Electronic device including sound module
Disclosed is an electronic device including a sound module. The electronic device comprises: a housing in which at least one sound hole is formed; and a sound component mounted on the housing adjacent to the sound hole and configured to emit sound in a first direction toward the outside of the housing through the sound hole. The sound component includes: a sound frame forming a front surface open in the first direction; a center diaphragm disposed in the front space such that the front surface thereof faces the first direction; a vibration module including a loop disposed on the rear surface of the center diaphragm and configured to apply vibrations to the center diaphragm; and a sealing part including a seal that connects the center diaphragm and the sound frame along the circumference of the center diaphragm and provides a seal between the housing and the sound frame through a portion connected to the sound frame, wherein the sound frame and the center diaphragm may include the same material.
1 . An electronic device comprising:
a housing having at least one sound hole formed therein; and
a sound component mounted on the housing adjacent to the sound hole and configured to emit a sound in a first direction toward an outside of the housing through the sound hole,
wherein the sound component comprises:
a sound frame configured to form a front space open in the first direction;
a center diaphragm disposed in the front space such that a front surface thereof faces the first direction;
a vibration module including a loop disposed on a rear surface of the center diaphragm and configured to apply vibration to the center diaphragm; and
a sealing portion comprising a seal and configured to connect the center diaphragm and the sound frame along a circumference of the center diaphragm and seal a space between the housing and the sound frame through a portion connected to the sound frame,
wherein the sound frame and the center diaphragm comprise a same material.
2 . The electronic device of claim 1 , wherein
based on a state in which the front surface of the center diaphragm is viewed,
the sealing portion comprises:
a vibration part covering a space between the sound frame and the center diaphragm and acoustically coupled to the center diaphragm and configured to vibrate; and
a sealing part protruding from the sound frame in at least one direction along a circumference of the sound frame and configured to be compressed in contact with the housing.
3 . The electronic device of claim 2 , wherein
the sealing portion further comprises a cover part configured to at least partially cover the front surface of the center diaphragm to block the center diaphragm from being exposed in the first direction.
4 . The electronic device of claim 2 , wherein
the sealing portion further comprises, based on a state in which the front surface of the center diaphragm is viewed, a center hole formed to be open such that the front surface of the center diaphragm is exposed.
5 . The electronic device of claim 2 , wherein
the sealing part comprises a first sealing part protruding from the sound frame in the first direction.
6 . The electronic device of claim 5 , further comprising:
a stopper disposed along an inner circumference of the first sealing part based on a state in which the front surface of the center diaphragm is viewed, and configured to inhibit the first sealing part from being deformed in a direction of the center diaphragm.
7 . The electronic device of claim 2 , wherein
the sealing part comprises a second sealing part protruding from an outer circumferential surface of the sound frame in a second direction perpendicular to the first direction.
8 . The electronic device of claim 2 , wherein
the sealing part has a cross-sectional shape decreasing in a direction away from the sound frame.
9 . The electronic device of claim 2 , wherein
the sealing portion further comprises a connection part configured to connect the sealing part and the vibration part by passing through the sound frame.
10 . The electronic device of claim 1 , wherein
the sound frame and the center diaphragm are simultaneously formed through an injection process.
11 . The electronic device of claim 1 , wherein
the sealing portion is integrally connected to the center diaphragm and the sound frame.
12 . The electronic device of claim 1 , wherein
the sound component further comprises a reinforcing member comprising a reinforcement material disposed on at least one of a front surface or a rear surface of the center diaphragm.
13 . The electronic device of claim 1 , wherein
the sound component further comprises a protective grille connected to the sealing portion to cover the front space and exposed in the first direction.
14 . A sound module manufacturing method of molding a sound module through double injection, the sound module comprising a sound frame configured to form a front space that is open in a first direction, a center diaphragm disposed in the front space such that a front surface thereof faces the first direction, and a vibration portion configured to connect the center diaphragm and the sound frame, the sound module manufacturing method comprising:
a first injection operation of integrally molding the sound frame and the center diaphragm by injecting a first material for primary molding, in a state in which a first moving mold is coupled to a fixed mold; and
a second injection operation of molding the vibration portion integrally connected to the sound frame and the center diaphragm by injecting a second material for secondary molding, in a state in which the first moving mold is decoupled from the fixed mold and a second moving mold is coupled to the fixed mold,
wherein in the second injection operation, the vibration portion is formed to comprise a vibration part configured to connect the sound frame and the center diaphragm along a circumference of the center diaphragm, and a sealing part configured to protrude in at least one direction along a circumference of the sound frame.
15 . The sound module manufacturing method of claim 14 , further comprising:
after the second injection operation, a third injection operation of attaching a reinforcing member formed of a third material to one of a front surface or a rear surface of the center diaphragm.
16 . A sound component mounted on an electronic device comprising:
a sound frame forming a front surface open in a first direction toward a sound hole formed in a housing of the electronic device, the sound frame including a first material;
a center diaphragm comprising the first material, disposed in the front space such that a front surface thereof may face the first direction, and spaced apart from the sound frame;
a sealing portion comprising a seal and including a vibration part configured to connect the center diaphragm and the sound frame along a circumference of the center diaphragm and acoustically coupled to the center diaphragm to vibrate, and a sealing part protruding from the sound frame and configured to seal a space between the housing and the sound frame; and
a vibration module comprising a loop disposed on a rear surface of the center diaphragm and configured to apply vibration to the center diaphragm.
17 . The sound component of claim 16 , wherein
the sealing portion further includes a connection part configured to connect the sealing part and the vibration part by passing through the sound frame.
18 . The sound component of claim 17 , wherein
the sealing portion may be integrally connected to the sound frame and the center diaphragm.
19 . The sound component of claim 16 , wherein
the sealing part including at least one of a first sealing part protruding from the sound frame in the first direction, and a second sealing part protruding from an outer circumferential surface of the sound frame in a second direction perpendicular to the first direction.
20 . The sound component of claim 16 , wherein
the sealing portion further including a cover part connected to cover the center diaphragm to block the front surface of the center diaphragm from being exposed in the first direction.