Electrical assembly

1. An electrical assembly, comprising:

a bus bar assembly;

a sensor assembly, including:

a circuit board connected to the bus bar assembly; and

a sensor;

a bracket connected to the bus bar assembly; and

a cooling member connected to the bracket;

wherein the bus bar assembly includes a bus bar first portion and a bus bar second portion connected to the bus bar first portion via a shunt resistor;

the shunt resistor is configured to facilitate determining an electrical current flowing through the bus bar assembly; and

the cooling member is connected with the bracket such that the shunt resistor is indirectly connected to the cooling member via the bus bar assembly and the bracket.

2. The electrical assembly of claim 1 , wherein the sensor includes a thermistor and is configured to, at least in part, obtain temperature information regarding the bus bar assembly.

3. The electrical assembly of claim 2 , wherein the circuit board includes a plurality of layers including a first layer, a second layer, and one or more additional layers.

4. The electrical assembly of claim 3 , wherein the first layer of the circuit board includes copper; and

a shape of the copper of the first layer corresponds to a shape of the sensor.

5. The electrical assembly of claim 4 , wherein the second layer includes additional copper that facilitates a thermal transfer from the bus bar assembly to the sensor.

6. The electrical assembly of claim 1 , wherein the shunt resistor is connected to the bus bar first portion and the bus bar second portion via a welded connection.

7. The electrical assembly of claim 1 , including a plurality of pins connecting the circuit board to the bus bar assembly;

wherein the plurality of pins includes a first pin connected to the bus bar first portion and a second pin connected to the bus bar second portion.

8. The electrical assembly of claim 7 , wherein the plurality of pins includes a third pin; and

the second pin and the third pin are configured to conduct heat from the bus bar assembly to the sensor such that a temperature proximate the sensor is substantially the same as a shunt resistor temperature.

9. The electrical assembly of claim 1 , wherein the cooling member includes an at least partially hollow body configured to receive a cooling fluid.

10. The electrical assembly of claim 1 , wherein a thermally conductive material is disposed at least partially between the bus bar assembly and the circuit board.

11. An electrical assembly, comprising:

a bus bar assembly;

a sensor assembly, including:

a circuit board connected to the bus bar assembly; and

a sensor;

a bracket connected to the bus bar assembly;

a cooling member connected to the bracket; and

a plurality of pins connecting the circuit board to the bus bar assembly;

wherein the sensor includes a thermistor and is configured to, at least in part, obtain temperature information regarding the bus bar assembly;

the bus bar assembly includes a bus bar first portion and a bus bar second portion connected to the bus bar first portion via a shunt resistor;

the shunt resistor is configured to facilitate determining an electrical current flowing through the bus bar assembly;

the plurality of pins includes a first pin connected to the bus bar first portion and a second pin connected to the bus bar second portion;

the circuit board includes a first aperture and a second aperture;

the first pin and the second pin include a first portion having a first diameter and a second portion having a second diameter larger than the first diameter;

the first portion of the first pin is disposed at least partially in the first aperture;

the first portion of the second pin is disposed at least partially in the second aperture; and

the circuit board is in contact with the second portions of the first pin and the second pin.

12. The electrical assembly of claim 11 , including a third pin;

wherein the circuit board is offset from a first surface of the bus bar first portion and a first surface of the bus bar second portion via the second portions of the first pin and the second pin; and

the first pin, the second pin, and the third pin are disposed to facilitate alignment of the circuit board relative to the bus bar assembly.

13. The electrical assembly of claim 12 , wherein the bus bar first portion and the bus bar second portion are disposed in an annular configuration to facilitate thermal transfer to the cooling member.

14. A method of assembling the electrical assembly of claim 11 , the method comprising:

connecting the shunt resistor with the bus bar assembly;

connecting the circuit board with the bus bar assembly;

connecting the bus bar assembly with the bracket;

disposing the cooling member on or about the bracket; and

connecting the cooling member with the bracket.

15. The method of claim 14 , wherein connecting the circuit board with the bus bar assembly includes press fitting one or more pins with the bus bar assembly; and

soldering the circuit board with the one or more pins.

16. The method of claim 14 , wherein disposing the cooling member on the bracket includes inserting the bracket, the circuit board, the bus bar assembly, and the shunt resistor at least partially into a recess of the cooling member.

17. The method of claim 14 , wherein the bus bar assembly is fixed directly to the shunt resistor;

the bus bar assembly is fixed directly with the circuit board by one or more pins;

the bus bar assembly is fixed directly with the bracket; and

the cooling member is fixed directly with the bracket.