IP Library › Granted Patent US 12,219,867
Granted Patent B2
US 12,219,867 · App. 18/388,899 · Granted Feb 4, 2025

Display device and manufacturing method thereof

Inventors: Daiki Nakamura (Kanagawa, JP); Kazuhiko Fujita (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H10K77/111H10K50/8426
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Quick Facts
Patent No.
US 12,219,867
App. No.
18/388,899
Granted
Feb 4, 2025
Kind
B2
Abstract

When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an environmental change such as temperature due to difference in linear expansion coefficient before and after a thermal shock. A buffer plate that is thin enough to be bent is provided between the base film used in a flexible display panel and the resin member. With the use of heat dissipation effect and heat equalization effect of the buffer plate, a structure around the panel capable of resisting the environmental change can be provided.

Claims (44)

1. A display device comprising:

a member having a curved surface;

a buffer plate over the curved surface of the member; and

a display panel overlapping with the curved surface of the member with the buffer plate therebetween,

wherein the member has regions with different thicknesses, and

wherein the buffer plate comprises a metal.

2. The display device according to claim 1 ,

wherein the member has a first surface opposite to the curved surface, and

wherein the first surface has a flat surface.

3. The display device according to claim 2 ,

wherein the member has a second surface between the first surface and the curved surface and a third surface opposite to the second surface, and

wherein an area of the second surface is larger than an area of the third surface.

4. The display device according to claim 1 , further comprising a guide portion fixed to the member.

5. The display device according to claim 1 , wherein the metal comprises stainless steel, aluminum, copper, silver, gold, iron, titanium, molybdenum, tungsten, or platinum.

6. The display device according to claim 1 , further comprising a printed circuit board,

wherein the buffer plate and the member are between the printed circuit board and the display panel, and

wherein the printed circuit board is electrically connected to the display panel with a flexible printed circuit board therebetween.

7. The display device according to claim 1 ,

wherein the display panel comprises an organic light-emitting element over a film comprising a first organic resin material, and

wherein the member comprises a second organic resin material having a different linear expansion coefficient from that of the first organic resin material.

8. The display device according to claim 7 , wherein the second organic resin material is any one of acrylic, polypropylene, polyvinyl chloride, polycarbonate, and polyamide.

9. A display device comprising:

a member having a curved surface;

a buffer plate over the curved surface of the member;

a display panel overlapping with the curved surface of the member with the buffer plate therebetween; and

a flexible printed circuit board over a display surface side of the display panel,

wherein the flexible printed circuit board is bent toward a rear side of the display panel with the member therebetween,

wherein the member has regions with different thicknesses, and

wherein the buffer plate comprises a metal.

10. The display device according to claim 9 ,

wherein the member has a first surface opposite to the curved surface, and

wherein the first surface has a flat surface.

11. The display device according to claim 10 ,

wherein the member has a second surface between the first surface and the curved surface and a third surface opposite to the second surface, and

wherein an area of the second surface is larger than an area of the third surface.

12. The display device according to claim 9 , further comprising a guide portion fixed to the member.

13. The display device according to claim 9 , wherein the metal comprises stainless steel, aluminum, copper, silver, gold, iron, titanium, molybdenum, tungsten, or platinum.

14. The display device according to claim 9 , further comprising a printed circuit board,

wherein the buffer plate and the member are between the printed circuit board and the display panel, and

wherein the printed circuit board is electrically connected to the display panel with the flexible printed circuit board therebetween.

15. The display device according to claim 9 ,

wherein the display panel comprises an organic light-emitting element over a film comprising a first organic resin material, and

wherein the member comprises a second organic resin material having a different linear expansion coefficient from that of the first organic resin material.

16. The display device according to claim 15 , wherein the second organic resin material is any one of acrylic, polypropylene, polyvinyl chloride, polycarbonate, and polyamide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2023
From: NAKAMURA, DAIKI; FUJITA, KAZUHIKO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 065538/0439 →
Priority Claims (1)
JP 2017-070206 · Mar 31, 2017 · national
Continuity (3)
Continuation 17370752 · Jul 8, 2021
Continuation 16497839
Related Publication 20240155933A1 · May 9, 2024
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