TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD
Technologies for reducing the impact of inductors on electrical traces are disclosed. In an illustrative embodiment, conductive ink is applied in a silk screen layer on top of a solder mask of a circuit board. The conductive ink forms shield regions under and near where inductors are placed and/or where a power plane is routed. The conductive shield regions may be coupled to a ground plane in the circuit board. The conductive shield regions can partially shield traces under and near the inductor, reducing the noise induced on nearby traces. The conductive shield regions can allow traces for high-speed input/output signals to be routed closer to the inductor, reducing the size, number of layers, and/or cost of the circuit board. In some embodiments, the conductive shield regions can shield emissions from the power plane, reducing interference on antennas of a device.
1 . A circuit board comprising:
a substrate comprising one or more layers;
a solder mask, wherein a bottom surface of the solder mask is adjacent a top surface of the substrate; and
one or more conductive regions adjacent a top surface of the solder mask.
2 . A system comprising the circuit board of claim 1 , further comprising an inductor mounted on the circuit board, wherein at least one of the one or more conductive regions is between the inductor and the circuit board.
3 . The system of claim 2 , wherein the at least one of the one or more conductive regions surrounds one or more contact pads of the circuit board, wherein the inductor is mounted on the one or more contact pads.
4 . The system of claim 3 , further comprising one or more dielectric regions adjacent the top surface of the solder mask, wherein the one or more dielectric regions are between the one or more conductive regions and the one or more contact pads.
5 . The circuit board of claim 1 , further comprising a power plane on a top layer of the substrate nearest the solder mask.
6 . The circuit board of claim 5 , wherein the one or more conductive regions reduce radiofrequency interference from the power plane at an antenna by at least 5 dB.
7 . The circuit board of claim 1 , further comprising one or more vias, wherein the one or more vias electrically couple the one or more conductive regions to a ground plane below the top surface of the substrate.
8 . The circuit board of claim 1 , wherein the one or more conductive regions comprise conductive ink.
9 . The circuit board of claim 1 , wherein a height of the one or more conductive regions is between about 10 and about 50 micrometers.
10 . The circuit board of claim 1 , wherein the one or more conductive regions comprise a contact resistance of less than about 2 milliohm-centimeter squared.
11 . The circuit board of claim 1 , wherein the one or more conductive regions comprise a sheet resistance of less than about 5 milliohm per square for a thickness of about 25 micrometers.
12 . The circuit board of claim 1 , wherein an inductor is mounted on the circuit board above one of the one or more conductive regions, wherein, in use, the one or more conductive regions reduce voltage noise on a trace of the circuit board below the inductor by at least about 25%.
13 . A processor comprising the circuit board of claim 1 .
14 . A circuit board comprising:
a substrate comprising one or more layers;
a solder mask adjacent the substrate; and
a silk screen layer adjacent the solder mask, wherein the silk screen layer comprises one or more conductive regions.
15 . The circuit board of claim 14 , wherein the silk screen layer further comprises one or more text labels, the one or more text labels comprising one or more nonconductive regions.
16 . A system comprising the circuit board of claim 14 , further comprising an inductor disposed on the circuit board, wherein at least one of the one or more conductive regions is between the inductor and the circuit board.
17 . The circuit board of claim 14 , further comprising a power plane on a top layer of the substrate nearest the solder mask.
18 . The circuit board of claim 14 , further comprising one or more vias, wherein the one or more vias connect the one or more conductive regions to a ground plane of the substrate.
19 . A circuit board comprising:
a substrate comprising one or more layers;
a solder mask layer, wherein a bottom surface of the solder mask layer is adjacent a top surface of the substrate; and
means for shielding the one or more layers, wherein the means for shielding the one or more layers is adjacent a top surface of the solder mask layer.
20 . A system comprising the circuit board of claim 19 , further comprising an inductor mounted on the circuit board, wherein the means for shielding the one or more layers is between the inductor and the circuit board.