Patent Assignment
Reel/Frame 075990/0451
Assignment of Assignor's Interest
Recorded: 2026-09-11
Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL PRODUCTS IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(12)
Code Objects Offload Based on Accelerator, Accelerator Cache, and Data Transfer Metrics
Application:
18/030,057 →
Publication:
US US20230367640A1
Low-Profile Fasteners with Springs for Heat Transfer Device Loading
Application:
18/059,534 →
Publication:
US US20230093095A1
Computing Architecture
Die-To-Die Interconnect Protocol Layer
Application:
17/853,502 →
Publication:
US US20220327084A1
Apparatus, System, Method and Computer-Implemented Storage Media to Implement a Per Data Packet Quality of Service Requirement in a Communication Network
Computing Network Physical Layer Device Including Port Expander, and Method of Using Same
Application:
17/957,966 →
Publication:
US US20230023258A1
Correctable Error Tracking and Link Recovery
Application:
17/969,321 →
Publication:
US US20230281080A1
Technologies for Optical Demultiplexing with Backwards Compatibility
Application:
18/146,332 →
Publication:
US US20230125660A1
Transmission Configuration Indicator (Tci) Chain Enhancements for New Radio Systems
Cyber Attack Detection Function
Keyboard Switch Design for Ultrathin Computing Devices
Application:
18/344,061 →
Publication:
US US20250004505A1
Technologies for Reducing the Impact of Radiofrequency Interference on a Circuit Board
Application:
18/513,045 →
Publication:
US US20250113430A1
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 30, 2022
From: DAS SHARMA, DEBENDRA; CHOUDHARY, SWADESH; LANKA, NARASIMHA; SESHAN, LAKSHMIPRIYA
To: INTEL CORPORATION
Reel/Frame 060375/0063 →
Assignment of Assignor's Interest
Oct 11, 2022
From: HYDE, MARUTI GUPTA; ZHANG, YI
To: INTEL CORPORATION
Reel/Frame 061374/0520 →
Assignment of Assignor's Interest
Oct 19, 2022
From: WU, HAO; XU, TAO; GUO, CHANGPENG; ZHAO, YANXIN
To: INTEL CORPORATION
Reel/Frame 061472/0251 →
Assignment of Assignor's Interest
Dec 22, 2022
From: ALVA, SAMARTH; K, NAGARAJ; SEKAR, DEEPAK; SEN, ARNAB
To: INTEL CORPORATION
Reel/Frame 062181/0118 →
Assignment of Assignor's Interest
Feb 1, 2023
From: LIN, WENHUA; FATHOLOLOUMI, SAEED; SEDDIGHIAN, PEGAH; SU, TIEHUI
To: INTEL CORPORATION
Reel/Frame 062563/0194 →
Assignment of Assignor's Interest
Mar 13, 2023
From: LAURSEN, SOREN R. F.
To: INTEL CORPORATION
Reel/Frame 062968/0719 →
Assignment of Assignor's Interest
May 26, 2023
From: CHOFLEMING, KERMIN E., JR.; KAZACHKOV, EGOR A.; KHUDIA, DAYA SHANKER; MATVEEV, ZAKHAR A.
To: INTEL CORPORATION
Reel/Frame 063775/0317 →
Assignment of Assignor's Interest
Jul 3, 2023
From: PAAVOLA, JUHA T.; HEINISUO, SAMI M.; JOHANNES MANSUKOSKI, KARI PEKKA; MCEUEN, SHAWN S.
To: INTEL CORPORATION
Reel/Frame 064138/0517 →
Assignment of Assignor's Interest
Sep 12, 2023
From: KOLEKAR, ABHIJEET
To: INTEL CORPORATION
Reel/Frame 064880/0083 →
Assignment of Assignor's Interest
Nov 17, 2023
From: GUNNAM, VENKATA MAHESH; YEDRI, RAKESH; ALAPARTHI, PHANI; SAMARAJ, DAVID ELAYARAJ
To: INTEL CORPORATION
Reel/Frame 065605/0449 →
Assignment of Assignor's Interest
May 15, 2024
From: FRYMAN, JOSHUA B.; OH, BYOUNGCHAN; POLAGANI, SAI DHEERAJ; MA, KEVIN P.
To: INTEL CORPORATION
Reel/Frame 067424/0148 →