Hybrid fin field-effect transistor cell structures and related methods
In one embodiment, an integrated circuit cell includes a first circuit component and a second circuit component. The first circuit component includes fin field-effect transistors (finFETs) formed in a high fin portion of the integrated circuit cell, the high fin portion of the integrated circuit including a plurality of fin structures arranged in rows. The second circuit component that includes finFETs formed in a less fin portion of the integrated circuit cell, the less fin portion of the integrated circuit including a lesser number of fin structures than the high fin portion of the integrated circuit cell.
1. A integrated circuit cell, comprising:
a first circuit component that includes fin field-effect transistors (finFETs) formed in a high fin portion of the integrated circuit cell, the high fin portion of the integrated circuit including a first plurality of fin structures arranged in a first row and a second plurality of fin structures arranged in a second row; and
a second circuit component that includes finFETs formed in a less fin portion of the integrated circuit cell, the less fin portion of the integrated circuit including a third plurality of fin structures arranged in a third row and a fourth plurality of fin structures arranged in a fourth row, wherein each of the third row and the fourth row, in the less fin portion, contain a lesser number of fin structures than each of the first row and the second row, in the high fin portion.
2. The integrated circuit cell of claim 1 , wherein the integrated circuit cell is optimized for speed based on inclusion of the first circuit component in the high fin portion.
3. The integrated circuit cell of claim 1 , wherein the integrated circuit cell is optimized for power consumption based on inclusion of the second circuit component in the less fin portion.
4. The integrated circuit cell of claim 1 , wherein the integrated circuit cell is arranged in a double height cell layout with the high fin portion and the less fin portion being arranged in adjacent rows.
5. The integrated circuit cell of claim 1 , wherein the first circuit component is electrically coupled to the second circuit component to form a standard cell for a logic circuit.
6. The integrated circuit cell of claim 5 , wherein the logic circuit is a multi-stage buffer, the first circuit component is a first inverter stage, and the second circuit component is a second logic stage.
7. The integrated circuit cell of claim 5 , wherein the logic circuit is a multi-stage logic gate, the first circuit component is a logic gate, and the second circuit component is an inverter stage.
8. The integrated circuit cell of claim 5 , wherein the logic circuit is a multi-stage logic gate, the first circuit component is an inverter stage, and the second circuit component is a logic gate.
9. The integrated circuit cell of claim 1 , wherein the second circuit component further includes finFETs formed in the high fin portion of the integrated circuit cell.
10. The integrated circuit cell of claim 1 , wherein the integrated circuit cell is a standard cell for a flip-flop circuit.
11. The integrated circuit cell of claim 1 , wherein the integrated circuit cell is a standard cell for a multiplexer.
12. An integrated circuit cell for a flip-flop, comprising:
a first stage configured to receive a flip-flop input and pass the flip-flop input through to a first stage output in response to a clock signal, the first stage including field-effect transistors (finFETs) formed in one of a high fin portion of the integrated circuit cell or a less fin portion of the integrated circuit cell based on a performance optimization criterion, wherein the high fin portion of the integrated circuit cell includes a first plurality of fin structures arranged in a first row and a second plurality of fin structures arranged in a second row, and the less fin portion of the integrated circuit cell includes a third plurality of fin structures arranged in a third row and a fourth plurality of fin structures arranged in a fourth row, wherein each of the third row and the fourth row, in the less fin portion, contain a lesser number of fin structures than each of the first row and the second row, in the high fin portion; and
a second stage configured to receive the first stage output and generate a first latched output in response to the clock signal, the second stage including finFETs in a forward path that are formed in the high fin portion of the integrated circuit and finFETs in a feedback path that are formed in the less fin portion of the integrated circuit.
13. The integrated circuit cell of claim 12 , wherein the performance optimization criterion is one of speed or power consumption.
14. The integrated circuit cell of claim 12 , further comprising:
a third stage configured to receive the first latched output and pass the first latched output through to a third stage output in response to the clock signal, the third stage including finFETs formed in the high fin portion of the integrated circuit.
15. The integrated circuit cell of claim 14 , further comprising:
a fourth stage configured to receive the third stage output and generate a second latched output in response to the clock signal, the fourth stage including finFETs in a forward path formed in the high fin portion of the integrated circuit, and finFETs in a feedback path formed in one of the high fin portion or the less fin portion of the integrated circuit cell based on the performance optimization criterion.
16. The integrated circuit cell of claim 15 , further comprising:
a fifth stage configured to invert the third stage output to generate a flip-flop output, the first stage including finFETs formed in the high fin portion of the integrated circuit cell.
17. The integrated circuit cell of claim 12 , wherein the integrated circuit cell is arranged in a double height cell layout with the high fin portion and the less fin portion being arranged in adjacent rows.
18. A method of fabricating an integrated circuit cell to perform a function, the method comprising:
forming a first circuit component that includes fin field-effect transistors (finFETs) in a high fin portion of the integrated circuit cell, the high fin portion of the integrated circuit including a first plurality of fin structures arranged in a first row and a second plurality of fin structures arranged in a second row; and
forming a second circuit component that includes finFETs in a less fin portion of the integrated circuit cell, the less fin portion of the integrated circuit including a third plurality of fin structures arranged in a third row and a fourth plurality of fin structures arranged in a fourth row, wherein each of the third row and the fourth row, in the less fin portion, contain a lesser number of fin structures than each of the first row and the second row, in the high fin portion.
19. The method of claim 18 , wherein the integrated circuit cell is optimized for speed based on inclusion of the first circuit component in the high fin portion.
20. The method of claim 18 , wherein the integrated circuit cell is optimized for power consumption based on inclusion of the second circuit component in the less fin portion.