrmichl · 2014 [cited by examiner]
US 20150218032A1 · Hogan · 2015 [cited by examiner]
US 20150218042A1 · Hogan · 2015 [cited by examiner]
US 20160297706A1 · Naito et al. · 2016 [cited by applicant]
US 20180238104A1 · Mikkelsen et al. · 2018 [cited by applicant]
US 20190035951A1 · Lee et al. · 2019 [cited by applicant]
US 20190106931A1 · Krisko et al. · 2019 [cited by applicant]
US 20190177208A1 · Gödeke · 2019 [cited by examiner]
US 20200392036A1 · Naito et al. · 2020 [cited by applicant]
US 20210254395A1 · Nielsen et al. · 2021 [cited by applicant]
US 20210262279A1 · Hedeby et al. · 2021 [cited by applicant]
US 20210270084A1 · Abe et al. · 2021 [cited by applicant]
US 20220025697A1 · Nielsen · 2022 [cited by applicant]
US 20220074258A1 · Andersen et al. · 2022 [cited by applicant]
US 20220235601A1 · Krisko et al. · 2022 [cited by applicant]
EP 1563952B1 · 2013 [cited by applicant]
WO WO2017019837A1 · 2017 [cited by applicant]
Wang et al. “Tellurite Glass and its Applicaitons in Lasers”. Published Apr. 8, 2020. (Year: 2020). [cited by examiner]
Tellurite Glass and Its Application in Lasers, Wang et al. (2020). [cited by applicant]
PCT International Search Report dated Dec. 13, 2023 for PCT/US2023/077851. [cited by applicant]
PCT Written Opinion dated Dec. 13, 2023 for PCT/US2023/077851. [cited by applicant]
Li et al., “Glass forming region and bonding mechanism of low melting V2O5TeO2Bi2O3 glass applied in vacuum glazing sealing”, Mar. 9, 2021, pp. 1-17, American Ceramic Society. [cited by applicant]
Marple et al., “Structure of TeO2 Glass: Results from 2D Te NMR Spectroscopy”, Dept. of Materials Science & Engineering, Univ. of Calif. at Davis (2019). [cited by applicant]
Modeling of Vacuum Insulating Glazing, Published by ASHRAE; by Hart et al.; 7pgs. (Dec. 2013). [cited by applicant]
Laser Assisted Frit Sealing for High Thermal Expansion Glasses; [cited by applicant]
Vacuum Insulated Glazing under the Influence of a Thermal Load; 2 pgs; by Aronen et al. (Jul. 2020). [cited by applicant]
Edge Conduction in Vacuum Glazing; Presented at Thermal Performance of the ExteriorBuildings VI, Clearwater Beach, FL, Dec. 4-8, 1995, by Simko et al.; 14pgs (Dec. 1995). [cited by applicant]
U.S. Appl. No. 18/376,897, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/376,473, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/376,900, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/376,907, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/376,479, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/376,483, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/376,490, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/376,495, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/376,926, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/376,914, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/376,503, filed Oct. 4, 2023. [cited by applicant]
U.S. Appl. No. 18/379,275, filed Oct. 12, 2023. [cited by applicant]
U.S. Appl. No. 18/379,285, filed Oct. 12, 2023. [cited by applicant]
U.S. Appl. No. 18/376,932, filed Oct. 5, 2023. [cited by applicant]
U.S. Appl. No. 18/377,328, filed Oct. 6, 2023. [cited by applicant]
U.S. Appl. No. 18/377,335, filed Oct. 6, 2023. [cited by applicant]
U.S. Appl. No. 18/517,044, filed Nov. 22, 2023. [cited by applicant]
U.S. Appl. No. 18/513,944, filed Nov. 20, 2023. [cited by applicant]
U.S. Appl. No. 18/510,777, filed Nov. 16, 2023. [cited by applicant]
U.S. Appl. No. 18/616,420, filed Mar. 26, 2024. [cited by applicant]
U.S. Appl. No. 18/636,472, filed Apr. 16, 2024. [cited by applicant]
U.S. Appl. No. 18/632,364, filed Apr. 11, 2024. [cited by applicant]
U.S. Appl. No. 18/617,736, filed Mar. 27, 2024. [cited by applicant]
U.S. Appl. No. 18/619,266, filed Mar. 28, 2024. [cited by applicant]
U.S. Appl. No. 18/623,109, filed Apr. 1, 2024. [cited by applicant]
U.S. Appl. No. 18/626,359, filed Apr. 4, 2024. [cited by applicant]
U.S. Appl. No. 18/633,733, filed Apr. 12, 2024. [cited by applicant]
U.S. Appl. No. 18/629,996, filed Apr. 9, 2024. [cited by applicant]
U.S. Appl. No. 18/650,204, filed Apr. 30, 2024. [cited by applicant]
U.S. Appl. No. 18/654,040, filed May 3, 2024. [cited by applicant]
U.S. Appl. No. 18/664,462, filed May 15, 2024. [cited by applicant]
U.S. Appl. No. 18/668,374, filed May 20, 2024. [cited by applicant]
Moawad et al. “Electrical Conductivity of Silver Vanadium Tellurite Glasses”, J. Am. Ceram. Soc., 85 [11] 2655-59 (2002), 5 pages. [cited by applicant]
3 [cited by applicant]
Cited By (2)
US 12,612,821 US 12,715,199