Flux and solder paste
Provided herein is a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.
1. A flux comprising: a rosin; a rosin amine; p-toluenesulfonic acid; a thixotropic agent; and a solvent,
wherein a content of the rosin is 5% by mass or more and 50% by mass or less with respect to a total amount (100% by mass) of the flux,
a content of the rosin amine is 5% by mass or more and 30% by mass or less with respect to the total amount (100% by mass) of the flux,
a content of the p-toluenesulfonic acid acid is 0.2% by mass or more and 10% by mass or less with respect to the total amount (100% by mass) of the flux,
a ratio (mass ratio) of the content of the rosin amine to the content of the p-toluenesulfonic acid is 3.33 or more and 10 or less.
2. A flux comprising: a rosin; one or more azole selected from the group consisting of 2-ethylimidazole and 2-phenyl-4-methylimidazole; p-toluenesulfonic acid; a thixotropic agent; and a solvent,
wherein a content of the rosin is 5% by mass or more and 50% by mass or less with respect to a total amount (100% by mass) of the flux,
a content of the azole is 1% by mass or more and 10% by mass or less with respect to the total amount (100% by mass) of the flux,
a content of the p-toluenesulfonic acid acid is 0.2% by mass or more and 10% by mass or less with respect to the total amount (100% by mass) of the flux,
a ratio (mass ratio) of the content of the azole to the content of the p-toluenesulfonic acid acid is 1 or more and 3 or less.
3. A flux comprising: a rosin; ditolylguanidine; p-toluenesulfonic acid; a thixotropic agent; and a solvent,
wherein a content of the rosin is 5% by mass or more and 50% by mass or less with respect to a total amount (100% by mass) of the flux,
a content of the ditolylguanidine is 2% by mass or more and 20% by mass or less with respect to the total amount (100% by mass) of the flux,
a content of the p-toluenesulfonic acid acid is 0.2% by mass or more and 10% by mass or less with respect to the total amount (100% by mass) of the flux,
a ratio (mass ratio) of the content of the ditolylguanidine to the content of the p-toluenesulfonic acid acid is 1.66 or more and 5 or less.
4. A solder paste comprising: a solder alloy powder; and the flux of claim 1 .
5. The flux according to claim 1 , wherein a total content of the solvent in the flux is 40% by mass or more and 80% by mass or less with respect to the total amount (100% by mass) of the flux.
6. A solder paste comprising: a solder alloy powder; and the flux of claim 2 .
7. The flux according to claim 2 , wherein a total content of the solvent in the flux is 40% by mass or more and 80% by mass or less with respect to the total amount (100% by mass) of the flux.
8. A solder paste comprising: a solder alloy powder; and the flux of claim 3 .
9. The flux according to claim 3 , wherein a total content of the solvent in the flux is 40% by mass or more and 80% by mass or less with respect to the total amount (100% by mass) of the flux.