IP Library Granted Patent US 12,270,207
Granted Patent B2
US 12,270,207 · App. 18/454,179 · Granted Apr 8, 2025

Sound damping wallboard and method of constructing a sound damping wallboard

Inventors: Stephen A. Cusa (Downingtown, PA); Michael N. Blades (Indian Land, SC); Richard P. Weir (Indian Trail, NC); John W. Mixson (Charlotte, NC)
Assignee: Gold Bond Building Products, LLC
E04F13/0867E04B1/86E04B1/99E04F13/0875E04F13/14E04B2001/8461E04F2290/043
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Quick Facts
Patent No.
US 12,270,207
App. No.
18/454,179
Granted
Apr 8, 2025
Kind
B2
Abstract

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard comprises a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a sound damping layer disposed at the gypsum layer inner surface for installation between the gypsum layer and an installed wallboard and having a sound damping layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, and a second encasing layer disposed at the sound damping layer inner surface.

Claims (24)

1. A method for forming a sound damping wallboard, comprising: providing a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, the gypsum layer having a first encasing layer disposed at the gypsum layer outer surface and a third encasing layer disposed at the gypsum layer inner surface; applying a sound damping layer to the third encasing layer such that the sound damping layer includes a sound damping layer inner surface opposite the gypsum layer inner surface; and providing a second encasing layer at the sound damping layer inner surface, wherein the second encasing layer is formed of a material comprising paper, fiberglass, foil, or a polymer; wherein, when attached to an installed wallboard, the sound damping layer is disposed between the gypsum layer and the installed wallboard.

2. The method of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about 5/16 inch or less.

3. The method of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about ¼ inch or less.

4. The method of claim 1 , wherein the sound damping layer comprises a polymer.

5. The method of claim 1 , wherein the sound damping layer comprises an elastomer.

6. The method of claim 5 , wherein the elastomer comprises an acrylic polymer.

7. The method of claim 5 , wherein the elastomer comprises an acrylic copolymer.

8. The method of claim 1 , wherein the sound damping layer comprises an adhesive.

9. The method of claim 1 , wherein the second encasing layer is a curable coating.

10. The method of claim 9 , wherein the curable coating is applied to the sound damping layer inner surface and then cured to form the second encasing layer.

11. The method of claim 9 , wherein the curable coating is applied to the sound damping layer inner surface by spraying.

12. The method of claim 1 , wherein the first encasing layer comprises paper.

13. The method of claim 1 , wherein the second encasing layer comprises paper.

14. The method of claim 1 , wherein the third encasing layer comprises paper.

15. The method of claim 1 , wherein the first encasing layer and the third encasing layer comprise paper.

16. The method of claim 1 , wherein at least one of the first encasing layer, the second encasing layer, or the third encasing layer comprise a plurality of sheets.

17. The method of claim 1 , wherein the first encasing layer and the third encasing layer comprise a plurality of sheets.

18. The method of claim 1 , wherein the sound damping wallboard further comprises a first edge encasing layer.

19. The method of claim 18 , wherein the sound damping wallboard further comprises a second edge encasing layer.

20. The method of claim 1 , wherein the method further comprises:

providing the first encasing layer;

depositing a gypsum slurry on the first encasing layer to form the gypsum layer; and

providing the third encasing layer to the gypsum layer inner surface before applying the sound damping layer to the third encasing layer.

21. The method of claim 1 , wherein the gypsum layer is the only gypsum layer of the sound damping wallboard.

Assignments (5)
SECURITY INTEREST Recorded Nov 3, 2025
From: GOLD BOND BUILDING PRODUCTS, LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 073476/0358 →
SECURITY INTEREST Recorded Sep 4, 2025
From: GOLD BOND BUILDING PRODUCTS, LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 072813/0095 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2023
From: NATIONAL GYPSUM PROPERTIES, LLC
To: PROFORM FINISHING PRODUCTS, LLC
Reel/Frame 064677/0095 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2023
From: CUSA, STEPHEN A.; BLADES, MICHAEL N.; WEIR, RICHARD P.; MIXSON, JOHN W.
To: NATIONAL GYPSUM PROPERTIES, LLC
Reel/Frame 064677/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2023
From: PROFORM FINISHING PRODUCTS, LLC
To: GOLD BOND BUILDING PRODUCTS, LLC
Reel/Frame 064677/0267 →
Continuity (3)
Continuation 15017362 · Feb 5, 2016
Provisional Application 62112560 · Feb 5, 2015
Related Publication 20230399855A1 · Dec 14, 2023
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