Electrical assembly
An electrical assembly may include a bus bar assembly, a sensor assembly, including a circuit board connected to the bus bar assembly, and a sensor, a bracket connected to the bus bar assembly, and a cooling member connected to the bracket. A method of assembling an electrical assembly may include connecting a shunt resistor with a bus bar assembly, connecting a circuit board with the bus bar assembly, connecting the bus bar assembly with the bracket, disposing the cooling member on or about the bracket, and/or connecting the cooling member with the bracket.
1. An electrical assembly, comprising:
a bus bar assembly;
a sensor assembly, including:
a circuit board fixed directly to the bus bar assembly via a plurality of pins; and
a sensor, wherein at least one pin from the plurality of pins is inserted within the circuit board to transfer heat from the at least one pin to the sensor;
a bracket connected to the bus bar assembly; and
a cooling member connected to the bracket.
2. The electrical assembly of claim 1 , wherein the bus bar assembly includes bus bar portions thermally coupled to the circuit board and the cooling member.
3. The electrical assembly of claim 1 , wherein the sensor includes a thermistor and is configured to, at least in part, obtain temperature information associated with the bus bar assembly.
4. The electrical assembly of claim 3 , wherein the bus bar assembly includes a bus bar first portion and a bus bar second portion connected to the bus bar first portion via a shunt resistor, and
the shunt resistor is configured to determine an electrical current flowing through the bus bar assembly.
5. The electrical assembly of claim 4 , wherein the shunt resistor is connected to the bus bar first portion and the bus bar second portion via a welded connection.
6. The electrical assembly of claim 4 ,
wherein the plurality of pins includes a first pin connected to the bus bar first portion and a second pin connected to the bus bar second portion.
7. The electrical assembly of claim 6 , wherein the plurality of pins includes a third pin, and
the second pin and the third pin are configured to conduct heat from the bus bar assembly to the sensor such that a temperature proximate the sensor is substantially the same as a shunt resistor temperature.
8. The electrical assembly of claim 6 , wherein the circuit board includes a first aperture and a second aperture,
the first pin and the second pin include a first portion having a first diameter and a second portion having a second diameter that is larger than the first diameter,
the first portion of the first pin is disposed at least partially in the first aperture,
the first portion of the second pin is disposed at least partially in the second aperture, and
the circuit board is in contact with the second portions of the first pin and the second pin.
9. The electrical assembly of claim 8 , including a third pin, wherein the circuit board is offset from a first surface of the bus bar first portion and a first surface of the bus bar second portion via the second portions of the first pin and the second pin, and
the first pin, the second pin, and the third pin are disposed to facilitate alignment of the circuit board relative to the bus bar assembly.
10. The electrical assembly of claim 9 , wherein the bus bar first portion and the bus bar second portion are disposed in an annular configuration to facilitate thermal transfer to the cooling member.
11. The electrical assembly of claim 1 , wherein the cooling member includes an at least partially hollow body configured to receive a cooling fluid.
12. The electrical assembly of claim 4 , wherein the cooling member is connected with the bracket such that shunt resistor is indirectly connected to the cooling member via the bus bar assembly and the bracket.
13. The electrical assembly of claim 3 , wherein the circuit board includes a plurality of layers including a first layer, a second layer, and one or more additional layers.
14. The electrical assembly of claim 13 , wherein the first layer of the circuit board includes copper, and
a shape of the copper of the first layer corresponds to a shape of the sensor.
15. The electrical assembly of claim 14 , wherein the second layer includes additional copper that facilitates a thermal transfer from the bus bar assembly to the sensor.
16. The electrical assembly of claim 1 , wherein a thermally conductive material is disposed at least partially between the bus bar assembly and the circuit board.
17. A method of assembling the electrical assembly of claim 4 , the method comprising:
connecting the shunt resistor with the bus bar assembly;
connecting the circuit board with the bus bar assembly;
connecting the bus bar assembly with the bracket;
disposing the cooling member on or about the bracket; and
connecting the cooling member with the bracket.
18. The method of claim 17 , wherein connecting the circuit board with the bus bar assembly includes press fitting the plurality of pins with the bus bar assembly, and
soldering the circuit board with the plurality of pins.
19. The method of claim 17 , wherein disposing the cooling member on the bracket includes inserting the bracket, the circuit board, the bus bar assembly, and the shunt resistor at least partially into a recess of the cooling member.
20. The method of claim 17 , wherein the bus bar assembly is fixed directly to the shunt resistor,
the bus bar assembly is fixed directly with the bracket, and
the cooling member is fixed directly with the bracket.