IP Library Granted Patent US 12,188,231
Granted Patent B2
US 12,188,231 · App. 18/479,446 · Granted Jan 7, 2025

Systems and methods for a wall assembly having an acoustic panel

Inventor: Randall C. Hartwick (Tempe, AZ)
Assignee: HercuTech, Inc.
E04C2/2885E04C2/38E04C2/40E04C2/46E04C2/526E04C2002/004
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Quick Facts
Patent No.
US 12,188,231
App. No.
18/479,446
Granted
Jan 7, 2025
Kind
B2
Abstract

Various embodiments for a wall assembly having an acoustic panel defining a plurality of thru-holes that act to break low density mechanically coupled pathways for sound transmission through the acoustic panel for reducing sound transmission are disclosed herein.

Claims (15)

1. A method, comprising:

forming a panel body defining a front side, a rear side, a top side, a bottom side, a first lateral side, a second lateral side opposite the first lateral side;

forming a plurality of thru-holes through the panel body from the front side of the panel body to the rear side of the panel body;

forming a plurality of vertical voids through the panel body from the top side to the bottom side;

forming a vertical slit along the panel body that communicates between a vertical void of the plurality of vertical voids and the front side or the rear side of the panel body; and

coupling a reinforcement strip within the vertical slit such that a plurality of laterally extending tab portions of the reinforcement strip couple within a respective vertical void of the plurality of vertical voids.

2. The method of claim 1 , further comprising:

filling at least one vertical void of the plurality of vertical voids with a bonding material that envelops the plurality of laterally extending tab portions of the reinforcement strip and bonds the reinforcement strip to the panel body.

3. The method of claim 1 , further comprising:

forming a top horizontal void through the panel body along the top side of the panel body and from the first lateral side to the second lateral side of the panel body; and

forming a bottom horizontal void through the panel body along the bottom side of the panel body and from the first lateral side to the second lateral side of the panel body.

4. The method of claim 3 , further comprising:

filling the top horizontal void and the bottom horizontal void with a bonding material that forms a part of a rigid internal structure of the panel body.

5. The method of claim 1 , further comprising:

coupling a first drywall panel to the front side of the panel body and a second drywall panel to the rear side of the panel body.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2025
From: HERCUTECH INC.
To: TREMCO CPG INC.
Reel/Frame 070714/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2023
From: HARTWICK, RANDALL C.
To: HERCUTECH INC.
Reel/Frame 065095/0676 →
Continuity (3)
Division 17719696 · Apr 13, 2022
Provisional Application 63174294 · Apr 13, 2021
Related Publication 20240026682A1 · Jan 25, 2024
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