Electronic device and method for manufacturing the same
A method includes providing a first substrate which has an active layer, a metal layer, a passivation layer disposed on the metal layer, a first patterned metal layer passing through the passivation layer to electrically connected to the active layer, an insulating layer disposed on the passivation layer, and a second patterned metal layer passing through the insulating layer to electrically connected to the first patterned metal layer. A part of the metal layer does not serve as a portion of a thin film transistor, but serves as a portion of a gate line. The method includes providing a second substrate supporting a plurality of elements, transferring at least one of the plurality of elements from the second substrate to the second patterned metal layer of the first substrate, and fixing the at least one of the plurality of elements to the first substrate.
1 . A method for manufacturing an electronic device comprising:
providing a first substrate, wherein the first substrate has an active layer, a metal layer, a passivation layer disposed on the metal layer, a first patterned metal layer passing through the passivation layer to electrically connected to the active layer, an insulating layer disposed on the passivation layer, and a second patterned metal layer passing through the insulating layer to electrically connected to the first patterned metal layer, wherein a part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line;
providing a second substrate supporting a plurality of elements;
transferring at least one of the plurality of elements from the second substrate to the second patterned metal layer of the first substrate;
fixing the at least one of the plurality of elements to the first substrate; and
inspecting the at least one of the plurality of elements on the first substrate.
2 . The method according to claim 1 , further comprising performing an inspection on the second substrate.
3 . The method according to claim 1 , wherein the inspecting comprises electroluminescence inspecting or photoluminescence inspecting.
4 . The method according to claim 1 , further comprising filling an insulator between the at least one of the plurality of elements and the second patterned metal layer.