IP Library Granted Patent US 12,593,497
Granted Patent B2
US 12,593,497 · App. 18/473,098 · Granted Mar 31, 2026

Integrated circuit in hybrid row height structure

Inventors: Jerry Chang-Jui Kao (Taipei, TW); Hui-Zhong Zhuang (Kaohsiung, TW); Li-Chung Hsu (Hsinchu, TW); Sung-Yen Yeh (Pingtung County, TW); Yung-Chen Chien (Kaohsiung, TW); Jung-Chan Yang (Taoyuan, TW); Tzu-Ying Lin (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H10D84/038H01L21/4828H01L23/50H01L23/535H10D88/01
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Quick Facts
Patent No.
US 12,593,497
App. No.
18/473,098
Granted
Mar 31, 2026
Kind
B2
Abstract

An integrated circuit includes a first cell and a second cell. The first cell has a first height along a first direction. The second cell has a second height shorter than the first height along the first direction. A transistor of the first cell and a transistor of the second cell share a first active area, and a first boundary of the first cell, a first boundary of the second cell, a second boundary of the first cell and a second boundary of the second cell are arranged in order along the first direction.

Claims (67)

1 . An integrated circuit, comprising:

a first cell having a first height along a first direction; and

a second cell having a second height shorter than the first height along the first direction,

wherein a transistor of the first cell and a transistor of the second cell share a first active area,

a first boundary of the first cell, a first boundary of the second cell, a second boundary of the first cell and a second boundary of the second cell are arranged in order along the first direction,

the first cell is at least formed by the first active area and a second active area,

the second cell is at least formed by the first active area and a third active area,

the first active area, the second active area and the third active area are separated from each other along the first direction,

the second active area is wider than the first active area along the first direction, and

the third active area is wider than the first active area along the first direction.

2 . The integrated circuit of claim 1 , wherein the first cell is at least formed by the first active area and a fourth active area,

the first active area and the fourth active area are separated from each other along the first direction, and

the first boundary of the second cell is located between the first active area and the fourth active area along the first direction.

3 . The integrated circuit of claim 1 , wherein the second cell is further formed by a fourth active area located between the first active area and the third active area along the first direction,

each of the first active area and the fourth active area has a first conductive type, and

each of the second active area and the third active area has a second conductive type different from the first conductive type.

4 . The integrated circuit of claim 3 , further comprising:

a third cell located between the first cell and the second cell along a second direction different from the first direction,

wherein the third cell is formed by at least the first active area, the second active area and the third active area.

5 . The integrated circuit of claim 4 , wherein the third cell is further formed by a fifth active area separated from the third active area along the first direction,

wherein the second boundary of the second cell is located between the fifth active area and the third active area.

6 . The integrated circuit of claim 5 , wherein the fifth active area has the second conductive type and is narrower than the fourth active area along the first direction.

7 . The integrated circuit of claim 5 , further comprising:

a fourth cell located between the third cell and the second cell along the second direction,

wherein the fourth cell is formed by the fifth active area, the fourth active area and the third active area, and

a boundary of the fourth cell is located between the fourth active area and the first active area.

8 . The integrated circuit of claim 1 , further comprising:

a third cell located between the first cell and the second cell along a second direction different from the first direction.

9 . An integrated circuit, comprising:

a first cell having a height along a first direction; and

a second cell having the height along the first direction,

wherein at least one transistor of the first cell and at least one transistor of the second cell share each of a first active area and a second active area,

a first boundary of the first cell, a first boundary of the second cell, a second boundary of the first cell and a second boundary of the second cell are arranged in order along the first direction,

the first cell is formed by the first active area, the second active area and a third active area,

the second cell is formed by the first active area, the second active area and a fourth active area, and

the third active area, the second active area, the first active area and the fourth active area are separated from each other and arranged in order along the first direction.

10 . The integrated circuit of claim 2 , wherein

each of the first active area and the second active area is wider than the third active area, and

each of the first active area and the second active area is wider than the fourth active area.

11 . The integrated circuit of claim 9 , further comprising:

a third cell formed by the first active area, the second active area, the third active area and the fourth active area.

12 . The integrated circuit of claim 11 , further comprising:

a fourth cell formed by at least the fourth active area, a fifth active area and a sixth active area separated from each other,

wherein each of the fifth active area, the sixth active area, the third active area and the second active area has a first conductive type, and

each of the fourth active area and the first active area has a second conductive type different from the first conductive type.

13 . The integrated circuit of claim 12 , wherein the fourth cell, the third cell, the first cell and the second cell are separated from each other and are arranged in order along a second direction different from the first direction.

14 . The integrated circuit of claim 9 , further comprising:

a third cell separated from the first cell and the second cell along a second direction different from the first direction.

15 . An integrated circuit, comprising:

a first cell comprising:

a first circuit arranged in a first cell row having a first row height, the first circuit comprising at least one first transistor having a two-fins active area structure;

a second circuit arranged in a portion of a second cell row, the second circuit comprising at least one second transistor having a first one-fin active area structure; and

a third circuit arranged in a portion of a third cell row, the third circuit comprising at least one third transistor having a second one-fin active area structure; and

a second cell separated from the first cell, and sharing the first one-fin active area structure with the first cell,

wherein the portion of the second cell row has a second row height that is smaller than the first row height, and the portion of the third cell row has a third row height that is smaller than the first row height,

wherein the first cell has a cell height that equals to the first row height plus the second row height and the third row height.

