Substrate support with real time force and film stress control
Embodiments of the present disclosure provide a method for processing a substrate disposed on a substrate support. The method includes chucking a substrate to a substrate support, monitoring a chucking force on the substrate with a sensor disposed in a backside gas hole of the substrate support, wherein the sensor comprises a sensor assembly disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole and flowing a gas through the backside gas hole past the sensor.
1. A method for processing a substrate disposed on a substrate support, comprising:
chucking the substrate to the substrate support;
monitoring a chucking force on the substrate with a sensor assembly disposed in a backside gas hole of the substrate support, wherein:
the sensor assembly is disposed in the backside gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on a workpiece support surface;
the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the backside gas hole;
the sensor assembly has a sensor housing and a sensor, the sensor housing having a split plate configured to be disposed around at least a portion of the sensor;
the passages include gas passages formed in the split plate; and
flowing a gas through the backside gas hole past the sensor.
2. The method of claim 1 , further comprising:
measuring with the sensor a deflection of the substrate disposed on the substrate support.
3. The method of claim 2 , further comprising:
based on the measured deflection of the substrate, adjusting the chucking force on the substrate.
4. The method of claim 2 , wherein adjusting the chucking force on the substrate comprises:
adjusting a clamping voltage.
5. The method of claim 3 , wherein adjusting the chucking force on the substrate comprises:
adjusting a clamping pressure.
6. The method of claim 2 , wherein the deflection is measured in real-time to maintain a target clamping force on the substrate.
7. The method of claim 1 , further comprising:
performing a process on the chucked substrate.
8. A method for adjusting a clamping force on a substrate disposed on a substrate support, comprising:
monitoring a chucking force on the substrate disposed on the substrate support, wherein the chucking force is monitored with a sensor assembly disposed in a backside gas hole of the substrate support, wherein:
the sensor assembly is disposed in the backside gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on a workpiece support surface;
the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the backside gas hole;
the sensor assembly has a sensor housing and a sensor, the sensor housing having a split plate configured to be disposed around at least a portion of the sensor; and
the passages include gas passages formed in the split plate;
measuring with the sensor a deflection in real-time of the substrate disposed on the substrate support; and
based on the measured deflection of the substrate, adjusting the chucking force on the substrate.
9. The method of claim 8 , wherein adjusting the chucking force on the substrate comprises:
adjusting the clamping force by adjusting a clamping voltage.
10. The method of claim 8 , wherein adjusting the chucking force on the substrate comprises:
adjusting the clamping force by adjusting a clamping vacuum pressure.
11. A method for processing a substrate disposed on a substrate support, comprising:
chucking the substrate to the substrate support; and
monitoring a chucking force on the substrate with a sensor assembly disposed in a backside gas hole of the substrate support, wherein:
the sensor assembly is disposed in the backside gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on a workpiece support surface;
the sensor assembly has passages that permit fluid to pass through the sensor assembly when positioned in the backside gas hole;
the sensor assembly has a sensor housing and a sensor, the sensor housing having a split plate configured to be disposed around at least a portion of the sensor; and
the passages include gas passages formed in the split plate.
12. The method of claim 11 , further comprising:
flowing a gas through the backside gas hole past the sensor.
13. The method of claim 11 , further comprising:
measuring with the sensor a deflection of the substrate disposed on the substrate support.
14. The method of claim 13 , further comprising:
based on the measured deflection of the substrate, adjusting the chucking force on the substrate.
15. The method of claim 14 , wherein adjusting the chucking force on the substrate comprises:
adjusting a clamping voltage.
16. The method of claim 14 , wherein adjusting the chucking force on the substrate comprises:
adjusting a clamping pressure.
17. The method of claim 13 , wherein the deflection is measured in real-time to maintain a target clamping force on the substrate.