RFID device
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
1. A transaction card comprising:
a metal card body having a length and a width that define opposite faces having a thickness between the opposite faces, an outer periphery that defines an edge of the metal card body, an opening in the metal card body, and a discontinuity in the metal card body edge extending from the opening;
a payment module having a first antenna;
a booster antenna disposed in the opening and configured to inductively couple to the first antenna; and
a non-metal molding material disposed in the opening in contact with the payment module and extending through the discontinuity to the edge of the metal card body, wherein the payment module is secured in a pocket defined in the molding material, and wherein the pocket includes a first portion having a first geometry and a second portion having a second geometry.
2. The transaction card of claim 1 , wherein the first geometry has a first dimension along the width of the card, and the second geometry has a second dimension along the width of the card.
3. The transaction card of claim 2 , wherein the discontinuity in the metal card body edge has a third dimension along the width of the card that is different from the first dimension and the second dimension.
4. A process for manufacturing a transaction card comprising the steps of:
(a) providing a metal card body having a length and a width that define opposite faces having a thickness between the opposite faces, an outer periphery that defines an edge of the metal card body, an opening in the metal card body, and a discontinuity in the metal card body edge extending from the opening;
(b) providing a payment module having a first antenna;
(c) disposing a non-conductive molding material about a booster antenna to completely encapsulate the booster antenna, wherein the booster antenna is configured to inductively couple to the first antenna, and then after performance of step (c);
(d) inserting the completely encapsulated booster antenna into the opening;
(e) forming a pocket in the non-conductive molding material, the pocket including a first portion having a first geometry and a second portion having a second geometry
(f) inserting the payment module into the pocket.
5. The process of claim 4 , wherein the first geometry has a first dimension along the width of the card, and the second geometry has a second dimension along the width of the card.
6. The process of claim 5 , wherein the discontinuity in the metal card body edge has a third dimension along the width of the card that is different from the first dimension and the second dimension.
7. The process of claim 4 , wherein the booster antenna is disposed in a substrate.
8. The process of claim 7 , further comprising disposing at least one additional layer over the non-conductive molding material.
9. The process of claim 8 , further comprising laminating the at least one additional layer over or under the substrate.
10. The process of claim 4 , wherein steps (e) and (f) are performed after step (d).
11. The process of claim 4 , further comprising disposing the non-conductive molding material in the discontinuity.