16 . The integrated circuit of claim 15 , wherein the second row height is equal to the third row height.

17 . The integrated circuit of claim 15 , wherein the portion of the second cell row and the portion of the third cell row are arranged at opposite sides of the first cell row.

18 . The integrated circuit of claim 15 , wherein

the at least one second transistor is of a first conductivity type, and the at least one third transistor is of a second conductivity type that is different from the first conductivity type.

19 . The integrated circuit of claim 15 , wherein the at least one first transistor comprises:

at least one fourth transistor; and

at least one fifth transistor;

wherein the at least one fourth transistor is of a first conductivity type, and the at least one fifth transistor is of a second conductivity type that is different from the first conductivity type.

20 . The integrated circuit of claim 19 , wherein

the at least one second transistor is of the first conductivity type and coupled to the at least one fourth transistor, and

the at least one third transistor is of the second conductivity type and coupled to the at least one fifth transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2023
From: KAO, JERRY CHANG-JUI; ZHUANG, HUI-ZHONG; HSU, LI-CHUNG; YEH, SUNG-YEN; CHIEN, YUNG-CHEN; YANG, JUNG-CHAN; LIN, TZU-YING
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 065014/0731 →
Continuity (3)
Division 17831108 · Jun 2, 2022
Continuation 16882103 · May 22, 2020
Related Publication 20240030069A1 · Jan 25, 2024
References Cited (45)
US 5666288A · Jones et al. · 1997 [cited by applicant]
US 6505323B1 · Lipton et al. · 2003 [cited by applicant]
US 8610241B1 · Hu et al. · 2013 [cited by applicant]
US 9263257B2 · Chien et al. · 2016 [cited by applicant]
US 9502351B1 · Sahu · 2016 [cited by applicant]
US 9748236B1 · Chang et al. · 2017 [cited by applicant]
US 9793174B1 · Huang et al. · 2017 [cited by applicant]
US 11011545B2 · Guo et al. · 2021 [cited by applicant]
US 20070290192A1 · Rotondaro · 2007 [cited by examiner]
US 20090094568A1 · Shukla et al. · 2009 [cited by applicant]
US 20090294868A1 · Griebenow · 2009 [cited by examiner]
US 20130328162A1 · Hu et al. · 2013 [cited by applicant]
US 20140197463A1 · Gan et al. · 2014 [cited by applicant]
US 20140363960A1 · Kim et al. · 2014 [cited by applicant]
US 20150048424A1 · Tien et al. · 2015 [cited by applicant]
US 20150102426A1 · Flachowsky et al. · 2015 [cited by applicant]
US 20170116365A1 · Cheng · 2017 [cited by applicant]
US 20170373090A1 · Correale, Jr. et al. · 2017 [cited by applicant]
US 20180151451A1 · Li · 2018 [cited by applicant]
US 20190065650A1 · Pelloie · 2019 [cited by applicant]
US 20190148407A1 · Guo · 2019 [cited by examiner]
US 20190164949A1 · Sio et al. · 2019 [cited by applicant]
US 20190287967A1 · Liaw · 2019 [cited by applicant]
US 20190355719A1 · Maeda et al. · 2019 [cited by applicant]
US 20200019667A1 · Lin et al. · 2020 [cited by applicant]
US 20200051977A1 · Lim · 2020 [cited by examiner]
US 20200057830A1 · Azmat et al. · 2020 [cited by applicant]
US 20200058681A1 · Lai · 2020 [cited by examiner]
US 20200134119A1 · Sio · 2020 [cited by applicant]
US 20200402968A1 · Zhuang · 2020 [cited by examiner]
US 20210117603A1 · Jiang et al. · 2021 [cited by applicant]
CN 103455654A · 2013 [cited by applicant]
CN 110046369A · 2019 [cited by applicant]
CN 110660800A · 2020 [cited by applicant]
CN 110828450A · 2020 [cited by applicant]
CN 111129000A · 2020 [cited by applicant]
DE 102019113506A1 · 2020 [cited by applicant]
DE 102020111749A1 · 2020 [cited by applicant]
KR 20170104043A · 2017 [cited by applicant]
KR 20190062312A · 2019 [cited by applicant]
KR 20200008526A · 2020 [cited by applicant]
KR 20200020262A · 2020 [cited by applicant]
TW 201506529A · 2015 [cited by applicant]
Claas Cornelius et al., “Encountering Gate Oxide Breakdown with Shadow Transistors to Increase Reliability”, 21st Annual Symposium on Integrated Circuits and Systems Design, SBCCI 2008, Gramado, Sep. 3, 2008, pp. 1-22. [cited by applicant]
Coventor(a Lam Research company), “Intel Announces Production-Ready 22nm 3-D Tri-Gate Transistor”, published on May 5, 2011, retrieved form the Internet: https://www.coventor.com/blog/intel-announces-production-ready-22… [cited by applicant]