IP Library › Granted Patent US 12,733,441
Granted Patent B2
US 12,733,441 · App. 18/550,011 · Granted Sep 8, 2026

Substrate transfer method

Inventors: Nanako Shinoda (Yamanashi, JP); Shinya Okano (Yamanashi, JP)
Assignee: Tokyo Electron Limited
H10P72/50H10P72/3306H10P72/7602
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Quick Facts
Patent No.
US 12,733,441
App. No.
18/550,011
Granted
Sep 8, 2026
Kind
B2
Abstract

A substrate transfer method includes receiving first and second substrates by a pick of a first transfer device, detecting shift amounts of the first and second substrates, calculating a correction amount of a delivery position of the pick based on the shift amount of the first substrate, and moving the pick to the corrected delivery position to respectively deliver the first and second substrates to a first and second mounting sections, moving a first pick of a second transfer device to a receiving position of the first mounting section to receive the first substrate, calculating a correction amount of a receiving position of a second pick of the second transfer device based on the correction amount of the delivery position and the shift amount of the second substrate; and moving the second pick to the corrected receiving position of the second pick to receive the second substrate.

Claims (19)

1 . A substrate transfer method comprising:

simultaneously receiving a first substrate and a second substrate by a pick of a first transfer device;

detecting a first shift amount of the first substrate and a second shift amount of the second substrate that are held by the pick;

calculating a correction amount of a delivery position of the pick of the first transfer device based on the first shift amount of the first substrate and correcting the delivery position of the pick of the first transfer device based on the correction amount;

moving the pick of the first transfer device to the corrected delivery position of the pick to deliver the first substrate to a first mounting section of a second chamber and deliver the second substrate to a second mounting section of the second chamber, the first substrate and the second substrate being simultaneously held by the pick of the first transfer device after the receiving of the first substrate and the second substrate;

moving a first pick of a second transfer device to a receiving position of the first mounting section to receive the first substrate by the first pick;

calculating a receiving correction amount of a receiving position of a second pick of the second transfer device based on the correction amount of the delivery position of the pick and the second shift amount of the second substrate and correcting the receiving position of the second pick based on the receiving correction amount; and

moving the second pick of the second transfer device to the corrected receiving position of the second pick to receive, by the second pick, the second substrate that is delivered by the first transfer device.

2 . The substrate transfer method as claimed in claim 1 , wherein the calculating of the correction amount of the delivery position of the pick calculates the correction amount by which the first shift amount of the first substrate with respect to a reference position of the first mounting section falls within a predetermined threshold when the first substrate is delivered to the first mounting section of the second chamber.

3 . The substrate transfer method as claimed in claim 2 , wherein the calculating of the correction amount of the delivery position of the pick does not correct the delivery position of the pick in a case where the first shift amount of the first substrate is within the threshold.

4 . The substrate transfer method as claimed in claim 1 ,

wherein the first transfer device is provided in a vacuum transfer chamber and transfers the first substrate and the second substrate between the vacuum transfer chamber and a processing chamber and between the vacuum transfer chamber and a load lock chamber, and

wherein the second transfer device is provided in an atmospheric transfer chamber and transfers the first substrate and the second substrate between the atmospheric transfer chamber and the load lock chamber.

5 . The substrate transfer method as claimed in claim 1 ,

wherein the moving of the second pick of the second transfer device is performed after the moving of the pick of the first transfer device.

6 . The substrate transfer method as claimed in claim 1 ,

wherein the simultaneously receiving the first substrate and the second substrate includes receiving the first substrate and the second substrate disposed in a processing chamber, and

wherein the substrate transfer method further comprises accommodating the received first substrate and the received second substrate in a carrier.

7 . The substrate transfer method as claimed in claim 1 , wherein the moving of the second pick of the second transfer device to the corrected receiving position of the second pick including moving the second pick holding no substrate to the corrected receiving position of the second pick to hold the second substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2023
From: SHINODA, NANAKO; OKANO, SHINYA
To: TOKYO ELECTRON LIMITED
Reel/Frame 064860/0278 →
Priority Claims (1)
JP 2021-050068 · Mar 24, 2021 · national
Continuity (1)
Related Publication 20240153807A1 · May 9, 2024
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